Polyamic acid and polyimide, processes for the production of same, compositions containing same, and uses thereof

Patent metadata

Field	Value
Publication number	US-9752030-B2
Application number	US-201013203343-A
Country	US
Kind code	B2
Filing date	Feb 26, 2010
Priority date	Mar 4, 2009
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

The purpose of the present invention is to provide a polyimide resin which exhibits higher heat resistance than that of a conventional polyimide resin by controlling the geometric configuration of the constituent units. Provided is a polyamic acid which comprises repeating units represented by general formula (1), wherein the 1,4-bismethylenecyclohexane skeleton units consist of both trans- and cis-form units, and the contents of the trans- and cis-form units are 60 to 100% and 0 to 40% respectively (with the sum total of the trans- and cis-form units being 100%).

First claim

The invention claimed is:

1. A polyimide having at least two different repeating units each represented by general formula (2) and having different R,

wherein 1,4-bismethylenecyclohexane skeletons (X) in general formula (2) are a trans isomer represented by formula (X1) or a cis isomer represented by formula (X2), and

a content of the trans isomer is 63% to 91%, and a content of the cis isomer is 9% to 37%, with respect to the total content of the cis and trans isomers being 100%,
where the at least two different repeating units include a repeating unit having R represented by the following formula (R1) and a repeating unit having R represented by the following formula (R2),

where —Y— represents a single bond.

2. The polyimide according to claim 1 , wherein the content of the trans isomer is 80% to 91%, and the content of the cis isomer is 9% to 20%, with respect to the total content of the cis and trans isomers being 100%.

3. The polyimide according to claim 1 , wherein a logarithmic viscosity of the polyimide in a 9:1 (weight ratio) mixture solvent of p-chlorophenol and phenol is 0.1 to 3.0 dl/g, as measured at 35° C. and at a polyimide concentration of 0.5 g/dl.

4. A polyimide film comprising the polyimide according to claim 1 .

5. The polyimide film according to claim 4 , wherein a glass transition temperature is 250° C. or above.

6. A metal clad laminate obtained by laminating together the polyimide film according to claim 4 and a metal foil.

7. A polyimide resin composition comprising the polyimide according to claim 1 and a coloring agent.

8. The polyimide resin composition according to claim 7 , wherein the coloring agent is a whitening agent.

9. The polyimide resin composition according to claim 8 , wherein the whitening agent is titanium oxide.

10. A light reflector comprising the polyimide resin composition according to claim 8 as a light reflecting material.

11. A display substrate material comprising the polyimide according to claim 1 .

12. A circuit board material comprising the polyimide according to claim 1 .

13. A coating material comprising the polyimide according to claim 1 .

14. A display substrate material comprising the polyimide resin composition according to claim 7 .

15. A circuit board material comprising the polyimide resin composition according to claim 7 .

16. A coating material comprising the polyimide resin composition according to claim 7 .

17. A process for producing a polyimide comprising:
reacting together 1,4-bis(aminomethyl)cyclohexane and at least two different tetracarboxylic dianhydrides each represented by formula (3) and having different R, to thereby obtain a polyamic acid,

wherein a content of a trans isomer of the 1,4-bis(aminomethyl)cyclohexane represented by formula (Y1) is 63% to 91%, and a content of a cis isomer of the 1,4-bis(aminomethyl)cyclohexane represented by formula (Y2) is 9% to 37%, with respect to the total content of the cis and trans isomers being 100%,

where the at least two different repeating units include a repeating unit having R represented by the following formula (R1) and a repeating unit having R represented by the following formula (R2),

where —Y— represents a single bond, and
thermally or chemically imidizing the polyamic acid.

Assignees

• Fukukawa Kenichi
• Okazaki Masaki
• Sakata Yoshihiro
• Fujio Ichiro
• Yamashita Wataru
• Mitsui Chemicals Inc

Inventors

• Fukukawa Kenichi
• Okazaki Masaki
• Sakata Yoshihiro
• Fujio Ichiro
• Yamashita Wataru

Classifications

• Y10T428/31681

  Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.] · CPC title

• B32B15/08

  of synthetic resin · CPC title

• C08L79/08 Primary

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• C08G73/1082

  wholly aromatic in the tetracarboxylic moiety · CPC title

• C09D179/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title