Wafer inspection method and software

Patent metadata

Field	Value
Publication number	US-9754365-B2
Application number	US-201514609455-A
Country	US
Kind code	B2
Filing date	Jan 30, 2015
Priority date	Feb 21, 2014
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

Embodiments of the present invention generally relate to methods for inspecting wafers. After a brick is sliced into a plurality of bare wafers, a two-dimensional (2D) photoluminescence (PL) image of each wafer is taken, the PL images of the wafers in sequential order (i.e., the sequence of the wafers as they are sliced from the brick) are then combined to construct a three-dimensional (3D) model of the brick that highlights similar regions in the brick.

First claim

The invention claimed is:

1. A method for inspecting wafers, comprising:
combining two-dimensional photoluminescence images of each wafer of a plurality of wafers, wherein the images of the plurality of wafers are combined in sequential order corresponding to a position of each wafer in a brick prior to slicing of the brick; and
constructing a three-dimensional photoluminescence model of the brick highlighting similar regions within the brick, wherein the three-dimensional photoluminescence model is constructed from combining the two-dimensional photoluminescence images in sequential order.

2. The method of claim 1 , wherein the brick has a length of about 144 mm, a width of about 144 mm and a height of about 500 mm or more.

3. The method of claim 2 , wherein each wafer of the plurality of wafers has a length of about 144 mm, a width of about 144 mm and a thickness of about 200 microns.

4. The method of claim 1 , wherein the brick has a length of about 156 mm, a width of about 156 mm and a height of about 500 mm or more.

5. The method of claim 4 , wherein each wafer of the plurality of wafers has a length of about 156 mm, a width of about 156 mm and a thickness of about 200 microns.

6. The method of claim 1 , further comprising forming the plurality of wafers by slicing the brick.

7. The method of claim 6 , further comprising taking the two-dimensional photoluminescence image of each wafer.

8. The method of claim 7 , wherein the taking the two-dimensional photoluminescence image of each wafer comprises inducing photoluminescence across a surface of the wafer by a light source.

9. The method of claim 8 , wherein the light source is a laser.

10. The method of claim 1 , wherein the similar regions represent defects.

11. A method, comprising:
slicing a brick to form a plurality of wafers;
taking a two-dimensional photoluminescence image of each wafer of the plurality of wafers;
sorting the two-dimensional photoluminescence images of the wafers in sequential order to produce sequential two-dimensional photoluminescence images;
combining the sequential two-dimensional photoluminescence images; and
constructing a three-dimensional photoluminescence model of the brick, wherein the three-dimensional photoluminescence model is constructed from combining the sequential two-dimensional photoluminescence images.

12. The method of claim 11 , wherein the brick has a length of about 144 mm, a width of about 144 mm and a height of about 500 mm or more.

13. The method of claim 12 , wherein each wafer of the plurality of wafers has a length of about 144 mm, a width of about 144 mm and a thickness of about 200 microns.

14. The method of claim 11 , wherein the brick has a length of about 156 mm, a width of about 156 mm and a height of about 500 mm or more.

15. The method of claim 14 , wherein each wafer of the plurality of wafers has a length of about 156 mm, a width of about 156 mm and a thickness of about 200 microns.

16. The method of claim 11 , wherein the taking the two-dimensional photoluminescence image of each wafer comprises inducing photoluminescence across a surface of the wafer by a light source.

17. The method of claim 16 , wherein the light source is a laser.

18. The method of claim 11 , further comprising highlighting similar regions within the three-dimensional photoluminescence model, wherein the similar regions represent defects.

19. The method of claim 18 , further comprising treating a subsequent brick based on the three-dimensional photoluminescence model of the brick, wherein the brick and the subsequent brick are formed under same process conditions.

20. The method of claim 19 , wherein treating the subsequent brick comprises laser annealing.

Assignees

• Applied Materials Inc

Inventors

• Schlezinger Asaf
• Stopper Markus J

Classifications

• G06T2219/2012

  Colour editing, changing, or manipulating; Use of colour codes · CPC title

• G06T17/00

  Three-dimensional [3D] modelling for computer graphics · CPC title

• G06T2207/30148

  Semiconductor; IC; Wafer · CPC title

• G06T7/001 Primary

  using an image reference approach · CPC title

• G06T17/10

  Constructive solid geometry [CSG] using solid primitives, e.g. cylinders, cubes · CPC title