Method for modifying an electronic device

Patent metadata

Field	Value
Publication number	US-9753502-B2
Application number	US-201314056433-A
Country	US
Kind code	B2
Filing date	Oct 17, 2013
Priority date	May 6, 2010
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

The present invention relates to improved protective cases for hand-held electronic devices. More specifically, the present invention relates to cases that protect and modify the functionality of an electronic device.

First claim

The invention claimed is:

1. A method for modifying an electronic device comprising the steps of:
providing a lower portion having:
i. at least one edge;
ii. an inner surface located within the at least one edges;

providing an upper portion having:
i. at least one edge;
ii. a recessed area for receiving the electronic device;
iii. a pocket for receiving an edge of the electronic device, the pocket located substantially parallel to at least one edge of the upper portion;

providing a hinge portion having:
at least two upper pin structures attaching the hinge portion to the upper portion of the case;
at least two lower pin structures attaching the hinge portion to the lower portion of the case;

locating a keyboard insert within the lower portion; and
locating the electronic device within the recessed area of the upper portion so that an edge of the electronic device contacts the pocket for receiving an edge of the electronic device.

2. The method of claim 1 , further comprising a step of moving the upper portion toward the lower portion so that the electronic device is located between and substantially parallel to the upper portion and the lower portion.

3. The method of claim 1 , further comprising a step of moving the upper portion toward the lower portion so that the upper portion is located between and substantially parallel to the electronic device and the lower portion.

4. The method of claim 3 , further comprising a step of moving the upper portion away from the lower portion so that the upper portion is maintained at an angle of greater than 15° but less than 150° in relation to the lower portion.

5. The method of claim 4 , further comprising a step of locating a planar portion of the lower portion onto a surface so that the electronic device can be viewed by a user.

6. The method of claim 4 , further comprising a step of locating at least one edge of the lower portion and at least one edge of the upper portion on a surface so that the electronic device can be viewed by a user.

7. The method of claim 1 , further comprising a step of removing the electronic device from the upper portion.

8. The method of claim 1 , further comprising a step of providing a wireless connection between the keyboard insert and the electronic device so that any data entered via the keyboard insert is received by the electronic device.

9. The method of claim 1 , further comprising a step of contacting the electronic device through an opening along an edge of the upper portion and placing pressure on the electronic device in order to dislodge the electronic device from within the upper portion.

10. The method of claim 1 , wherein the hinge portion has exactly four pin structures.

11. The method of claim 10 , further comprising a step of at least partially enclosing the upper pin structures within the hinge portion.

12. The method of claim 11 , further comprising a step of forming one or more openings in the hinge portion for receiving the upper pin structures.

13. The method of claim 12 , further comprising a step of connecting the upper pin structures to the upper portion.

14. The method of claim 13 , further comprising a step of connecting the lower pin structures to the lower portion.

15. The method of claim 1 , further comprising a step of at least partially enclosing the upper pin structures within the hinge portion.

16. The method of claim 1 , further comprising a step of forming one or more openings in the hinge portion for receiving the upper pin structures.

17. The method of claim 1 , further comprising a step of connecting the upper pin structures to the upper portion.

18. The method of claim 1 , further comprising a step of connecting the lower pin structures to the lower portion.

19. The method of claim 18 , further comprising a step of connecting the upper pin structures to the upper portion.

Assignees

• Incipio Tech Inc
• Incipio Llc

Inventors

• Ahee Anthony
• Schoenith John M

Classifications

• Y10T29/49826

  Assembling or joining · CPC title

• G06F1/1632 Primary

  External expansion units, e.g. docking stations · CPC title

• G06F1/1681

  Details related solely to hinges (hinge details related to the transmission of signals or power are classified in G06F1/1683) · CPC title

• G06F1/182 Primary

  with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI] · CPC title

• Y10T16/547

  Cross-Sectional Technologies · mapped topic