Printing system architecture for encoding chip-less RFID tags in real time

Patent metadata

Field	Value
Publication number	US-9740975-B2
Application number	US-201514733536-A
Country	US
Kind code	B2
Filing date	Jun 8, 2015
Priority date	Jun 8, 2015
Publication date	Aug 22, 2017
Grant date	Aug 22, 2017

Abstract

Provided is a method for encoding chipless RFID tags in real-time. The method includes exposing a chipless RFID transponder to a conductive material, the RFID transponder comprising an antenna and a plurality of resonant structures, the plurality of resonant structures together defining a first spectral signature. Each of the plurality of resonant structures includes a respective one of a frequency domain. The method also includes depositing a conductive material on at least one of the resonant structures to short the at least one of the resonant structures. The remainder of the plurality of resonant structures that are not shorted by the conductive material define a second spectral signature for the RFID transponder.

First claim

What is claimed is:

1. A method for encoding chipless RFID tags in real-time, comprising:
exposing a chipless RFID transponder to a conductive material, the RFID transponder comprising
an antenna and a plurality of resonant structures that together define a first spectral signature, wherein each of the plurality of resonant structures comprises a respective one of a frequency domain;

wherein the exposing comprises depositing the conductive material on at least one of the resonant structures to short the at least one of the resonant structures,
wherein the remainder of the plurality of resonant structures not shorted by the conductive material define a second spectral signature for the RFID transponder, and
wherein the conductive material comprises conductive ink, and the depositing comprises ejecting the conductive ink from an inkjet printhead onto the at least one resonant structure.

2. The method of claim 1 , wherein depositing the conductive material on the at least one of the resonant structures changes the first spectral signature of the RFID transponder.

3. The method of claim 1 , wherein the at least one of the resonant structures on which the conductive material is deposited comprises an etched structure.

4. The method of claim 1 , wherein the depositing comprises applying the conductive material in a predetermined pattern.

5. The method of claim 1 , wherein depositing the conductive material comprises completely covering the at least one of the resonant structures with the conductive material.

6. The method of claim 1 , wherein the conductive material deposited on the at least one of the resonant structures shifts a natural frequency of the at least one of the resonant structures.

7. The method of claim 6 , wherein the conductive material deposited on the at least one of the resonant structures shifts the natural frequency to a frequency outside of microwave detection.

8. The method of claim 1 , wherein after depositing the conductive material, the at least one resonant structure has no electromagnetic resonance.

9. The method of claim 1 , wherein after the depositing the conductive material the at least one resonant structure does not contribute to the second spectral signature.

10. The method of claim 1 , further comprising removing portions of the at least one resonant structure.

11. The method of claim 1 , further comprising: after depositing the conductive material, removing portions of the at least one resonant structure on which the conductive material was not deposited.

12. The method of claim 1 , further comprising laser ablating a portion of the at least one resonant structure.

13. The method of claim 1 , further comprising: after depositing the conductive material, laser ablating at least one of the plurality of resonant structures.

14. The method of claim 1 , wherein the first spectral signature comprises a first absorbance range for interrogating pulses and the second spectral signature comprises a second absorbance range for the interrogating pulses.

15. The method of claim 1 , wherein the RFID transponder comprises a chipless RFID tag.

16. The method of claim 1 , further comprising patterning a conductive film to form the at least one resonant structure.

17. The method of claim 1 , wherein the providing comprises forming the plurality of resonant structures.

18. The method of claim 17 , wherein the forming comprises lithographically etching at least one resonant structure into a conductive film.

19. The method of claim 17 , wherein the conductive material comprises a conductive ink comprising particles dispersed in a carrier and wherein the particles comprise at least one material selected from copper or aluminum.

20. A method for customizing a generic RFID transponder, comprising:
changing a resonance of at least one resonant structure of the RFID transponder by exposing the at least one resonant structure to a conductive material,
wherein the exposing comprises depositing the conductive material on the at least one resonant structure via inkjet printing; and
after depositing the conductive material, removing portions of the at least one resonant structure on which the conductive material was not deposited,
wherein the resonant structure is electrically shorted such that its resonance shifts from a first resonance to a second resonance.

21. The method of claim 20 , wherein the first resonance comprises a natural resonance of the at least one resonant structure of the generic RFID transponder.

22. The method of claim 20 , wherein the at least one resonant structure comprises a continuous segment of electrically connected material and wherein the electrically shorting results from the depositing the conductive material to form an electrical pathway between a first portion of the continuous segment and a second portion of the continuous segment.

23. The method of claim 20 , wherein the conductive material comprises a conductive ink comprising particles dispersed in a carrier and wherein the particles comprise at least one material selected from copper or aluminum.

Assignees

• Xerox Corp

Inventors

• Gibson George A
• Buchar Wayne A

Classifications

• H05K2203/13

  Moulding and encapsulation; Deposition techniques; Protective layers · CPC title

• H05K3/125

  by ink-jet printing · CPC title

• H05K3/1241

  by ink-jet printing or drawing by dispensing · CPC title

• H05K3/12

  using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} · CPC title

• H05K1/097

  Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence) · CPC title