Method and apparatus for inspecting workpieces

US9739606B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9739606-B2
Application numberUS-201214236799-A
CountryUS
Kind codeB2
Filing dateAug 9, 2012
Priority dateAug 9, 2011
Publication dateAug 22, 2017
Grant dateAug 22, 2017

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A series of nominally identical production workpieces is measured on a measuring apparatus. To correct for temperature variations, one of the workpieces forms a master artifact, the dimensions of which are known. The artifact is measured on the measuring apparatus at two or more temperatures, producing two or more corresponding sets of measured dimensional values of the master artifact at the respective temperatures. One or more error maps, look-up tables, or functions are generated which relate the measured dimensional values of the artifact to the known dimensions of the artifact. The error map(s), look-up table(s) or function(s) are dependent on the respective temperatures at which the artifact was measured. Correction values derived from the error map(s), look-up table(s) or function(s) are used to correct the measurements of production workpieces in the series. These correction values are determined in dependence upon the temperature at which the workpiece measurements were obtained.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of measurement on measuring apparatus, comprising: providing a master artefact in the form of a reference workpiece which is one of a series of nominally identical workpieces to be measured, the master artefact having dimensions which are known from a source which is external to said measuring apparatus, measuring the master artefact on said apparatus at two or more temperatures, and producing two or more corresponding sets of measured dimensional values of the master artefact at the respective temperatures, measuring said temperatures at which the master artefact was measured, generating one or more error maps or look-up tables or functions which relate the measured dimensional values of the master artefact to the known dimensions of the master artefact, the or each error map, look-up table or function being dependent on said respective temperatures at which the master artefact was measured. 2. A method of measurement according to claim 1 , wherein one error map or lookup table or function relates the measured dimensional values of the master artefact to the known dimensions of the master artefact at a plurality of the respective temperatures. 3. A method of measurement according to claim 1 , wherein respective error maps or lookup tables or functions relate the measured dimensional values of the master artefact to the known dimensions of the master artefact at respective said temperatures. 4. A method of measurement according to claim 1 , further comprising: measuring a production workpiece on said apparatus to obtain measured workpiece dimensional values, and measuring the temperature at which the workpiece dimensional values were obtained, and correcting the workpiece dimensional values with correction values derived from a said error map, look-up table or function, wherein the correction values are determined in dependence upon the temperature at which the workpiece dimensional values were obtained. 5. A method according to claim 1 , wherein the measuring apparatus has not been calibrated to traceable standards. 6. A method according to claim 1 , wherein the measuring apparatus has been calibrated to traceable standards. 7. A method according to claim 1 , wherein the known master artefact dimensions are obtained by calibrating the master artefact. 8. A method according to claim 7 , wherein the master artefact is calibrated on a separate measuring system which is certified as an absolute measuring system. 9. A method according to claim 1 , wherein the known dimensions of the workpiece forming the master artefact are obtained from design data for the workpiece. 10. A method according to claim 1 , wherein the measured dimensional values are coordinate measurements of individual points on the surface of the artefact or workpiece. 11. A method according to claim 1 , wherein the measured dimensional values are measured dimensions of features of the artefact or workpiece. 12. A method according to claim 1 , wherein the measured dimensional values are dimensional relationships between features of the artefact or workpiece. 13. A method according to claim 1 , wherein the measuring apparatus is a coordinate measuring apparatus. 14. A method according to claim 13 , wherein the coordinate measuring apparatus comprises a probe mounted for rotation about one or two axes. 15. A method according to claim 1 , wherein the measuring apparatus comprises a contact probe. 16. A method according to claim 1 , wherein the measuring apparatus comprises a non-contact probe. 17. A method of measurement on measuring apparatus, comprising: providing a master artefact in the form of a reference workpiece having dimensions which are known from a source which is external to said measuring apparatus, measuring the reference workpiece on said apparatus at a first temperature, and producing a resulting first set of measured dimensional values of the reference workpiece at the first temperature, generating at least one error map or look-up table or function which relates the measured dimensional values of the reference workpiece at the first temperature to the known dimensions of the reference workpiece, measuring a production workpiece on said apparatus to obtain measured workpiece dimensional values, and measuring the temperature at which the workpiece dimensional values were obtained, and correcting the workpiece dimensional values with correction values derived from the error map, look-up table or function, wherein the correction values are determined in dependence upon the temperature at which the workpiece dimensional values were obtained. 18. A method according to claim 17 , including checking whether the temperature at which a production workpiece is measured or is to be measured corresponds to the temperature of a said error map or lookup table or function, to within a predetermined tolerance, and if so then correcting the workpiece dimensional values with correction values derived from the corresponding error map or lookup table or function. 19. A method according to claim 17 , including checking whether the temperature at which a production workpiece is measured or is to be measured corresponds to the temperature of a said error map or lookup table or function, to within a predetermined tolerance, and if not then remeasuring the master artefact and producing a further set of measured dimensional values of the master artefact at the respective temperature. 20. A method according to claim 17 , wherein the production workpiece is one of a series of nominally identical workpieces. 21. A method of measurement according to claim 17 , wherein the correction values are derived by extrapolation or interpolation from the one or more error maps, look-up tables or functions, in dependence upon the temperature at which the workpiece dimensional values were obtained. 22. A method according to claim 21 , wherein the correction values are derived by interpolation using a function which is derived from two or more error maps or lookup tables. 23. A measuring apparatus comprising: a measuring device configured (i) to measure a master artefact on the apparatus at a first temperature and (ii) to produce a resulting first set of measured dimensional values of the master artefact at the first temperature, the master artefact being in the form of a reference workpiece having dimensions which are known from a source which is external to the apparatus; a temperature measuring device configured to measure the temperature at which the master artefact was measured; and a computer control configured to generate one or more error maps or look-up tables or functions which relate the measured dimensional values of the master artefact at the first temperature to the known dimensions of the master artefact, wherein the or each error map, look-up table or function is dependent on the temperature at which the master artefact was measured. 24. A non-transitory computer-readable medium storing a software program for a measuring apparatus, the program being configured to cause the apparatus to perform the following: measuring a master artefact on said apparatus at a first temperature, and producing a resulting first set of measured dimensional values of the master artefact at the first temperature, wherein the master artefact is in the form of a reference workpiece having dimensions which are known from a source which is external to said measuring

Assignees

Inventors

Classifications

  • due to temperature (on machine tools B23Q11/0003) · CPC title

  • G01B21/042Primary

    Calibration or calibration artifacts (G01B3/30, G01B9/02072 take precedence) · CPC title

  • G01B21/045Primary

    Correction of measurements (G01B9/02055 takes precedence) · CPC title

  • using coordinate measuring machines · CPC title

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What does patent US9739606B2 cover?
A series of nominally identical production workpieces is measured on a measuring apparatus. To correct for temperature variations, one of the workpieces forms a master artifact, the dimensions of which are known. The artifact is measured on the measuring apparatus at two or more temperatures, producing two or more corresponding sets of measured dimensional values of the master artifact at the r…
Who is the assignee on this patent?
Jonas Kevyn Barry, Somerville Leo Christopher, Renishaw Plc
What technology area does this patent fall under?
Primary CPC classification G01B21/042. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 22 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).