Multicathode deposition system and methods
US-12051576-B2 · Jul 30, 2024 · US
US9752228B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9752228-B2 |
| Application number | US-72319910-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 12, 2010 |
| Priority date | Apr 3, 2009 |
| Publication date | Sep 5, 2017 |
| Grant date | Sep 5, 2017 |
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Target assemblies and PVD chambers including target assemblies are disclosed. The target assembly includes a target that has a concave shaped target. When used in a PVD chamber, the concave target provides more radially uniform deposition on a substrate disposed in the sputtering chamber.
Opening claim text (preview).
What is claimed is: 1. A sputtering apparatus comprising: a chamber having a wall defining a process area including a substrate support; a reactive gas source connected to the chamber to provide a reactive gas during processing; a target spaced from the substrate support, the target having a front face defining sputterable target surface extending between peripheral edges of the target and the sputterable target surface defining an overall concave shape substantially between t…
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