Data center floor management

Patent metadata

Field	Value
Publication number	US-9752329-B2
Application number	US-201514926041-A
Country	US
Kind code	B2
Filing date	Oct 29, 2015
Priority date	Jul 6, 2015
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

A floor tile for a data center floor is provided that includes a first tile module having a main surface including a first side wall portion and a second side wall portion extending from opposite edges of the main surface, the first side wall portion and second side wall portion each including at least one recess for receiving cabling; and a second tile module having a main further surface adapted to form a removable lid of the first tile module. A data center floor including such a floor tile and a data center including such a data center floor are also provided.

First claim

What is claimed is:

1. A floor tile for a data center floor, comprising:
a first tile module comprising a main tile portion having a first surface area and opposite inner and outer main surfaces, and a first side wall and a second side wall each extending away from the opposite main surfaces to a side wall edge, the first side wall and second side wall being opposing side walls and each side wall edge comprising at least one recess for receiving cabling;
a second tile module comprising a further main tile portion, having a second surface area, and opposite inner and outer further main surfaces, and a first further side wall and a second further side wall extending away from the opposite further main surfaces to a further sidewall edge, the first further side wall and the second further side wall being opposing side walls and each further side wall edge comprising at least one further recess for receiving the cabling, the second tile module being adapted to form a removable lid of the first tile module, and the second surface area of the further main tile portion of the second tile module being different from the first surface area of the main tile portion of the first tile module;
wherein with the floor tile in position, the first further side wall of the second tile module is disposed opposite the first side wall of the first tile module and the second further side wall of the second tile module is disposed opposite the second side wall of the first tile module and the at least one further recess in the first further side wall and second further side wall are arranged to cooperate with the at least one recess in the first side wall and second side wall to allow passing of the cabling through the floor tile; and
wherein with the floor tile in position, the side wall edges of the first and second side walls of the first tile module contact the inner further main surface of the second tile module or the further side wall edges of the first and second further side walls of the second tile module contact the inner main surface of the first tile module.

2. The floor tile of claim 1 , further comprising a third side wall opposite a fourth side wall, the third side wall and fourth side wall each extending from the first side wall to the second side wall.

3. The floor tile of claim 2 , wherein the third side wall and the fourth side wall each comprise at least one further recess for receiving cabling.

4. The floor tile of claim 1 , wherein the further main tile portion of the second tile module contact the side wall edges of the first side wall and the second side wall when the second tile module is placed on the first tile module.

5. The floor tile of claim 1 , wherein the further side wall edges of the first further side wall and the second further side wall contact the main tile portion of the first tile module when the second tile module is placed on the first tile module.

6. The floor tile of claim 1 , further comprising at least one fastener to fasten the first tile module to the second tile module.

7. The floor tile of claim 1 , wherein the main tile portion and the main further tile portion each comprise a plurality of air holes for circulating air through the floor tile.

8. The floor tile of claim 7 , wherein the main tile portion and the main further tile portion are perforated surfaces.

9. A data center floor comprising a grid of floor tiles including floor tiles having:
a first tile module comprising a main tile portion having a first surface area, and opposite inner and outer main surfaces, and a first side wall and a second side wall each extending away from the opposite main surfaces to a side wall edge, the first side wall and second side wall being opposite side walls and each side wall edge comprising at least one recess for receiving cabling;
a second tile module comprising a further main tile portion, having a second surface area, and opposite inner and outer main surfaces, and a first further side wall and a second further side wall extending away from the opposite further main surfaces to a further side wall edge, the first further side wall and the second further side wall being opposite side walls and each further side wall edge comprising at least one further recess for receiving the cabling, the second tile module being adapted to form a removable lid of the first tile module, and the second surface area of the further main tile portion of the second tile module being different from the first surface area of the main tile portion of the first tile module;
wherein with the floor tile in position, the first further side wall of the second tile module is disposed opposite the first side wall of the first tile module and the second further side wall of the second tile module is disposed opposite the second side wall of the first tile module and the at least one further recess in the first further side wall and second further side wall are arranged to cooperate with the at least one recess in the first side wall and second side wall to allow passing of the cabling through the first tile; and
wherein with the floor tile in position, the side wall edges of the first and second side walls of the first tile module contact the inner further main surface of the second tile module or the further side wall edges of the first and second further side walls of the second tile module contact the inner main surface of the first tile module.

10. The data center floor of claim 9 , further comprising a plurality of legs for raising the grid of floor tiles above a floor surface on which the legs are to be positioned.

11. A data center including a data center floor comprising a grid of floor tiles including floor tiles having:
a first tile module comprising a main tile portion having a first surface area, and opposite inner and outer main surfaces, and a first side wall and a second side wall each extending away from the opposite main surfaces to a side wall edge, the first side wall and second side wall being opposite side walls and each side wall edge comprising at least one recess for receiving cabling;
a second tile module comprising a further main tile portion, having a second surface area, and opposite inner and outer further main surfaces, and a first further side wall and a second further side wall extending away from the opposite further main surfaces to a further side wall edge, the first further side wall and the second further side wall being opposite side walls and each further side wall edge comprising at least one further recess for receiving the cabling, the second tile module being adapted to form a removable lid of the first tile module, and the second surface area of the further main tile portion of the second tile module being different from the first surface area of the main tile portion of the first tile module;
wherein with the floor tile in position, the first further side wall of the second tile module is disposed opposite the first side wall of the first tile module and the second further side wall of the second tile module is disposed opposite the second side wall of the first tile module and the at least one further recess in the first further side wall and second further side wall are arranged to cooperate with the at least one recess in the first side wall and second side wall to allow passing of the cabling through the first tile; and
wherein with the floor tile in position, the side wall edges of the first and second side walls of the first tile module contact the inner further main surface of the second tile module or the further side wall edges of the first and second further side walls of the second tile module contact the inner main surface of the first tile module.

Assignees

• IBM

Inventors

• Rodriguez Jean-Michel

Classifications

• E04F15/02177

  Floor elements for use at a specific location (not used, see subgroups) · CPC title

• E04F15/02447

  Supporting structures · CPC title

• E04F15/02458

  Framework supporting the panels · CPC title

• E04F15/02417 Primary

  made of box-like elements · CPC title

• E04F2290/02

  for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets · CPC title