Shielded photonic integrated circuit

Patent metadata

Field	Value
Publication number	US-9739938-B2
Application number	US-201514963842-A
Country	US
Kind code	B2
Filing date	Dec 9, 2015
Priority date	Dec 9, 2015
Publication date	Aug 22, 2017
Grant date	Aug 22, 2017

Abstract

A light shield may be formed in photonic integrated circuit between integrated optical devices of the photonic integrated circuit. The light shield may be built by using materials already present in the photonic integrated circuit, for example the light shield may include metal walls and doped semiconductor regions. Light-emitting or light-sensitive integrated optical devices or modules of a photonic integrated circuit may be constructed with light shields integrally built in.

First claim

What is claimed is:

1. A photonic integrated circuit comprising:
a substrate;
first and second integrated optical devices over the substrate; and
a light shield structure between the first and second integrated optical devices, the light shield structure comprising an opaque structure configured to suppress optical crosstalk between the first and second integrated optical devices;
wherein the light shield structure comprises a Bragg structure for out-coupling stray light; and
wherein the Bragg structure comprises a plurality of concentric walls surrounding the first integrated optical device.

2. The photonic integrated circuit of claim 1 , wherein the light shield structure comprises a metal structure.

3. The photonic integrated circuit of claim 2 , wherein the metal structure is not coplanar with the first integrated optical device.

4. The photonic integrated circuit of claim 3 , wherein the metal structure is farther away from the substrate than the first integrated optical device.

5. The photonic integrated circuit of claim 2 , wherein the first integrated optical device comprises a photodetector.

6. The photonic integrated circuit of claim 1 , wherein the opaque structure comprises a semiconductor.

7. The photonic integrated circuit of claim 1 , wherein the opaque structure comprises an optically absorbing material.

8. The photonic integrated circuit of claim 1 , wherein the first or the second integrated optical device is bonded to the substrate.

9. The photonic integrated circuit of claim 1 , wherein the first or the second integrated optical device is monolithically fabricated on the substrate.

10. The photonic integrated circuit of claim 1 , wherein the first integrated optical device comprises a waveguide Y-junction.

11. The photonic integrated circuit of claim 1 , wherein the first integrated optical device comprises a light-emitting device.

12. The photonic integrated circuit of claim 11 , wherein the second integrated optical device comprises a receiver.

13. The photonic integrated circuit of claim 11 , wherein the light emitting device comprises a semiconductor laser or a semiconductor optical amplifier chip.

14. The photonic integrated circuit of claim 1 , wherein the substrate is selected from the group consisting of Si, GaAs, and InP.

15. The photonic integrated circuit of claim 1 , wherein the first or second optical device is comprised of a material selected from the group consisting of Si, SiO 2 , doped glass, SiON, SiN, InP, GaAs, AlGaAs, InGaAsP, InGaP, InAlAs, and InGaAlAs.

Assignees

• Coriant Advanced Tech Llc
• Elenion Tech Llc

Inventors

• Shi Ruizhi
• Liu Yang
• Novack Ari
• Ma Yangjin
• Padmaraju Kishore
• Hochberg Michael J

Classifications

• G02B6/122

  Basic optical elements, e.g. light-guiding paths · CPC title

• G02B6/4277 Primary

  Protection against electromagnetic interference [EMI], e.g. shielding means (shielding of electric apparatus H05K9/00, of instruments G12B17/00) · CPC title

• G02B2006/12107

  Grating · CPC title

• G02B2006/12157

  Isolator · CPC title

• G02B6/12004 Primary

  Combinations of two or more optical elements · CPC title