Point of sale envelopes and methods of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9738419-B2
Application number	US-201313836771-A
Country	US
Kind code	B2
Filing date	Mar 15, 2013
Priority date	Mar 15, 2013
Publication date	Aug 22, 2017
Grant date	Aug 22, 2017

Abstract

Point of sale envelopes and methods of producing the same are disclosed herein. An example method includes moving a substrate in a direction. The substrate includes a first side opposite a second side. The method includes applying adhesive to the second side of a first portion and a second portion of a first panel of the substrate. The first portion is spaced apart from the second portion. The method includes folding the first panel about a first fold line to couple the first panel to a second panel of the substrate and forming an opening to a pocket in the first panel. The pocket is defined by the second panel and a third portion of the first panel. The third portion is positioned between the first and second portions.

First claim

What is claimed is:

1. A method, comprising:
moving a substrate in a direction, the substrate comprising a first side opposite a second side;
applying adhesive to a first portion of the second side of a first panel of the substrate and a second portion of the first panel of the substrate, the first portion being spaced apart from the second portion;
folding the first panel about a first fold line to couple the first panel to a second panel of the substrate; and
forming an opening to a pocket in the first panel or the second panel via a slit, opposing edges of the slit being immediately adjacent one another after the slit is formed, the pocket being formed by the second panel and a third portion of the first panel, the third portion positioned between the first and second portions.

2. The method of claim 1 , further comprising applying adhesive to the second side of a third panel of the substrate, the second panel positioned between the first panel and the third panel.

3. The method of claim 2 , further comprising folding the third panel about a second fold line to couple the third panel to the first panel.

4. The method of claim 2 , wherein the first panel, the second panel, and the third panel are approximately the same size.

5. The method of claim 2 , wherein folding the first panel about the first fold line to couple the first panel to the second panel includes coupling the second side of the first panel to the second side of the second panel, further including folding the third panel about the second fold line to couple the second side of the third panel to the first side of the second panel via the adhesive on the second side of the third panel.

6. The method of claim 5 , wherein the third panel is sized to entirely cover the first panel when the third panel is coupled to the first panel.

7. The method of claim 6 , wherein the first panel is positioned entirely between the second panel and the third panel.

8. The method of claim 2 , wherein the second side of the third panel is entirely covered with the adhesive.

9. The method of claim 1 , further comprising forming a line of weakness in the substrate, the line of weakness being substantially parallel to the direction.

10. The method of claim 9 , wherein the line of weakness comprises a score.

11. The method of claim 1 , further comprising forming a card-shaped line of weakness in the second panel.

12. The method of claim 11 , further comprising removing a portion of the first portion to correspond to the card-shaped line of weakness.

13. The method of claim 11 , wherein the card-shaped line of weakness is spaced from the opening.

14. The method of claim 11 , wherein the second panel includes a fourth portion and a fifth portion, the slit separating the fourth and fifth portions, the fourth portion similarly sized to the fifth portion.

15. The method of claim 14 , wherein the fourth portion defines the pocket and the fifth portion includes the card-shaped line of weakness.

16. The method of claim 11 , further comprising applying a release coating over a portion of the adhesive on the first portion, the portion corresponding in shape and size to the card-shaped line of weakness, the portion to be positioned immediately adjacent the card-shaped line of weakness when the first and second panels are coupled.

17. The method of claim 1 , wherein the third portion includes two intersecting sides free of lines of weakness to enable access to the pocket.

18. The method of claim 1 , wherein the third portion is approximately half the size of the first panel.

19. The method of claim 1 , wherein the slit is formed in the second panel.

20. The method of claim 1 , wherein a fourth portion of the second panel defines the pocket, the third portion being similarly sized to the fourth portion.

21. The method of claim 1 , wherein an interaction between the adhesive on the first portion forms a bottom of the pocket, the first fold line forms a first side edge of the pocket, and the second fold line forms a second side edge of the pocket based on the adhesive on the third panel adhering to the first panel.

22. The method of claim 1 , wherein the slit is formed without substantially removing any portion of the substrate.

Assignees

• Donnelley & Sons Co
• Donnelley & Sons Co

Inventors

• Reinholtz Judith L

Classifications

• B31B2219/9038

  Operations & Transport · mapped topic

• B65D27/14 Primary

  using adhesive applied to integral parts, e.g. flaps · CPC title

• B65D27/08

  with two or more compartments · CPC title

• B31B21/00

  Operations & Transport · mapped topic

• B31B2160/102

  obtained from essentially rectangular sheets · CPC title