Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
US9741700B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9741700-B2 |
| Application number | US-201614997359-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 15, 2016 |
| Priority date | Mar 23, 2015 |
| Publication date | Aug 22, 2017 |
| Grant date | Aug 22, 2017 |
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The present disclosure provides a lighting device comprising: a reflective element layer; an optical resin layer formed on the reflective element layer; a transparent electrode film layer formed on the optical resin layer; and a plurality of light-emitting units formed on the lower surface of the transparent electrode film layer. The lighting device allows the fundamental cause of the hot spot phenomenon to be eliminated, shows excellent luminous efficiency by efficiently performing the function of a surface light source, and enables the kinds of raw materials and the number of production processes to be reduced by eliminating the use of a PCB board and selectively applying second reflective patterns.
Opening claim text (preview).
What is claimed is: 1. A laminated device for surface lighting, the device comprising: a reflective resin layer comprising a reflective surface; an optical resin layer formed over the reflective resin layer; a transparent electrode film layer formed over the optical resin layer and comprising a lower surface opposing the reflective surface; and a chip-on-film (COF) structure formed on the lower surface of the transparent electrode film layer, the COF structure comprising an array of a plurality of light-emitting units, each of which comprises a base and an LED, the base comprising a concave surface facing the reflective surface, the LED positioned in a central area of the concave surface of the base, wherein the LED of each light emitting unit is configured to emit light beams such that the light beams emitted from the LED are directed to the reflective surface and redirected to outside the surface lighting device via the optical resin layer and the transparent electrode film layer after reflection on the reflective surface, wherein the laminated device does not comprise a PCB formed underneath the reflective resin layer. 2. The device of claim 1 , wherein the reflective resin layer comprises a resin matrix and a white pigment dispersed in the resin matrix. 3. The device of claim 2 , wherein the resin matrix comprises at least one of polyethylene terephthalate resins, polyethylene naphthalate resins, acrylic resins, polycarbonate resins, polystyrene resins, polyolefin resins, and cellulose acetate resins. 4. The device of claim 2 , wherein the white pigment comprises at least one of titanium oxide, aluminum oxide, zinc oxide, lead carbonate, barium sulfate, silica, and calcium carbonate. 5. The device of claim 2 , further comprising first reflective patterns formed on an upper surface of the reflective resin layer. 6. The device of claim 5 , wherein the first reflective patterns are formed by printing a reflective ink containing a white pigment in a binder. 7. The device of claim 1 , wherein the optical resin layer comprise at least one of urethane acrylate resins, epoxy acrylate resins, and polyester acrylate resins. 8. The device of claim 7 , wherein the optical resin layer further comprises beads made of at least one of silicon, glass bubbles, zinc, zirconium, aluminum oxide, urethane resins, and (meth)acrylic resins. 9. The device of claim 8 , wherein the beads have voids or pores formed therein. 10. The device of claim 1 , wherein the transparent electrode film layer comprises an insulating transparent resin layer and a conductive transparent electrode layer formed on an upper surface of the insulating transparent resin layer. 11. The device of claim 10 , wherein the insulating transparent resin layer comprises at least one of polycarbonate resins, polyester resins, polyimide resins, cycloolefin resins, and copolymers thereof. 12. The device of claim 10 , wherein the conductive transparent electrode layer comprises about 60-95 wt % of polymer resins, about 4-35 wt % of an electrically conductive materials, and about 1-10 wt % of polydopamine resins. 13. The device of claim 10 , wherein the conductive transparent electrode layer further comprises at least one of palladium, platinum, aluminum, silver, copper, gold, nickel, tin, indium oxide, cobalt, indium tin oxide (ITO), antimony tin oxide (ATO), fluorine-doped tin oxide (FTO), zinc tin oxide (ZTO), metal nanowires, carbon nanotubes (CNTs), and graphene. 14. The device of claim 1 , wherein the transparent electrode film layer has a surface resistivity of about 0.01-100 Ω/square as measured in accordance with ASTM D257, and a transparency of about 80% or more as measured in accordance with ASTM D1003, and an average thickness of about 10-200 μm. 15. The device of claim 1 , further comprising second reflective patterns for shielding or reflecting light, formed on an upper surface of the transparent electrode film layer.
Package configurations · CPC title
characterised by their material, surface treatment or coatings · CPC title
Light-emitting diodes [LED] · CPC title
Light emitting diodes [LED] · CPC title
Attachment of light sources or lamp holders · CPC title
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