Proximity sensor module including time-of-flight sensor wherein a second group of light sensitive elements is in a second one of the chambers of the module

Patent metadata

Field	Value
Publication number	US-9746557-B2
Application number	US-201514806770-A
Country	US
Kind code	B2
Filing date	Jul 23, 2015
Priority date	Jul 25, 2014
Publication date	Aug 29, 2017
Grant date	Aug 29, 2017

Abstract

The present disclosure describes proximity sensor modules that include a time-of-flight (TOF) sensor. The module can include a plurality of chambers corresponding, respectively, to a light emission channel and a light detection channel. The channels can be optically separated from one another such that light from a light emitter element in the light emission chamber does not impinge directly on light sensitive elements of the TOF sensor in the light detection chamber. To achieve a module with a relatively small footprint, some parts of the TOF sensor can be located within the light emission chamber.

First claim

What is claimed is:

1. A proximity sensor module comprising:
a light emitter element to generate light, at least some of which is directed out of the module; and
a time-of-flight sensor including spatially distributed light sensitive elements and including circuitry to read and process signals from the light sensitive elements; and
the module having a plurality of chambers, wherein the light emitter and a first group of the light sensitive elements are in a first one of the chambers, and wherein a second group of the light sensitive elements is in a second one of the chambers,
wherein the first and second chambers are optically separated from one another such that light from the light emitter does not impinge directly from the light emitter onto the second group of light sensitive elements in the second chamber.

2. The proximity sensor module of claim 1 including an interior wall to separate the first and second chambers, wherein the interior wall has a bridge portion extending over a surface of the time-of-flight sensor.

3. The proximity sensor module of claim 1 wherein the second group of light sensitive elements includes detection pixels arranged to provide signals for determining a proximity of an object outside the module.

4. The proximity sensor module of claim 3 wherein the first group of light sensitive elements includes reference pixels arranged to provide signals for compensating for drift or to provide a zero distance measurement.

5. The proximity sensor module of claim 3 further including pixels arranged to provide signals to correct for a spurious reflection.

6. The proximity sensor module of claim 1 further including a respective optical filter coating over each of the first and second chambers.

7. A proximity sensor module comprising:
a light emitter element to generate light, at least some of which is directed out of the module;
a time-of-flight sensor including spatially distributed light sensitive elements and including circuitry to read and process signals from the light sensitive elements, wherein some of the light sensitive elements are arranged to provide reference signals based on light from the light emitter element, and wherein other ones of the light sensitive elements are arranged to provide detection signals in response to light entering the module;
the module having a plurality of chambers, a first one of the chambers including the light emitter and including the light sensitive elements arranged to provide the reference signals, and a second one of the chambers including the light sensitive elements arranged to provide the detection signals,
wherein the first and second chambers are optically separated from one another by an interior wall such that light from the light emitter does not impinge directly on the light sensitive elements arranged to provide the detection signals.

8. The proximity sensor module of claim 7 wherein the interior wall includes a bridge portion extending over a surface of the time-of-flight sensor.

9. The proximity sensor module of claim 7 wherein some of the light sensitive elements in the time-of-flight sensor further are arranged to provide signals for correction of optical cross-talk.

10. The proximity sensor module of claim 7 the light emitter element and the time-of-flight sensor are mounted on a first surface of a printed circuit board, and wherein an integrated circuit is mounted in a cavity on the opposite surface of the printed circuit board.

11. The proximity sensor module of claim 7 wherein the time-of-flight sensor is at an angle with respect to an edge of a printed circuit board on which the light emitter element is mounted.

12. The proximity sensor module of claim 7 further including a first beam shaping member arranged to direct light from the light emitter element out of the module, and a second beam shaping element arranged to direct light received from outside the module to the light sensitive elements that serve as the detection signals.

13. The proximity sensor module of claim 12 including a spacer separating a printed circuit board on which the light emitter element is mounted from an optics assembly including the first and second beam shaping elements.

14. The proximity sensor module of claim 7 further including a reflector to reflect some light from the light emitter element to the light sensitive elements that provide the reference signals.

15. The proximity sensor module of claim 14 wherein the reflector is formed as a unitary piece with a spacer that separates a printed circuit board on which the light emitter element is mounted from an optics assembly including the first and second beam shaping elements.

16. The proximity sensor module of claim 15 wherein the reflector is composed of a same material as the spacer.

17. The proximity sensor module of claim 16 wherein the reflector is composed of a material that is non-transparent to a wavelength of light emitted by the light emitter element.

18. The proximity sensor module of claim 12 further including a baffle laterally surrounding the first and second beam shaping elements.

19. The proximity sensor module of claim 7 wherein the spatially distributed light sensitive elements are pixels, wherein some of the pixels are dedicated to provide the reference signals based on light from the light emitter element, and wherein other ones of the pixels are dedicated to provide the detection signals in response to light entering the module.

20. A method of fabricating a proximity sensor module, the method comprising:
providing a printed circuit board having a surface on which are mounted a light emitter element and a flight-of-time sensor, wherein the time-of-flight sensor includes spatially distributed light sensitive elements and includes circuitry to read and process signals from the light sensitive elements, wherein some of the light sensitive elements are to provide reference signals based on light from the light emitter element, and wherein other ones of the light sensitive elements are to provide detection signals in response to light entering the module;
attaching a spacer to the surface of the printed circuit board such that the spacer laterally surrounds the light emitter element and the time-of-flight sensor, the spacer including first and second partial interior wall extensions separated from one another by the flight-of-time sensor;
forming a bridge extension over the time-of-flight sensor, the bridge extension connecting the first and second partial interior wall extensions to one another, wherein the light emitter element and the light sensitive elements to provide the reference signals are disposed to one side of the bridge extension, and wherein the light sensitive elements to provide the detection signals are disposed to another side of the bridge extension; and
attaching an optics member over the spacer, wherein the optics member includes beam shaping elements arranged, respectively, to direct light from the light emitter element out of the module and to direct incoming light to the light sensitive elements arranged to provide the detection signals.

21. The method of claim 20 wherein forming the bridge extension includes dispensing a non-transparent epoxy material that connects the partial interior wall extensions.

Assignees

• Heptagon Micro Optics Pte Ltd

Inventors

• Camarri Camilla
• Hobbis Jonathan
• Hallal Bassam

Classifications

• G01S17/08

  for measuring distance only (indirect measurement G01S17/46; active triangulation systems G01S17/48) · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K1/183

  associated with components mounted in and supported by recessed areas of the PCBs · CPC title

• G01S17/04 Primary

  Systems determining the presence of a target · CPC title