Magnetic sensor having a recessed die pad

US9741924B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9741924-B2
Application numberUS-201615050827-A
CountryUS
Kind codeB2
Filing dateFeb 23, 2016
Priority dateFeb 26, 2015
Publication dateAug 22, 2017
Grant dateAug 22, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A magnetic sensor has a pair of Hall elements formed in spaced-apart relationship on a front surface of a semiconductor substrate. A die pad is bonded to a back surface of the semiconductor substrate and overlaps the Hall elements. The die pad has formed therein a magnetic converging plate holder having a recessed portion, and a magnetic converging plate having the same shape and size as the recessed portion is fitted in the recessed portion of the magnetic converging plate holder.

First claim

Opening claim text (preview).

What is claimed is: 1. A magnetic sensor, comprising: a semiconductor substrate; a pair of Hall elements formed on a surface of the semiconductor substrate so as to be separated from each other by a separation region; a protective film formed on the semiconductor substrate so as to cover the pair of Hall elements; a die pad bonded to a back surface of the semiconductor substrate so as to overlap the separation region and each of the Hall elements of the pair of Hall elements, the die pad having a magnetic converging plate holder having a recessed portion between the die pad and the back surface; and a magnetic converging plate having the same shape as, and fitted in, the recessed portion of the magnetic converging plate holder. 2. A magnetic sensor according to claim 1 , wherein the magnetic converging plate comprises a soft magnetic material subjected to high-temperature annealing of from 800° C. to 1,200° C. 3. A magnetic sensor according to claim 1 , wherein the magnetic converging plate has, at at least one point of an outer periphery of the magnetic converging plate, one of a recessed portion and a protruded portion for magnetic converging plate rotation direction position adjustment. 4. A magnetic sensor according to claim 3 , wherein the magnetic converging plate holder has one of a protruded portion and a recessed portion formed into the same shape as a shape of the one of the recessed portion and the protruded portion for magnetic converging plate rotation direction position adjustment formed in the magnetic converging plate. 5. A magnetic sensor according to claim 3 , wherein the one of the recessed portion and the protruded portion for magnetic converging plate rotation direction position adjustment represents a direction of magnetic anisotropy of the magnetic converging plate.

Assignees

Inventors

Classifications

  • Detachable holders for supporting packaged chips in operation · CPC title

  • Organic materials · CPC title

  • Ceramics or glasses · CPC title

  • Shapes or dispositions thereof · CPC title

  • Electricity · mapped topic

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What does patent US9741924B2 cover?
A magnetic sensor has a pair of Hall elements formed in spaced-apart relationship on a front surface of a semiconductor substrate. A die pad is bonded to a back surface of the semiconductor substrate and overlaps the Hall elements. The die pad has formed therein a magnetic converging plate holder having a recessed portion, and a magnetic converging plate having the same shape and size as the re…
Who is the assignee on this patent?
Sii Semiconductor Corp
What technology area does this patent fall under?
Primary CPC classification G01R33/0052. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 22 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).