A component storage system, a component storehouse and a magazine preparation method
US-2024015942-A1 · Jan 11, 2024 · US
US9750168B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9750168-B2 |
| Application number | US-201615244301-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 23, 2016 |
| Priority date | Aug 28, 2015 |
| Publication date | Aug 29, 2017 |
| Grant date | Aug 29, 2017 |
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A depth of a cavity formed in a storing member is set to a depth which allows a portion of an electronic component to project from the cavity in a state where the electronic component is stored in the cavity. A storing member includes guide portions each of which is a space communicating with the cavity and configured to guide the electronic component into the cavity. A guide portion is formed such that a guide opening portion which is an opening portion of the guide portion is larger than an opening portion of the cavity and the opening portion of the cavity falls within a region of the guide opening portion as viewed in a depth direction of the cavity. A space formed of the cavity and the guide portion is configured to store an entire electronic component in the inside thereof.
Opening claim text (preview).
What is claimed is: 1. A conveyance apparatus for electronic components comprising: a storing member having a plurality of cavities in which an electronic component is stored respectively, an electronic component supply mechanism configured to supply a plurality of electronic components to be stored in the cavities to the storing member; and a moving unit configured to move the storing member in a predetermined direction in a relative relationship with the electronic component supply mechanism, the electronic components being sequentially stored in the plurality of cavities by moving the storing member and the electronic component supply mechanism relative to each other such that the plurality of respective cavities opposedly face the electronic components sequentially supplied from the electronic component supply mechanism, a depth of the cavity being set to a depth which allows a portion of the electronic component to project from the cavity in a state where the electronic component is stored in the cavity in a predetermined posture, the storing member including guide portions each of which is a space communicating with the cavity and configured to guide the electronic component into the cavity, the guide portion being formed such that a guide opening portion which is an opening portion of the guide portion is larger than an opening portion of the cavity and the opening portion of the cavity falls within a region of the guide opening portion as viewed in a depth direction of the cavity, and a storing space formed of the cavity and the guide portion being configured to store an entire electronic component in the inside thereof. 2. The conveyance apparatus for electronic components according to claim 1 , wherein the guide portion has a size which prevents another electronic component from projecting from the guide portion, even when said another electronic component enters the guide portion in a state where the electronic component is stored in the cavity. 3. The conveyance apparatus for electronic components according to claim 1 , wherein among the plurality of cavities which the storing member has, the guide portions which correspond to at least a pair of cavities adjacent to each other in a direction of relative movement between the electronic component supply mechanism and the storing member are formed integrally so as to communicate with each other. 4. An apparatus for industrial use comprising: the conveyance apparatus for electronic components according to claim 1 ; and an action portion which acts on the electronic components stored in the plurality of cavities, the storing member and the action portion being configured to be sequentially moved relative to each other such that the plurality of cavities in which the electronic components are stored opposedly face the action portion sequentially, and the action portion being configured to act on the electronic component in a state where at least a portion of the action portion is inserted into the guide portion.
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