Gas sensor package

Patent metadata

Field	Value
Publication number	US-9754848-B2
Application number	US-201514595546-A
Country	US
Kind code	B2
Filing date	Jan 13, 2015
Priority date	Jan 14, 2014
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

Provided is a gas sensor package, including: a gas sensing element; and a substrate on which the gas sensing element is disposed, in which a through hole corresponding to the gas sensing element is formed.

First claim

What is claimed is:

1. A gas sensor package, comprising:
a gas sensing element;
a substrate on which the gas sensing element is arranged, and in which a through hole corresponding to the gas sensing element is formed;
an output change part that converts an output mode of the gas sensing element and is disposed on the substrate;
a protective cap configured to cover the gas sensing element and the output change part;
an adhesive part that adheres the protective cap to the substrate and comes in contact with at least one portion of the gas sensing element and at least one portion of the output change part; and
a first gas moving path formed between the substrate and the protective cap via the adhesive part,
wherein the gas sensing element is mounted to the substrate via a conductive material layer, and the adhesive part comes into contact with the conductive material layer, and
wherein the gas sensing element is made of a sensing material having same resistance change rate for each temperature as that of the output change part.

2. The gas sensor package of claim 1 , wherein the adhesive part is provided around the gas sensing element from the substrate.

3. The gas sensor package of claim 1 , wherein the adhesive part is formed at an edge of a surface of the protective cap toward the substrate.

4. The gas sensor package of claim 1 , wherein the adhesive part contains epoxy.

5. The gas sensor package of claim 1 , wherein the protective cap is configured such that the surface toward the substrate is divided into a plurality of areas, and a width of at least one area of the plurality of areas is formed wider than each width of the remaining areas.

6. The gas sensor package of claim 5 , wherein the adhesive part is provided at a width of any one area formed wider than each width of the remaining areas.

7. The gas sensor package of claim 1 , wherein multiple gas sensing elements are formed on the substrate.

8. The gas sensor package of claim 1 , wherein the output change part is an NTC (Negative Temperature Coefficient) thermistor or resistance.

9. A gas sensor package, comprising:
a gas sensing element having a body in which a cavity, providing a space to hold gas to be sensed, is formed;
a substrate on which the gas sensing element is arranged and in which a through hole corresponding to the gas sensing element is formed; and
a cover configured to cover the cavity of the body of the gas sensing element,
wherein the cover is disposed to partially further enter to a degree of an inner depth on a side of a lower surface than one surface of a side portion of the body, and
wherein the lower surface of the cover has a curvature.

10. The gas sensor package of claim 1 , further comprising a metal filling part formed to protrude from the substrate.

11. The gas sensor package of claim 10 , further comprising a second substrate separated from the substrate via the metal filling part.

12. The gas sensor package of claim 11 , further comprising a second gas moving path formed between the substrate and the second substrate by the metal filling part.

Assignees

• Lg Innotek Co Ltd

Inventors

• Jun Sung Gon
• Paik Jee Heum
• Hwang Ji Hun

Classifications

• G01N27/128

  Microapparatus · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W76/157

  having interconnections parallel to the insulating or insulated base · CPC title

• H10W76/60 Primary

  Seals · CPC title

• H01L23/10 Primary

  Electricity · mapped topic