Manufacturing method of liquid ejection head

Patent metadata

Field	Value
Publication number	US-9738076-B2
Application number	US-201214348023-A
Country	US
Kind code	B2
Filing date	Sep 12, 2012
Priority date	Sep 29, 2011
Publication date	Aug 22, 2017
Grant date	Aug 22, 2017

Abstract

A manufacturing method of a liquid ejection head, which includes a step of preparing a substrate including a first layer, a step of forming a flow path mold for forming the flow path and a member located outside the mold with a gap between the mold and the member from the first layer, a step of providing a second layer so that the second layer fills the gap and covers the mold and the member located outside the mold with the gap between them, a step of forming an ejection orifice forming member for forming an ejection orifice from the second layer, a step of removing the member located outside the mold with the gap between them, and a step of forming a wall member located outside the ejection orifice forming member with at least a partial gap between the ejection orifice forming member and the wall member.

First claim

The invention claimed is:

1. A manufacturing method of a liquid ejection head including a flow path connected to an ejection orifice that ejects liquid, the manufacturing method comprising:
a step of preparing a substrate including a first layer;
a step of forming a flow path mold for forming the flow path and a member, from the first layer, the member is not part of the flow path mold and is located outside the flow path mold with a gap between the flow path mold and the member;
a step of providing a second layer so that the gap is filled with the second layer, the second layer covers the flow path mold and the member located outside the flow path mold with the gap between the flow path mold and the member;
a step of forming an ejection orifice forming member for forming an ejection orifice from the second layer;
a step of removing the second layer on the member;
a step of removing the member located outside the flow path mold;
a step of forming a third layer so that the third layer covers the ejection orifice forming member; and
a step of forming a wall member located outside the ejection orifice forming member from the third layer, with a gap between the ejection orifice forming member and the wall member.

2. The manufacturing method of a liquid ejection head according to claim 1 , wherein the first layer includes a positive-type photosensitive resin.

3. The manufacturing method of a liquid ejection head according to claim 1 , wherein the second layer includes a negative-type photosensitive resin.

4. The manufacturing method of a liquid ejection head according to claim 1 , wherein the third layer includes a negative-type photosensitive resin.

5. The manufacturing method of a liquid ejection head according to claim 1 , wherein, in a cross section in parallel with a surface of the substrate, an area of the member is greater than an area of the flow path mold.

6. The manufacturing method of a liquid ejection head according to claim 1 , wherein, in a cross section in parallel with a surface of the substrate, an area of the member is greater than or equal to three times an area of the flow path mold and smaller than or equal to 100 times an area of the flow path mold.

7. The manufacturing method of a liquid ejection head according to claim 1 , wherein a width of the gap between the flow path mold and the member is greater than or equal to 10 micrometers and smaller than or equal to 50 micrometers.

8. The manufacturing method of a liquid ejection head according to claim 1 , wherein a width of the gap between the ejection orifice forming member and the wall member is greater than or equal to a diameter of the ejection orifice and smaller than or equal to five times the diameter of the ejection orifice.

9. The manufacturing method of a liquid ejection head according to claim 1 , wherein a liquid-repellent material is given to a surface of the second layer after the step of providing the second layer.

10. The manufacturing method of a liquid ejection head according to claim 1 , wherein an electrical circuit unit is formed between the substrate and the wall member.

11. The manufacturing method of a liquid ejection head according to claim 1 , wherein the wall member is provided with the gap between the election orifice forming member and the wall member in the entire area of the wall member.

Assignees

• Sato Tamaki
• Morisue Masafumi
• Ishikawa Tetsushi
• Yoneyama Hirono
• Canon Kk

Inventors

• Sato Tamaki
• Morisue Masafumi
• Ishikawa Tetsushi
• Yoneyama Hirono

Classifications

• B41J2/1639

  sacrificial molding · CPC title

• Y10T29/49401

  Fluid pattern dispersing device making, e.g., ink jet · CPC title

• B29C33/0083

  Electrical or fluid connection systems therefor · CPC title

• B41J2/1637

  molding · CPC title

• Y10T29/49083

  Heater type · CPC title