Liquid ejection head, recording apparatus and heat radiation method for liquid ejection head

Patent metadata

Field	Value
Publication number	US-9744760-B2
Application number	US-201514615960-A
Country	US
Kind code	B2
Filing date	Feb 6, 2015
Priority date	Feb 25, 2014
Publication date	Aug 29, 2017
Grant date	Aug 29, 2017

Abstract

Provided is a liquid ejection head including: a plurality of recording element substrates including energy generating elements that generate ejection energy for ejecting liquid from ejection orifices; a first support member that supports the plurality of recording element substrates such that the recording element substrates are arranged in one or more lines on a main surface of the first support member; and a second support member that supports the first support member on a surface opposite to the main surface. A first thermal resistance concerning an in-plane direction parallel to the main surface, of a region between the recording element substrates in the first support member is higher than a second thermal resistance concerning a thickness direction of the second support member, of a projection region that overlaps with each recording element substrate in the second support member.

First claim

What is claimed is:

1. A liquid ejection head comprising:
a plurality of recording element substrates including energy generating elements that generate ejection energy for ejecting liquid from ejection orifices;
a first support member that supports the plurality of recording element substrates such that the recording element substrates are arranged in one or more lines on a main surface of the first support member; and
a second support member that supports the first support member on a surface opposite to the main surface, wherein
a first thermal resistance concerning an in-plane direction parallel to the main surface, of a region between the recording element substrates in the first support member, is higher than a second thermal resistance concerning a thickness direction of the second support member, of a projection region that overlaps with each recording element substrate in the second support member, and
a third thermal resistance concerning the in-plane direction, of the projection region in the first support member, is lower than the first thermal resistance.

2. The liquid ejection head according to claim 1 , wherein a hole part that penetrates through the first support member is provided in the region between the recording element substrates.

3. The liquid ejection head according to claim 1 , wherein
a plurality of pedestal parts for individually mounting the plurality of recording element substrates is provided for the first support member, and
a distance between the pedestal parts is greater than a distance between the recording element substrates.

4. The liquid ejection head according to claim 1 , wherein
each recording element substrate includes a temperature sensor that detects a temperature of the recording element substrate and a heating member that heats the recording element substrate, and
an operation of the heating member is controlled such that a temperature that is detected by the temperature sensor in a period in which the liquid is not ejected from the ejection orifices falls within a predetermined allowable range.

5. The liquid ejection head according to claim 1 , wherein
each recording element substrate includes a temperature sensor that detects a temperature of the recording element substrate, and
operations of the energy generating elements are controlled such that a temperature that is detected by the temperature sensor in a period in which the liquid is not ejected from the ejection orifices falls within a predetermined allowable range.

6. The liquid ejection head according to claim 1 , wherein a distance from a region in which the recording element substrate located at an end of a line in the first support member is placed to an end of the first support member is equal to or less than ½ of a distance between the recording element substrates.

7. The liquid ejection head according to claim 1 , wherein the first support member includes through-holes for respectively supplying the liquid to the recording element substrates, the through-holes being respectively covered by the recording element substrates, and beam parts that extend across each through-hole.

8. The liquid ejection head according to claim 1 , wherein
the third thermal resistance is lower than a fourth thermal resistance concerning the in-plane direction, of the projection region in the second support member, and
a contact area between the first support member and the second support member is larger than a contact area between the first support member and the recording element substrates.

9. The liquid ejection head according to claim 8 , wherein a fifth thermal resistance concerning the in-plane direction of the first support member, of a region obtained by excluding the projection region from a region in which the first support member and the second support member overlap with each other, is lower than a sixth thermal resistance concerning the in-plane direction of the second support member.

10. A recording apparatus comprising a liquid ejection head, the liquid ejection head comprising:
a plurality of recording element substrates including energy generating elements that generate ejection energy for ejecting liquid from ejection orifices;
a first support member that supports the plurality of recording element substrates such that the recording element substrates are arranged in one or more lines on a main surface of the first support member; and
a second support member that supports the first support member on a surface opposite to the main surface, wherein
a first thermal resistance concerning an in-plane direction parallel to the main surface, of a region between the recording element substrates in the first support member, is higher than a second thermal resistance concerning a thickness direction of the second support member, of a projection region that overlaps with each recording element substrate in the second support member, and
a third thermal resistance concerning the in-plane direction, of the projection region in the first support member, is lower than the first thermal resistance.

11. A heat radiation method for a liquid ejection head, comprising:
radiating heat generated in a plurality of recording element substrates including energy generating elements that generate ejection energy for ejecting liquid from ejection orifices, by a first support member that supports the plurality of recording element substrates such that the recording element substrates are arranged in one or more lines on a main surface of the first support member, and a second support member that supports the first support member on a surface opposite to the main surface; and
transferring the heat from the first support member to the second support member by making such setting that a first thermal resistance concerning an in-plane direction parallel to the main surface, of a region between the recording element substrates in the first support member, is higher than a second thermal resistance concerning a thickness direction of the second support member, of a projection region that overlaps with each recording element substrate in the second support member, and a third thermal resistance concerning the in-plane direction, of the projection region in the first support member, is lower than the first thermal resistance.

Assignees

• Canon Kk

Inventors

• Yamada Kazuhiro
• Moriguchi Takuto
• Tamenaga Zentaro
• Iwanaga Shuzo
• Moriya Takatsugu

Classifications

• B41J2202/12

  with ink circulating through the whole print head · CPC title

• B41J2/04528 Primary

  aiming at warming up the head · CPC title

• B41J2/04581

  controlling heads based on piezoelectric elements · CPC title

• B41J2/1408

  Structure dealing with thermal variations, e.g. cooling device, thermal coefficients of materials · CPC title

• B41J2/155

  for line printing · CPC title