Printed circuit board with compact groups of devices

Patent metadata

Field	Value
Publication number	US-9743522-B2
Application number	US-201213627989-A
Country	US
Kind code	B2
Filing date	Sep 26, 2012
Priority date	Sep 26, 2012
Publication date	Aug 22, 2017
Grant date	Aug 22, 2017

Abstract

Electronic devices may contain electrical systems in which electrical components are mounted on a substrate such as a printed circuit board. The electrical components may include surface mount technology components. Multiple surface mount technology components may be stacked on top of each other and beside each other to form an electrical component that minimizes the amount of area that is consumed on a printed circuit board. Noise suppression circuits and other circuits may be implemented using stacked surface mount technology components. Surface mount technology components placed on the printed circuit board may be pushed together and subsequently injection molded to form packed component groups. An integrated circuit may be mounted to the printed circuit board via an interposer and may cover components mounted to the printed circuit board. An integrated circuit may be mounted over a recessed portion of the printed circuit board on which components are mounted.

First claim

What is claimed is:

1. Apparatus, comprising:
a printed circuit board having printed circuit board contacts on a surface; and
an electrical component formed from a plurality of stacked surface mount technology components on the surface of the printed circuit board, wherein:
the plurality of stacked surface mount technology components includes at least a first surface mount technology component having first component contacts, a second surface mount technology component having second component contacts, a third surface mount technology component having third component contacts, and a fourth surface mount technology component having fourth component contacts;
the electrical component has first, second, and third terminals coupled directly to the printed circuit board contacts;
the first and second surface mount technology components are both mounted directly to the printed circuit board and the third and fourth surface mount technology components are mounted on the first and second surface mount technology components;
the third surface mount technology component has a first portion that overlaps the first surface mount technology component without overlapping the second surface mount technology component and a second portion that is different than the first portion that overlaps the second surface mount technology component without overlapping the first surface mount technology component; and
the fourth surface mount technology component has a first portion that overlaps the first surface mount technology component without overlapping the second surface mount technology component and a second portion that is different than the first portion that overlaps the second surface mount technology component without overlapping the first surface mount technology component.

2. The apparatus defined in claim 1 further comprising an integrated circuit on the printed circuit board, wherein the integrated circuit comprises a power supply input and the electrical component is configured to reduce noise on the power supply input.

3. The apparatus defined in claim 2 wherein the first surface mount technology component comprises a capacitor and the second surface mount technology component comprises a capacitor.

4. The apparatus defined in claim 3 wherein the third surface mount technology component comprises a capacitor.

5. Apparatus, comprising:
a printed circuit board having first, second, and third printed circuit board contacts; and
an electrical component formed from a plurality of stacked surface mount technology components on the printed circuit board, wherein:
the plurality of stacked surface mount technology components includes a first surface mount technology component having first and second component contacts, a second surface mount technology component having third and fourth component contacts, a third surface mount technology component having fifth and sixth component contacts, and a fourth surface mount technology component having seventh and eight component contacts;
the first and second surface mount technology components are mounted adjacent to each other on the printed circuit board such that the first component contact is soldered to the first printed circuit board contact, the second component contact is soldered to the second printed circuit board contact, and the third component contact is soldered to the third printed circuit board contact;
the third surface mount technology component is mounted on the first and second surface mount technology components;
the fourth surface mount technology component is mounted on the first and second surface mount technology components and adjacent to the third surface mount technology component;
the sixth component contact is soldered to the third component contact;
the third surface mount technology component has a first portion that overlaps the first surface mount technology component without overlapping the second surface mount technology component and a second portion that is different than the first portion that overlaps the second surface mount technology component without overlapping the first surface mount technology component; and
the fourth surface mount technology component has a first portion that overlaps the first surface mount technology component without overlapping the second surface mount technology component and a second portion that is different than the first portion that overlaps the second surface mount technology component without overlapping the first surface mount technology component.

6. The apparatus defined in claim 5 further comprising an integrated circuit on the printed circuit board, wherein the integrated circuit comprises a power supply input and the electrical component is configured to reduce noise on the power supply input.

7. The apparatus defined in claim 6 wherein the first surface mount technology component comprises a resistor, the second surface mount technology component comprises a capacitor, and the third surface mount technology component comprises a capacitor.

8. The apparatus defined in claim 4 , wherein the fourth surface mount technology component comprises an inductor.

9. The apparatus defined in claim 5 , wherein the sixth component contact is soldered to the third component contact with solder, the solder is interposed between the third component contact and the sixth component contact, and the solder, the third component contact, and the sixth component contact are vertically overlapping.

10. The apparatus defined in claim 9 , wherein the seventh component contact is soldered to the sixth component contact with additional solder.

11. The apparatus defined in claim 10 , wherein the additional solder is interposed between the sixth component contact and the seventh component contact and the additional solder, sixth component contact, and seventh component contact are not vertically overlapping.

12. The apparatus defined in claim 1 , wherein the first surface mount technology component is interposed between the printed circuit board and the third and fourth surface mount technology components.

13. The apparatus defined in claim 12 , wherein the second surface mount technology component is interposed between the printed circuit board and the third and fourth surface mount technology components.

14. The apparatus defined in claim 13 , wherein the first and second surface mount technology components are laterally adjacent to each other on the printed circuit board.

Assignees

• Apple Inc

Inventors

• Li Xingqun
• Ribas Carlos
• Pyper Dennis R
• Foster James H
• Fisher Jr Joseph R
• Mullins Scott P
• Mayo Sean A
• Chen Wyeman

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W70/682

  comprising holes having chips therein · CPC title

• H01L2924/15311

  Electricity · mapped topic

• H05K1/0233

  Filters, inductors or a magnetic substance · CPC title