Thermal flow meter with an asymmetrical inflow-side of circuit package

Patent metadata

Field	Value
Publication number	US-9752908-B2
Application number	US-201314407775-A
Country	US
Kind code	B2
Filing date	May 29, 2013
Priority date	Jun 15, 2012
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

A thermal flow meter has improved measurement accuracy due to the shape of a circuit package. The circuit package has a measurement surface and a backside of a measurement surface of a rear surface thereof is located in a bypass passage, the bypass passage being configured to allow a measurement target gas to flow therein dividing the measurement target gas into a flow path at a side of the measurement surface and a flow path at a side of the backside of measurement surface of a rear surface thereof. An inflow-side end surface of the circuit package has different shapes at the side of the measurement surface and at the side of the backside of the measurement surface.

First claim

The invention claimed is:

1. A thermal flow meter including a bypass passage for flowing a measurement target gas received from a main passage, an air flow sensing portion for measuring a flow rate of the measurement target gas by performing heat transfer with the measurement target gas flowing through the bypass passage, and a circuit package having the air flow sensing portion,
wherein the circuit package is such that a measurement surface and a backside of a measurement surface of the rear surface thereof are located in the bypass passage,
the bypass passage is configured to allow the measurement target gas to flow therein dividing the measurement target gas into a flow path at a side of the measurement surface of the circuit package and a flow path at a side of the backside of the measurement surface of a rear surface thereof,
an inflow-side end surface of the circuit package for dividing the measurement target gas has different shapes at the side of the measurement surface and at the side of the backside of the measurement surface, and
a metal substrate for fixing the air flow sensing portion is molded by a molding process, wherein the metal substrate is exposed on the backside of the measurement surface.

2. The thermal flow meter according to claim 1 , wherein the end surface is configured such that an inclined surface at the side of the measurement surface and an inclined surface at the side of the backside of the measurement surface are constituted by asymmetrical inclined surfaces.

3. The thermal flow meter according to claim 1 , wherein the end surface is constituted by an inclined surface at the side of the measurement surface and a vertical surface at the side of the backside of the measurement surface.

4. The thermal flow meter according to claim 1 , wherein the end surface is constituted by arc cross sections of which curvature radiuses are different at the side of the measurement surface and at the side of the backside of the measurement surface.

5. The thermal flow meter according to claim 1 , wherein the end surface is an inclined surface inclined backward to the outlet-side at the side of the measurement surface with respect to a reference line dividing the measurement target gas and an inclined surface inclined to protrude to the inflow-side farther than the reference line to the side of the backside of the measurement surface.

6. The thermal flow meter according to claim 1 , wherein
the metal substrate has an upper layer portion for fixing the flow rate detection element and a lower layer portion lower than this upper layer portion which are formed in a bent manner, and
the lower layer portion is exposed on the backside of the measurement surface.

7. The thermal flow meter according to claim 1 , wherein the air flow sensing portion has a diaphragm for transmitting heat with the measurement target gas, and a surface of the diaphragm and the measurement surface are formed to be flush with each other.

Assignees

• Hitachi Automotive Systems Ltd

Inventors

• Tashiro Shinobu
• Hanzawa Keiji
• Tokuyasu Noboru
• Morino Takeshi
• Doi Ryosuke
• Uenodan Akira

Classifications

• G01F1/6842 Primary

  with means for influencing the fluid flow · CPC title

• G01F1/684 Primary

  Structural arrangements; Mounting of elements, e.g. in relation to fluid flow · CPC title

• G01F15/14

  Casings, e.g. of special material · CPC title

• G01F1/696

  Circuits therefor, e.g. constant-current flow meters · CPC title