Method and apparatus for solar power generation through gas volumetric heat absorption based on characteristic absorption spectrum
US-2018038353-A1 · Feb 8, 2018 · US
US9746206B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9746206-B2 |
| Application number | US-201314397923-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 1, 2013 |
| Priority date | May 1, 2012 |
| Publication date | Aug 29, 2017 |
| Grant date | Aug 29, 2017 |
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Provided are a heat-absorbing material having high heat resistance and high wavelength selectivity, and a process for producing the same. The heat-absorbing material includes: a heat-resistant metal having the substantially same periodic structure in the light incidence plane as the wavelength of sunlight having a specific wavelength in the wavelength regions of visible light and near-infrared rays; and a cermet formed on the light incidence plane of the heat-resistant metal. Thus, there can be achieved desirable absorption and radiation characteristics being such that absorption is performed in the visible light region meanwhile reflection is performed in the infrared region. Furthermore, the cermet does not need complicated film-formation control, and therefore, the high heat resistance can be maintained.
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The invention claimed is: 1. Heat-absorbing material, comprising: a heat-resistant metal having a substantially same periodic structure in a light incidence plane as a wavelength of sunlight having a specific wavelength in wavelength regions of visible light and near-infrared rays; and a cermet having a metal concentration of not more than 10 wt % formed on the light incidence plane of the heat-resistant metal, wherein the cermet includes a metal containing at least one of Mo, W, and Ta; and a ceramic containing Al 2 O 3 or SiO 2 . 2. The heat-absorbing material according to claim 1 , wherein the heat-resistant metal comprises at least one selected from the group consisting of tantalum, tungsten, molybdenum, niobium, titanium, iron, and an alloy thereof as a main component. 3. The heat-absorbing material according to claim 1 , wherein cermet has a film thickness of not less than 100 nm and not more than 2000 nm. 4. The heat-absorbing material according to claim 1 , wherein a metal film is formed between the heat-resistant metal and the cermet. 5. The heat-absorbing material according to claim 4 , wherein the metal film contains at least one of Mo, W, and Ta. 6. The heat-absorbing material according to claim 4 , wherein the metal film has a film thickness of not less than 20 nm and not more than 500 nm. 7. The heat-absorbing material according to claim 1 , wherein a transparent conductive film is formed on the cermet. 8. The heat-absorbing material according to claim 7 , wherein the transparent conductive film comprises any of a zinc oxide-based transparent conductive film, an indium oxide-based transparent conductive film, and a tin oxide-based transparent conductive film. 9. The heat-absorbing material according to claim 7 , wherein the transparent conductive film has a film thickness of not less than 50 nm. 10. The heat-absorbing material according to claim 1 , wherein the heat-resistant metal is stainless steel. 11. The heat-absorbing material according to claim 1 , wherein the periodic structure of the heat-resistant metal has a pitch of not more than 1 μm and a hole diameter of 200 nm to 800 nm. 12. A process for producing a heat-absorbing material, comprising the steps of: forming a substantially same periodic structure in a light incidence plane of a heat-resistant metal as a wavelength of sunlight having a specific wavelength in wavelength regions of visible light and near-infrared rays; and film-forming a eel net having a metal concentration of not more than 10 wt % on the light incidence plane of the heat-resistant metal, wherein the cermet includes a metal containing at least one of Mo, W, and Ta; and a ceramic containing Al 2 O 3 or SiO 2 . 13. The process for producing a heat-absorbing material according to claim 12 , wherein, in the step of forming the periodic structure, side walls of the periodic structure are protected, and etching is performed.
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