Inline inspection of the contact between conductive traces and substrate for hidden defects using white light interferometer with tilted objective lens

Patent metadata

Field	Value
Publication number	US-9746428-B2
Application number	US-201615146812-A
Country	US
Kind code	B2
Filing date	May 4, 2016
Priority date	Mar 28, 2014
Publication date	Aug 29, 2017
Grant date	Aug 29, 2017

Abstract

Embodiments include devices, systems and processes for using a white light interferometer (WLI) microscope with a tilted objective lens to perform in-line monitoring of both resist footing defects and conductive trace undercut defects. The defects may be detected at the interface between dry film resist (DFR) footings and conductive trace footing found on insulating layer top surfaces of a packaging substrate. Such footing and undercut defects may other wise be considered “hidden defects”. Using the WLI microscope with a tilted objective lens provides a high-throughput and low cost metrology and tool for non-destructive, non-contact, in-line monitoring.

First claim

The invention claimed is:

1. An apparatus for detecting defects in an interface between conductive traces and an insulating substrate surface, the apparatus comprising:
a white light interferometer (WLI) microscope having an object lens disposed above a platform surface configured for mounting a package substrate, the object lens capable of being tilted at an angle to put an axis of the object lens at a first inspection angle of between 2 and 20 degrees with respect to a tangent of the platform surface; and
one of the object lens or the platform capable of being tilted at an angle to put an axis of the object lens at a second inspection angle of between 5 and 20 degrees with respect to a tangent of the platform surface.

2. The apparatus of claim 1 , further comprising:
a moving tool for moving the platform surface laterally with respect to the microscope; and
a camera for imaging the platform surface through the microscope while moving the platform surface.

3. The apparatus of claim 1 , wherein the platform surface is configured for mounting a package substrate having dry film resist islands or conductive traces on an insulating substrate surface.

4. The apparatus of claim 1 , wherein the platform surface is configured for mounting a package substrate having dry film resist (DFR) islands or conductive traces on an insulating substrate surface;
the object lens capable of being tilted at an angle to put an axis of the object lens at a first inspection angle of between 2 and 20 degrees with respect to a tangent of the platform surface for inspecting the insulating substrate surface and side surfaces of the DFR islands for DFR footing defects, wherein inspecting comprises using the tilted object lens at the first inspection angle; and
one of the object lens or the platform capable of being tilted at an angle to put an axis of the object lens at a second inspection angle of between 5 and 20 degrees with respect to a tangent of the platform surface for inspecting the insulating substrate surface and side surfaces of the traces for conductor trace undercut (CTU) defects using the tilted object lens at the second inspection angle.

5. The apparatus of claim 4 , wherein the platform surface is configured for mounting a package substrate having dry film resist (DFR) islands and conductive traces on an insulating substrate surface.

6. The apparatus of claim 1 , further comprising a package substrate mounted on the platform surface, the package substrate having dry film resist (DFR) islands and conductive traces on an insulating substrate surface; and
the object lens tilted at an angle to put an axis of the object lens at a first inspection angle of between 2 and 20 degrees with respect to a tangent of the platform surface for inspecting the insulating substrate surface and side surfaces of the DFR islands for DFR footing defects; and
one of the object lens or the platform tilted at an angle to put an axis of the object lens at a second inspection angle of between 5 and 20 degrees with respect to a tangent of the platform surface for inspecting the insulating substrate surface and side surfaces of the traces for conductor trace undercut (CTU) defects.

7. A system for detecting defects in an interface between conductive traces and an insulating substrate surface, the system comprising:
a platform surface for mounting a package substrate having dry film resist islands on an insulating substrate surface; and
a white light interferometer (WLI) microscope having an object lens disposed above the platform surface, the object lens capable of being tilted at an angle to put an axis of the object lens at a first inspection angle of between 2 and 20 degrees with respect to a tangent of the platform surface; and
one of the object lens or the platform capable of being tilted at an angle to put an axis of the object lens at a second inspection angle of between 5 and 20 degrees with respect to a tangent of the platform surface.

8. The system of claim 7 , further comprising:
a moving tool for moving the platform surface laterally with respect to the microscope; and
a camera for imaging through the microscope, one of the platform surface or the insulating substrate surface while moving the platform surface.

9. The system of claim 7 , wherein the platform surface is for mounting a package substrate having dry film resist (DFR) islands or conductive traces on an insulating substrate surface.

10. The system of claim 7 , wherein the platform surface is configured for mounting a package substrate having dry film resist (DFR) islands or conductive traces on an insulating substrate surface;
the object lens capable of being tilted at an angle to put an axis of the object lens at a first inspection angle of between 2 and 20 degrees with respect to a tangent of the platform surface for inspecting the insulating substrate surface and side surfaces of the DFR islands for DFR footing defects, wherein inspecting comprises using the tilted object lens at the first inspection angle; and
one of the object lens or the platform capable of being tilted at an angle to put an axis of the object lens at a second inspection angle of between 5 and 20 degrees with respect to a tangent of the platform surface for inspecting the insulating substrate surface and side surfaces of the traces for conductor trace undercut (CTU) defects using the tilted object lens at the second inspection angle.

11. The system of claim 10 , wherein the platform surface is configured for mounting a package substrate having dry film resist (DFR) islands and conductive traces on an insulating substrate surface.

12. The system of claim 7 , further comprising a package substrate mounted on the platform surface, the package substrate having dry film resist (DFR) islands and conductive traces on an insulating substrate surface; and
the object lens tilted at an angle to put an axis of the object lens at a first inspection angle of between 2 and 20 degrees with respect to a tangent of the platform surface for inspecting the insulating substrate surface and side surfaces of the DFR islands for DFR footing defects; and
one of the object lens or the platform tilted at an angle to put an axis of the object lens at a second inspection angle of between 5 and 20 degrees with respect to a tangent of the platform surface for inspecting the insulating substrate surface and side surfaces of the traces for conductor trace undercut (CTU) defects.

13. An apparatus for detecting defects in an interface between an insulating substrate surface and dry film resist (DFR) islands and conductive traces, the apparatus comprising:
a white light interferometer (WLI) microscope having an object lens disposed above a platform surface configured for mounting a package substrate, the object lens capable of being tilted at an angle to put an axis of the object lens at a first inspection angle of between 2 and 20 degrees with respect to a tangent of the platform surface for inspecting the insulating substrate surface and side surfaces of the DFR islands for DFR footing defects; and
one of the object lens or the platform capable of being tilted at an angle to put an axis of the object lens at a second inspection angle of between 5 and 20 degrees with respect to a tangent of the platform surface for inspecting the insulating substrate surface and side surfaces of the traces for conductor trace undercut (CTU) defects.

14. The apparatus of claim 13 , further comprising:
a moving tool for moving the platform surface laterally with respect to the microscope; and
a camera for imaging the platform surface through the microscope while moving th

Assignees

• Intel Corp

Inventors

• Liu Shuhong
• Wang Zhiyong
• Ghosh Nilanjan Z
• Goyal Deepak

Classifications

• G01B9/0209

  Low-coherence interferometers · CPC title

• G01N21/9501 Primary

  Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20) · CPC title

• G01N21/956

  Inspecting patterns on the surface of objects {(contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20)} · CPC title

• G01B11/0675

  using interferometry · CPC title

• G02B21/0016

  Technical microscopes, e.g. for inspection or measuring in industrial production processes · CPC title