Resistor, method of manufacturing the same, and board having the same

Patent metadata

Field	Value
Publication number	US-9754705-B2
Application number	US-201514931684-A
Country	US
Kind code	B2
Filing date	Nov 3, 2015
Priority date	Nov 4, 2014
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

A resistor includes: a base substrate; a resistance layer disposed on one surface of the base substrate; first and second electrode layers disposed to be spaced apart from each other and covering portions of the resistance layer; and a third electrode layer disposed between the first and second electrode layers to be spaced apart from the first and second electrode layers and covering a portion of the resistance layer.

First claim

What is claimed is:

1. A resistor comprising:
a base substrate;
an integral resistance layer covering first and second regions of the base substrate and continuously extending between the first and second regions of the base substrate;
first and second electrode layers disposed to be spaced apart from each other and respectively covering portions of the integral resistance layer formed on the first and second regions of the base substrate; and
a third electrode layer disposed between the first and second electrode layers to be spaced apart from the first and second electrode layers and covering a portion of the integral resistance layer between the portions of the integral resistance layer covered by the first and second electrode layers,
wherein a first resistance portion of the integral resistance layer electrically connecting the first electrode layer and the third electrode layer to each other and a second resistance portion of the integral resistance layer electrically connecting the second electrode layer and the third electrode layer to each other are formed of a same material.

2. The resistor of claim 1 , wherein the first to third electrode layers are disposed on one surface of the integral resistance layer.

3. The resistor of claim 1 , wherein the first to third electrode layers are disposed after the integral resistance layer is formed.

4. The resistor of claim 1 , wherein the integral resistance layer comprises:
a first resistance portion connected to a first terminal including the first electrode layer and a third terminal including the third electrode layer to form resistance; and
a second resistance portion connected to a second terminal including the second electrode layer and the third terminal to form resistance, and
in accordance with a resistance value of one of the first and second resistance portions determined by trimming, a resistance value of the other portion of the first and second resistance portions is determined by trimming the other portion of the first and second resistance portions.

5. The resistor of claim 1 , further comprising a protection layer disposed on a surface of the integral resistance layer exposed among the first to third electrode layers.

6. A method of manufacturing a resistor, the method comprising:
preparing a base substrate;
forming a resistance layer on one surface of the base substrate; and
forming first to third electrode layers to cover portions of the resistance layer,
wherein a first resistance portion of the resistance layer electrically connecting the first electrode layer and the third electrode layer to each other and a second resistance portion of the resistance layer electrically connecting the second electrode layer and the third electrode layer to each other are formed of a same material.

7. The method of claim 6 , wherein the first to third electrode layers are formed on one surface of the resistance layer.

8. The method of claim 6 , wherein the resistance layer is an integral layer covering first and second regions of the base substrate and continuously extending between the first and second regions of the base substrate, and
the first and second electrode layers are formed to be spaced apart from each other and respectively covering portions of the resistance layer formed on the first and second regions of the base substrate.

9. The method of claim 6 , wherein
the first and second resistance portions are disposed to be spaced apart from each other.

10. The method of claim 6 , further comprising forming a protection layer disposed on a surface of the resistance layer exposed among the first to third electrode layers.

11. A resistor comprising:
a base substrate;
first and second resistance layers disposed spaced apart from each other on one surface of the base substrate;
first and second electrode layers disposed to be spaced apart from each other and electrically connected to the first and second resistance layers, respectively;
a third electrode layer disposed between the first and second electrode layers to be spaced apart from the first and second electrode layers and covering portions of the first and second resistance layers so as to electrically connected to the first and second resistance layers; and
a protection layer disposed on surfaces of the first and second resistance layers exposed among the first to third electrode layers.

12. The resistor of claim 11 , wherein the first electrode layer covers one end portion of the first resistance layer in a length direction of the base substrate and a portion of the one surface of the base substrate adjacent to the one end portion of the first resistance layer, and
the second electrode layer covers one end portion of the second resistance layer in the length direction of the base substrate and a portion of the one surface of the base substrate adjacent to the one end portion of the second resistance layer.

13. The resistor of claim 12 , wherein the third electrode layer covers the other end portion of the first resistance layer in the length direction of the base substrate, the other end portion of the second resistance layer in the length direction of the base substrate, and a portion of the one surface of the base substrate exposed between the first and second resistance layers.

14. The resistor of claim 11 , wherein the first and second resistance layers are formed of a same material.

Assignees

• Samsung Electro Mech

Inventors

• Kim Hae In
• Nam Jung Min
• Lee Jea Hoon
• Kim Young Key

Classifications

• H05K3/3431

  Leadless components · CPC title

• H05K2201/10022

  Non-printed resistor · CPC title

• H01C7/003

  Thick film resistors · CPC title

• H05K2201/10045

  Mounted network component having plural terminals · CPC title

• H05K1/181

  associated with surface mounted components · CPC title