Electromagnetic shielding structures

Patent metadata

Field	Value
Publication number	US-9743564-B2
Application number	US-201514830351-A
Country	US
Kind code	B2
Filing date	Aug 19, 2015
Priority date	Aug 28, 2014
Publication date	Aug 22, 2017
Grant date	Aug 22, 2017

Abstract

An electronic device may have a printed circuit to which electrical components are mounted. Electromagnetic shields may be mounted to the printed circuit over the components to suppress interference. A shield may have a metal frame covered with a conductive fabric. The conductive fabric may cover an opening in the top of the frame. An insulating layer may be formed on the lower surface of the conductive fabric to prevent shorts between components on the printed circuit and the conductive fabric. An insulating cap such as an elastomeric polymer cap may also be formed over each component to provide electrical isolation between the components and the conductive fabric. Shields may be formed by coupling shield cans to subscriber identity module shields or other metal structures in a device. Intervening wall structures may be removed to help provide additional shielding volume.

First claim

What is claimed is:

1. A shield for electromagnetically shielding components on a printed circuit, comprising:
a metal frame having an opening;
a conductive fabric that covers the opening; and
an insulating layer on a surface of the conductive fabric, wherein the insulating layer is interposed between the components on the printed circuit and the conductive fabric.

2. The shield defined in claim 1 wherein the metal frame comprises four sidewalls and wherein the opening comprises a rectangular opening.

3. The shield defined in claim 2 further comprising conductive adhesive that attaches the conductive fabric to the metal frame.

4. The shield defined in claim 3 wherein the metal frame has planar upper metal wall portion that extends horizontally inwards from the four sidewalls and that surrounds the opening.

5. The shield defined in claim 4 wherein the conductive adhesive is attached between the planar upper metal wall portion and the conductive fabric.

6. The shield defined in claim 5 wherein the conductive fabric comprises intertwined fibers, metal particles, and a polymer binder in which the intertwined fibers and metal particles are embedded.

7. The shield defined in claim 5 wherein the planar upper metal wall portion has an inner surface of a first height and wherein the conductive fabric has an inner surface of a second height that is greater than the first height.

8. The shield defined in claim 1 wherein the insulating layer comprises a polymer layer and a layer of adhesive that attaches the polymer layer to the surface of the conductive fabric.

9. A shield for electromagnetically shielding components on a printed circuit, comprising:
a shield can; and
a subscriber identity module shield, wherein adjacent portions of the shield can and the subscriber identity module shield are joined together.

10. The shield defined in claim 9 wherein the shield can and subscriber identity module have at least one horizontal wall protrusion that mates with horizontally extending tabs.

11. The shield defined in claim 10 wherein the horizontally extending tabs comprise upper tabs and lower tabs and wherein the horizontal wall protrusion is received between the upper and lower tabs.

12. The shield defined in claim 10 wherein the horizontal wall protrusion protrudes outward from a horizontally extending planar upper wall of the shield can.

13. The shield defined in claim 10 wherein the horizontal wall protrusion protrudes outward from a horizontally extending planar upper wall of the subscriber identity module shield.

14. The shield defined in claim 9 further comprising a planar metal wall portion that is attached between the shielding can and the subscriber identity module shield.

15. The shield defined in claim 14 further comprising welds that attach the planar metal wall portion to the shielding can and to the subscriber identity module shield.

16. The shield defined in claim 9 further comprising conductive fabric that is attached between the shielding can and the subscriber identity module shield.

17. Apparatus, comprising:
a printed circuit;
electrical components soldered to the printed circuit;
a first shield that electromagnetically shields the electrical components, wherein the first shield includes a first vertical metal wall that is soldered to the printed circuit and a first surface extending horizontally from the first vertical metal wall; and
a second shield that electromagnetically shields an additional electronic component, wherein the second shield includes a second vertical metal wall and a second surface extending horizontally from the second vertical metal wall, and the second surface has tabs configured to attach the second surface to the first surface.

18. The apparatus defined in claim 17 wherein the tabs comprise upper and lower tabs, and the first surface is interposed between the upper and lower tabs when the second surface is attached to the first surface.

Assignees

• Apple Inc

Inventors

• Malek Shayan
• Pakula David A
• Stephens Gregory N
• Sloey Jason

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K9/0032 Primary

  having multiple parts, e.g. frames mating with lids · CPC title

• H05K2201/10371

  Shields or metal cases · CPC title