Method for mounting electronic component

Patent metadata

Field	Value
Publication number	US-9750169-B2
Application number	US-201314388487-A
Country	US
Kind code	B2
Filing date	Feb 27, 2013
Priority date	Mar 30, 2012
Publication date	Aug 29, 2017
Grant date	Aug 29, 2017

Abstract

A method for mounting an electronic component onto a circuit board. The method may include preparing a mounting device including a rotatable mounting head, a holding means to hold the electronic component, a component recognition camera, a memory device, and a microcomputer, the electronic component being mounted onto the circuit board based on a result of performing recognition processing with respect to an acquired image, determining a mid-operation instruction action mode at start of a production operation, executing an instruction of obtaining an offset value relative to a rotation center of the rotatable mounting head and storing the offset value in the memory device at a time interval according to the determined mid-operation instruction action mode, and executing the instruction at a longer time interval when the instruction has continuously met a required accuracy more than once.

First claim

The invention claimed is:

1. A method for mounting an electronic component onto a circuit board, the method comprising:
providing a mounting device including a rotatable mounting head, a holding means provided at the rotatable mounting head to hold the electronic component, a component recognition camera, a memory device and a microcomputer, the electronic component held by the holding means being mounted onto the circuit board based on a result of performing recognition processing by the microcomputer with respect to an acquired image by the component recognition camera;
determining a mid-operation instruction action mode at start of a production operation of the circuit board;
executing an instruction of obtaining an offset value relative to a rotation center of the rotatable mounting head and storing the offset value in the memory device at a time interval according to the determined mid-operation instruction action mode;
executing the instruction at a longer time interval than the time interval according to the mid-operation instruction action mode when the instruction has continuously met a required accuracy more than once; and
mounting the electronic component onto a circuit board after executing the instruction.

Assignees

• Yamaha Motor Co Ltd

Inventors

• Imoto Takuya
• Ono Tetsuji
• Okamoto Yoshinori

Classifications

• H05K13/04 Primary

  Mounting of components {, e.g. of leadless components} · CPC title

• H05K13/08

  Monitoring manufacture of assemblages · CPC title

• Y10T29/49131

  by utilizing optical sighting device · CPC title

• Y10T29/53087

  with signal, scale, illuminator, or optical viewer · CPC title

• B23Q17/24

  using optics {or electromagnetic waves} · CPC title