Composition for forming silica-based insulating layer, method for preparing composition for forming silica-based insulating layer, silica-based insulating layer, and method for manufacturing silica-based insulating layer

Patent metadata

Field	Value
Publication number	US-9738787-B2
Application number	US-201314432401-A
Country	US
Kind code	B2
Filing date	Aug 16, 2013
Priority date	Dec 27, 2012
Publication date	Aug 22, 2017
Grant date	Aug 22, 2017

Abstract

Disclosed is a composition for a silica-based insulation layer including hydrogenated polysilazane or hydrogenated polysiloxzane, wherein a concentration of a cyclic compound having a weight average molecular weight of less than 400 is less than or equal to 1,200 ppm. The composition for a silica-based insulation layer may reduce a thickness distribution during formation of a silica-based insulation layer, and thereby film defects after chemical mechanical polishing (CMP) during a semiconductor manufacturing process may be reduced.

First claim

What is claimed is:

1. A composition for a silica-based insulation layer, the composition comprising:
a hydrogenated polysilazane or a hydrogenated polysiloxazane,
wherein a concentration of a cyclic compound having a weight average molecular weight of less than 400 in the composition is less than or equal to 1200 ppm.

2. The composition for a silica-based insulation layer of claim 1 , wherein the cyclic compound is selected from cyclic hydrogenated silazane, cyclic hydrogenated siloxazane, and a mixture thereof.

3. The composition for a silica-based insulation layer of claim 1 , wherein the cyclic compound is a compound having a structure selected from one of the following Chemical Formulae 1a to 1f:

4. The composition for a silica-based insulation layer of claim 1 , wherein the hydrogenated polysilazane or the hydrogenated polysiloxazane has a weight average molecular weight of 1,000 to 7,000.

5. The composition for a silica-based insulation layer of claim 1 , wherein a content of the hydrogenated polysilazane or the hydrogenated polysiloxazane in the composition ranges from 0.1 to 50 wt %, based on a total weight of the composition.

6. A method of manufacturing the composition of claim 1 for a silica-based insulation layer, the method comprising:
coammonolyzing a halosilane compound to prepare a solution that includes a hydrogenated polysilazane or a hydrogenated polysiloxazane; and
substituting a solvent of the solution with a solvent that includes an aromatic hydrocarbon or ether, at 60 to 110° C.

7. A silica-based insulation layer manufactured using the composition for a silica-based insulation layer comprising the hydrogenated polysiloxazane as claimed in claim 1 by:
applying the composition for a silica-based insulation layer on a substrate;
drying the substrate applied with the composition for a silica-based insulation layer; and
curing the resultant under an atmosphere comprising water vapor at a temperature of greater than or equal to 200° C.

8. The silica-based insulation layer of claim 7 , wherein the silica-based insulation layer has a thickness distribution range of less than or equal to 120 nm.

9. A method of manufacturing a silica-based insulation layer, comprising:
applying the above-described composition for a silica-based insulation layer as claimed in claim 1 , on a substrate;
drying the substrate applied with the composition for a silica-based insulation layer; and
curing the resultant under an atmosphere comprising a water vapor at a temperature of of greater than or equal to 200° C.

Assignees

• Cheil Ind Inc
• Cheil Ind Inc

Inventors

• Yun Hui-Chan
• Kwak Taek-Soo
• Kim Mi-Young
• Lim Sang-Hak
• Han Kwen-Woo
• Kim Go-Un
• Kim Bong-Hwan
• Kim Sang-Kyun
• Na Yoong-Hee
• Park Eun-Su
• Bae Jin-Hee
• Song Hyun-Ji
• Lee Han-Song
• Hong Seung-Hee

Classifications

• H10P14/69215

  the material being a silicon oxide, e.g. SiO2 · CPC title

• H10P14/6922

  the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC · CPC title

• H10P14/6689

  the compound being a silazane · CPC title

• H10P14/6687

  the compound comprising silicon and nitrogen · CPC title

• H10P14/6686

  the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane · CPC title