Preparation method for spiral laminate composite using compressive torsion

Patent metadata

Field	Value
Publication number	US-9751152-B2
Application number	US-201214351880-A
Country	US
Kind code	B2
Filing date	Oct 2, 2012
Priority date	Oct 20, 2011
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

Disclosed is a preparation method for a composite which comprises the following steps: (a) preparing unit metal pieces comprising two or more types of different metals; (b) circumferentially arranging the two or more types of unit metal pieces in a mold comprising upper and lower dies; (c) applying compressive stress to the loaded metal pieces using the upper and lower dies; and (d) rotating the upper and lower dies in one or two directions to apply torque in the pressed state.

First claim

The invention claimed is:

1. A method of preparing a laminate composite, comprising:
(a) preparing two types of unit metal specimens comprising different metals;
(b) circumferentially arranging the two types of unit metal specimens in a mold having upper and lower dies, wherein the two types of unit metal specimens are circumferentially arranged in an A-B-A-B pattern;
(c) applying compressive stress to the loaded metal specimens using the upper and lower dies; and
(d) rotating either or both of the upper and lower dies to apply torque to the metal specimens which are pressed and forming the laminate composite having a spiral laminate structure in a thickness direction.

2. The method of claim 1 , wherein properties of the composite are controlled by adjusting the number of loaded unit metal specimens in (b).

3. The method of claim 1 , wherein properties of the composite are controlled by adjusting the number of rotations in (d).

4. The method of claim 1 , wherein A is copper or a copper alloy, and B is aluminum or an aluminum alloy.

5. The method of claim 1 , wherein the unit metal specimens have a shape of a circular sector or a semicircular shape.

Assignees

• Postech Academy-Industry Found

Inventors

• Kim Hyoung Seop
• Choi Kang Hyun
• Lee Dong Jun
• Yoon Eun Yoo

Classifications

• B23K2203/10

  Operations & Transport · mapped topic

• B23K20/026

  with diffusion of soldering material · CPC title

• Y10T29/49908

  Joining by deforming · CPC title

• B23K20/02 Primary

  by means of a press {; Diffusion bonding} · CPC title

• B23K2203/18

  Operations & Transport · mapped topic