Laser diode unit with enhanced thermal conduction to slider

Patent metadata

Field	Value
Publication number	US-9754617-B2
Application number	US-201514626688-A
Country	US
Kind code	B2
Filing date	Feb 23, 2015
Priority date	Feb 23, 2015
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

An apparatus comprises a slider having a trailing edge and a leading edge. A laser diode unit comprises a submount and a laser diode mounted to the submount. The submount includes a mounting surface affixed to a first surface of the slider at the trailing edge such that a first surface of the submount faces toward the leading edge of the slider. A thermally conductive material covers the first surface of the submount and at least a portion of the first surface of the slider. The thermally conductive material serves as a thermal conduction pathway between the submount and the slider.

First claim

What is claimed is:

1. An apparatus, comprising:
a slider having a trailing edge and a leading edge;
a laser diode unit comprising a submount and a laser diode mounted to the submount, the submount having a mounting surface affixed to a first surface of the slider near the trailing edge such that a first surface of the submount faces toward the leading edge of the slider; and
a thermally conductive material covering the first surface of the submount and at least a portion of the first surface of the slider, the thermally conductive material serving as a thermal conduction pathway between the submount and the slider;
wherein:
a mounting interface is defined between the first surface of the slider and the mounting surface of the submount;
the first surface of the slider comprises a solder layer adjacent the mounting surface of the submount;
the mounting surface of the submount comprises a solder layer; and
the thermally conductive material extends into the mounting interface.

2. The apparatus of claim 1 , wherein the thermally conductive material covers some or all of the mounting surface of the submount.

3. The apparatus of claim 1 , wherein a solder layer covers some or all of the thermally conductive material at the mounting surface.

4. The apparatus of claim 1 , wherein:
the submount comprises a plurality of surfaces including the first surface, the mounting surface, and a plurality of other exterior surfaces; and
the thermally conductive material covers some or all of at least three of the plurality of other exterior surfaces.

5. The apparatus of claim 1 , further comprising:
a suspension configured to support the slider; and
a thermally conductive bonding material disposed between the slider and the suspension, the thermally conductive bonding material serving as a thermal conduction pathway between the slider and the suspension.

6. The apparatus of claim 5 , wherein the thermally conductive bonding material comprises a thermally conductive polymer.

7. The apparatus of claim 5 , wherein the thermally conductive bonding material comprises a thermally conductive epoxy.

8. The apparatus of claim 5 , wherein the thermally conductive bonding material comprises solder.

9. The apparatus of claim 5 , wherein the suspension comprises a coating of metallic material having a high thermal conductivity relative to an underlying structure of the suspension.

10. The apparatus of claim 5 , wherein the suspension is formed from a material having a high thermal conductivity relative to stainless steel.

11. The apparatus of claim 5 , wherein:
the slider comprises an air bearing surface, side surfaces, and a contacting surface adjacent the suspension; and
at least the contacting surface of the slider comprises a coating of metallic material having a high thermal conductivity.

12. The apparatus of claim 5 , wherein:
the slider comprises an air bearing surface, side surfaces, and a contacting surface adjacent the suspension; and
the contacting surface and a plurality of the side surfaces of the slider comprise a coating of metallic material having a high thermal conductivity.

13. The apparatus of claim 12 , wherein the material covering the side surfaces of the slider forms a wedge-shaped structure between the slider and the suspension.

14. The apparatus of claim 5 , wherein the suspension comprises a coating of metallic material having a high thermal conductivity relative to an underlying structure of the suspension.

15. The apparatus of claim 1 , wherein:
the slider comprises a media-facing surface opposing the first surface of the slider; and
the first surface of the submount is normal to the first surface of the slider.

16. An apparatus, comprising:
a submount configured to be soldered to a slider, the submount having a polygonal shape with exterior surfaces and a mounting surface configured to be attached to the slider via a solder connection;
a laser diode mounted on a first surface of the submount, the first surface comprising one or more electrical conductors for establishing electrical connections to the laser diode; and
thermally conductive material covering a plurality of the exterior surfaces of the submount in addition to the mounting surface, the thermally conductive material covering the mounting surface of the submount serving as a wetting layer for the solder connection;
wherein the one or more electrical conductors are electrically isolated from the thermally conductive material to prevent shorting of the one or more electrical conductors.

17. The apparatus of claim 16 , wherein the thermally conductive material covers a second surface of the submount opposing the first surface.

18. The apparatus of claim 16 , wherein the thermally conductive material covers at least three surfaces of the submount.

19. The apparatus of claim 16 , wherein the thermally conductive material covers at least four surfaces of the submount.

20. The apparatus of claim 16 , wherein the thermally conductive material covers at least five surfaces of the submount.

21. The apparatus of claim 16 , wherein:
the thermally conductive material covers exterior surfaces of the submount and the laser diode; and
a layer or wedge of solder thermally connects the exterior surfaces of the laser diode to thermally conductive material on the submount.

Assignees

• Seagate Technology Llc

Inventors

• Cheng Yuhang
• Franzen Scott
• Jandric Zoran
• Wessel James Gary
• Shi Ning

Classifications

• G11B5/314

  where the layers are extra layers normally not provided in the transducing structure, e.g. optical layers (G11B5/3196 takes precedence) · CPC title

• G11B5/4826

  Mounting, aligning or attachment of the transducer head relative to the arm assembly, e.g. slider holding members, gimbals, adhesive (G11B5/484 takes precedence; details of head housings or structures G11B5/10, G11B5/127; adjustment relative to the record carrier G11B5/56) · CPC title

• G11B5/6088 Primary

  Optical waveguide in or on flying head · CPC title

• G11B2005/0021

  Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal · CPC title

• G11B5/105

  Mounting of head within housing {or assembling of head and housing (G11B5/3103 takes precedence)} · CPC title