Contact element and method for its manufacture

US9755345B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9755345-B2
Application numberUS-201314441968-A
CountryUS
Kind codeB2
Filing dateOct 30, 2013
Priority dateDec 11, 2012
Publication dateSep 5, 2017
Grant dateSep 5, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A contact element having contact points for the electrically conductive connection of contact regions of mutually spaced elements, which is formed completely of one or more deposited materials of which at least one is electrically conductive. The contact element is produced in particular using a lithography, electroplating and molding (LiGA) method.

First claim

Opening claim text (preview).

Thus, having described the invention, what is claimed is: 1. A contact element including: contact points for the electrically conductive connection of contact regions of mutually spaced elements, wherein said contact element is completely formed of one or more deposited materials, of which at least one is electrically conductive; a spring section which is elastically deformed when contact is made with the contact regions; a snap-lock connection which holds the contact element in a position in which the spring section is partially deformed; and two rigid supporting sections, wherein in a direction substantially orthogonal to a direction connecting the contact points, the spring section is arranged between the two rigid supporting sections, and the contact element is formed into a single part by material deposition. 2. The contact element of claim 1 , wherein the spring section is meander-formed in design. 3. The contact element of claim 1 , wherein the spring section includes several coaxially arranged curved spring tabs, such that adjacent spring tabs make contact when contact is made with the contact regions. 4. The contact element of claim 1 , wherein on a further deformation of the spring section, the rigid supporting sections forming the snap-lock connection slide against each other. 5. The contact element of claim 1 , wherein the snap-lock connection is formed by the rigid supporting sections. 6. The contact element of claim 1 , including a signal or current path between the contact points which bypasses the spring section. 7. A method for the manufacture of a contact element comprising forming said contact element using a LiGA method, wherein upon manufacture said contact element includes: contact points for the electrically conductive connection of contact regions of mutually spaced elements, wherein said contact element is completely formed of one or more deposited materials, of which at least one is electrically conductive; a spring section which is elastically deformed when contact is made with the contact regions; a snap-lock connection which holds the contact element in a position in which the spring section is partially deformed; and two rigid supporting sections, wherein in a direction substantially orthogonal to a direction connecting the contact points, the spring section is arranged between the two rigid supporting sections, and the contact element is formed into a single part by material deposition. 8. The method of claim 7 , wherein, in said LiGA method, a plurality of connected contact elements is created which contact elements are subsequently separated. 9. The method of claim 7 , wherein the contact elements are deformed following manufacture and possibly following separation in order to engage the snap-lock connection. 10. A contact device having a mounting which possesses a plurality of through-openings, as well as having several contact elements each of which include: contact points for the electrically conductive connection of contact regions of mutually spaced elements, wherein said contact element is completely formed of one or more deposited materials, of which at least one is electrically conductive; a spring section which is elastically deformed when contact is made with the contact regions; a snap-lock connection which holds the contact element in a position in which the spring section is partially deformed; and two rigid supporting sections, wherein in a direction substantially orthogonal to a direction connecting the contact points, the spring section is arranged between the two rigid supporting sections, and the contact element is formed into a single part by material deposition, wherein the contact elements are arranged in the through-openings and wherein the sections of said contact elements containing the contact points project beyond the mounting. 11. The contact element of claim 1 , wherein the spring section is meander-formed in design. 12. The contact element of claim 11 , wherein the spring section includes several coaxially arranged curved spring tabs, such that adjacent spring tabs make contact when contact is made with the contact regions. 13. The contact element of claim 12 , wherein on a further deformation of the spring section, the rigid supporting sections forming the snap-lock connection slide against each other. 14. The contact element of claim 11 , wherein the snap-lock connection is formed by the rigid supporting sections. 15. The contact element of claim 13 , including a signal or current path between the contact points which bypasses the spring section.

Assignees

Inventors

Classifications

  • for manufacturing contact members, e.g. by punching and by bending · CPC title

  • using meander springs · CPC title

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Frequently asked questions

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What does patent US9755345B2 cover?
A contact element having contact points for the electrically conductive connection of contact regions of mutually spaced elements, which is formed completely of one or more deposited materials of which at least one is electrically conductive. The contact element is produced in particular using a lithography, electroplating and molding (LiGA) method.
Who is the assignee on this patent?
Rosenberger Hochfrequenztechnik Gmbh & Co Kg
What technology area does this patent fall under?
Primary CPC classification H01R13/2428. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 05 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).