Treatment of filaments or yarn

US9739008B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9739008-B2
Application numberUS-201514662275-A
CountryUS
Kind codeB2
Filing dateMar 19, 2015
Priority dateNov 9, 2012
Publication dateAug 22, 2017
Grant dateAug 22, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for treating an aromatic polyamide filament or yarn to improve its adhesion to rubber wherein, the method comprises exposing the filament or yarn to a first mixture of reagents comprising multi-functional isocyanate oligomers and multi-functional epoxy oligomers, wherein the ratio of total isocyanate groups to total epoxy groups in the mixture is in the range of from 0.8 to 1.2, and heating the exposed filament or yarn to a temperature of at least 100 degrees C. whereby the epoxy and isocyanate oligomers cross-link and form a network on the surface of the filament or yarn.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for treating a filament or yarn comprising: (a) exposing the filament or yarn to a first mixture of reagents comprising first multi-functional isocyanate oligomers and first multi-functional epoxy oligomers, wherein the ratio of total isocyanate groups to total epoxy groups in the first mixture is in the range of from 0.8 to 1.2, (b) heating the exposed filament or yarn at a temperature of at least 100 degrees C. whereby the first epoxy oligomers and first isocyanate oligomers crosslink and form a network on the surface of the filament or yarn, (c) exposing this treated filament or yarn to a second mixture of reagents comprising second multi-functional isocyanate oligomers and second multi-functional epoxy oligomers wherein the ratio of total isocyanate groups to total epoxy groups in the second mixture is in the range of from 0.8 to 1.2, and (d) heating the exposed filament or yarn of at a temperature of at least 100 degrees C. whereby the second epoxy oligomers and the second isocyanate oligomers crosslink and form a network on the outer surface of the network formed by the first epoxy and first isocyanate oligomers, with the proviso that double bonds present in the second epoxy and second isocyanate oligomers do not participate in the crosslinking reaction, wherein the first and second multi-functional isocyanate oligomers of the first and second mixtures are different. 2. A method for treating a filament or yarn comprising: (a) exposing the filament or yarn to a first mixture of reagents comprising first multi-functional isocyanate oligomers and first multi-functional epoxy oligomers, wherein the ratio of total isocyanate groups to total epoxy groups in the first mixture is in the range of from 0.8 to 1.2, (b) heating the exposed filament or yarn at a temperature of at least 100 degrees C. whereby the first epoxy oligomers and first isocyanate oligomers crosslink and form a network on the surface of the filament or yarn, (c) exposing this treated filament or yarn to a second mixture of reagents comprising second multi-functional isocyanate oligomers and second multi-functional epoxy oligomers wherein the ratio of total isocyanate groups to total epoxy groups in the second mixture is in the range of from 0.8 to 1.2, and (d) heating the exposed filament or yarn at a temperature of at least 100 degrees C. whereby the second epoxy oligomers and the second isocyanate oligomers crosslink and form a network on the outer surface of the network formed by the first epoxy and first isocyanate oligomers, with the proviso that double bonds present in the second epoxy and second isocyanate oligomers do not participate in the crosslinking reaction, wherein the first and second epoxy oligomers of the first and second mixtures are different. 3. A method for bonding a filament or yarn to un-cured rubber, the method comprising (i) forming a treated filament or yarn by the method of claim 1 or 2 , and (ii) heating the treated filament or yarn in the presence of un-cured rubber whereby the networks of double bonds on the surface of the filament or yarn co-cure into the rubber matrix. 4. The method of claim 1 wherein the first and second multi-functional isocyanate oligomers contain two or more isocyanate functional groups. 5. The method of claim 2 wherein the first and second multi-functional epoxy oligomers contain two or more epoxide rings. 6. The method of claim 1 or 2 wherein the filament or yarn is synthetic and is selected from the group consisting of an aromatic polyamide, an aromatic copolyamide, an aliphatic polyamide and polyester. 7. The method of claim 6 wherein the aromatic polyamide is para-aramid. 8. The method of claim 1 or 2 wherein the filament or yarn is natural and is selected from the group consisting of cotton or cellulose. 9. The method of claim 1 or 2 wherein the filament or yarn is in a form selected from the group consisting of a cord and a fabric.

Assignees

Inventors

Classifications

  • Two layers · CPC title

  • with natural or synthetic rubber, or derivatives thereof · CPC title

  • Cooling; Steaming or heating, e.g. in fluidised beds; with molten metals · CPC title

  • in the substrate · CPC title

  • involving heating of the applied adhesive · CPC title

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Frequently asked questions

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What does patent US9739008B2 cover?
A method for treating an aromatic polyamide filament or yarn to improve its adhesion to rubber wherein, the method comprises exposing the filament or yarn to a first mixture of reagents comprising multi-functional isocyanate oligomers and multi-functional epoxy oligomers, wherein the ratio of total isocyanate groups to total epoxy groups in the mixture is in the range of from 0.8 to 1.2, and he…
Who is the assignee on this patent?
Du Pont
What technology area does this patent fall under?
Primary CPC classification C09J5/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 22 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).