Method for coincident alignment of a laser beam and a charged particle beam

Patent metadata

Field	Value
Publication number	US-9754764-B2
Application number	US-201614991507-A
Country	US
Kind code	B2
Filing date	Jan 8, 2016
Priority date	Sep 7, 2012
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

A method and apparatus for aligning a laser beam coincident with a charged particle beam. The invention described provides a method for aligning the laser beam through the center of an objective lens and ultimately targeting the eucentric point of a multi-beam system. The apparatus takes advantage of components of the laser beam alignment system being positioned within and outside of the vacuum chamber of the charged particle system.

First claim

We claim as follows:

1. A method for laser alignment within a charged particle beam system, comprising:
positioning a laser beam so that it passes through a laser injection port window and into a vacuum chamber toward a workpiece;
based on information from a first alignment detector, adjusting the laser beam so that it is pointed on a first designated point located before an objective lens and so that it passes through the objective lens;
moving a second alignment detector to a designated position in the laser beam pathway;
monitoring the position of the beam on the objective lens with second alignment detector;
based on information from the second alignment detectors, adjusting the laser beam so that the laser beam is pointed to a second designated point aligned with the workpiece and so that the laser beam is aligned eucentrically to the workpiece.

2. The method of claim 1 further comprising, after adjusting the beam to the second point, based on information from the first alignment detector, monitoring and adjusting the position of the laser beam again so that it is pointed to the first point.

3. The method of claim 1 wherein the process of adjusting the laser beam on the first designated point and the second designated point is done repeatedly until the laser beam is aligned to both the first point and the second point.

4. The method of claim 1 further comprising machining a spot on the workpiece with the laser and comparing to a eucentric point.

5. The method of claim 4 wherein if the laser spot does not match with the eucentric point, repeating the procedure until they match.

6. The method of claim 1 wherein adjusting the laser beam to be eucentrically aligned with the workpiece further includes adjusting the laser beam to a eucentric point of a focused ion beam system directed toward the workpiece, the method further comprising milling the workpiece with the focused ion beam system directed toward the workpiece in the vacuum chamber.

7. The method of claim 6 further comprising imaging the workpiece with an electron beam system directed toward the workpiece in the vacuum chamber to monitor the ion beam milling.

8. The method of claim 1 further comprising milling the workpiece with the laser beam.

9. The method of claim 8 further comprising imaging the workpiece with an electron beam system directed toward the workpiece in the vacuum chamber to monitor the laser beam milling.

10. A multi-beam system, comprising:
a vacuum chamber;
a workpiece support for supporting a workpiece within the vacuum chamber;
a focused ion beam system for generating a focused ion beam, said ion beam directed toward the workpiece and operable to remove material from the workpiece;
a laser beam system for generating a laser beam for processing the workpiece in the vacuum chamber;
an electron beam system for monitoring the material removal process;
an objective lens;
a laser beam alignment system operable to adjust the position laser beam through the center of the objective lens and direct it to a eucentric point of the workpiece.

11. The multi-beam system of claim 10 in which the laser beam is operable at a fluence greater than an ablation threshold of the workpiece.

12. The multi-beam system of claim 11 in which the laser beam is a nanosecond to femtosecond pulsed laser beam.

13. The multi-beam system of claim 10 in which the laser beam operable at a fluence that reacts with the workpiece without ablation.

14. The multi-beam system of claim 10 in which the laser beam is operable to cause thermally induced chemical desorption at the workpiece.

15. The multi-beam system of claim 10 in which the laser beam is operable to cause laser photochemistry reactions at the workpiece.

16. The multi-beam system of claim 10 , wherein the laser beam alignment system includes first and second alignment detectors, and is operable to, based on information from a first alignment detector, adjust the laser beam so that it is pointed on a first designated point located before the objective lens and so that it passes through the objective lens; the laser beam alignment system further operable to monitor the position of the beam on the objective lens with second alignment detector and, based on information from the second alignment detectors, adjust the laser beam so that the laser beam is pointed to a second designated point aligned with the workpiece and so that the laser beam is aligned eucentrically to the workpiece.

17. The multi-beam system of claim 16 in which the laser beam alignment system is further operable to, after adjusting the beam to the second point, based on information from the first alignment detector, monitor and adjust the position of the laser beam again so that it is pointed to said first point.

18. The multi-beam system of claim 16 in which the second alignment detector is a quad cell detector.

19. The multi-beam system of claim 16 wherein the second alignment detector is located close enough to the output of the objective lens to precisely measure the laser beam location on the objective lens and to prevent damage to the second alignment detector induced by the focused laser beam.

Assignees

• Fei Co

Inventors

• Straw Marcus
• Emerson Mark

Classifications

• H01J37/3056

  for microworking, e. g. etching of gratings or trimming of electrical components · CPC title

• H01J37/228

  whereby illumination or light collection take place in the same area of the discharge · CPC title

• G21K5/08

  Holders for targets or for other objects to be irradiated · CPC title

• H01J2237/1501

  Beam alignment means or procedures · CPC title

• H01J37/3045 Primary

  Object or beam position registration · CPC title