Anti-magnetic interference component and electronic device
US-2024260242-A1 · Aug 1, 2024 · US
US9750131B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9750131-B2 |
| Application number | US-201414774593-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 30, 2014 |
| Priority date | Aug 1, 2013 |
| Publication date | Aug 29, 2017 |
| Grant date | Aug 29, 2017 |
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Provided are a transparent conductive laminate, a transparent electrode including the transparent conductive laminate, and a manufacturing method for the transparent conductive laminate.
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What is claimed is: 1. A transparent conductive laminate, comprising: a transparent substrate; two or more transparent conductive patterns provided on the transparent substrate; and a conductive line having higher electrical conductivity than the transparent conductive patterns, wherein the conductive line and the transparent conductive patterns are provided on a same surface of the transparent substrate, and the conductive line is provided between at least two adjacent transparent conductive patterns to contact at least a part of the transparent conductive patterns; and a transparent conductive layer provided on an upper surface of the transparent conductive patterns and the conductive line, wherein at least two transparent conductive patterns are separated from each other, and electrically connected to each other by the conductive line. 2. The transparent conductive laminate of claim 1 , wherein the conductive line is provided between the transparent conductive patterns to contact the transparent conductive patterns. 3. The transparent conductive laminate of claim 1 , wherein an upper surface step of the transparent conductive patterns and the conductive line which face a lower surface adjacent to the transparent substrate is 0 nm or more and 30 nm or less. 4. The transparent conductive laminate of claim 1 , wherein a thickness of the transparent conductive patterns is 15 nm or more and 200 nm or less. 5. The transparent conductive laminate of claim 1 , wherein a line width of the conductive line is 2 μm or more and 70 μm or less. 6. The transparent conductive laminate of claim 4 , wherein the thickness of the transparent conductive patterns is 50 nm or more and 180 nm or less. 7. The transparent conductive laminate of claim 1 , wherein a shape of the transparent conductive patterns is a triangle, a quadrangle, a honeycomb shape, or a Voronoi polygon. 8. The transparent conductive laminate of claim 1 , wherein a pitch of the transparent conductive patterns is 100 μm or more and 600 μm or less. 9. The transparent conductive laminate of claim 1 , wherein the transparent conductive patterns include a metal oxide or a transparent conductive polymer. 10. The transparent conductive laminate of claim 1 , wherein a sheet resistance of the transparent conductive laminate is 70% or less of the sheet resistance of the transparent conductive patterns. 11. The transparent conductive laminate of claim 1 , wherein an aperture ratio of the transparent conductive laminate is 80% or more and 99% or less. 12. The transparent conductive laminate of claim 1 , wherein transmittance for visible light of the transparent conductive laminate is 60% or more and 93% or less. 13. A transparent electrode including the transparent conductive laminate of claim 1 . 14. An organic electronic device including the transparent electrode of claim 13 . 15. A manufacturing method of the transparent conductive laminate of claim 1 , comprising: preparing the transparent substrate; forming a first transparent conductive layer on the transparent substrate; forming two or more transparent conductive patterns by patterning the first transparent conductive layer; and forming the conductive line between at least two adjacent transparent conductive patterns so that at least a part of the conductive line contacts the transparent conductive patterns; and forming a second transparent conductive layer provided on the upper surface of the transparent conductive patterns and the conductive line. 16. The method of claim 15 , wherein the forming of the conductive line includes forming a conductive layer for forming the conductive line on the transparent substrate and the transparent conductive pattern, and removing the conductive layer formed on the transparent conductive patterns, after the patterning. 17. The method of claim 16 , wherein the conductive layer is formed with a thickness of 0 nm or more and 30 nm or less which is different from a thickness of the transparent conductive patterns. 18. The method of claim 15 , further comprising: forming a sacrificial layer on the first transparent conductive layer; patterning simultaneously or respectively the first transparent conductive layer and the sacrificial layer; and removing the sacrificial layer, after forming the conductive line.
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