Systems of bonded substrates and methods for bonding substrates

Patent metadata

Field	Value
Publication number	US-9738056-B2
Application number	US-201514862564-A
Country	US
Kind code	B2
Filing date	Sep 23, 2015
Priority date	Sep 23, 2015
Publication date	Aug 22, 2017
Grant date	Aug 22, 2017

Abstract

In one embodiment, a system of bonded substrates may include a first substrate, a second substrate, and a composite bonding layer positioned between the first substrate and the second substrate. The composite boding layer may include an interior bond region, an exterior bond region, and a metal matrix. The material of the interior bond region may have a greater elastic modulus than the material of the exterior bond region. A portion of the metal matrix may be in the interior bond region and a portion of the metal matrix may be in the exterior bond region. The composite bonding layer may also include a plurality of soft material members positioned in the portion of the metal matrix in the exterior bond region, or a plurality of hard material members positioned in the portion of the metal matrix in the interior bond region, or both.

First claim

What is claimed is:

1. A system of bonded substrates, the system comprising:
a first substrate comprising a bonding surface;
a second substrate comprising a complementary bonding surface; and
a composite bonding layer positioned between the first substrate and the second substrate and in contact with the bonding surface of the first substrate and the complementary bonding surface of the second substrate, the composite boding layer comprising:
an interior bond region;
an exterior bond region positioned around the interior bond region and defining an outer surface of the composite bonding layer, the material of the interior bond region having a greater elastic modulus than the material of the exterior bond region;
a metal matrix, wherein a portion of the metal matrix is in the interior bond region and a portion of the metal matrix is in the exterior bond region; and
a plurality of soft material members positioned in the portion of the metal matrix in the exterior bond region, or a plurality of hard material members positioned in the portion of the metal matrix in the interior bond region, or both, wherein the soft material members have an elastic modulus less than the elastic modulus of the metal matrix and the hard material members have an elastic modulus greater than the elastic modulus of the metal matrix.

2. The system of claim 1 , wherein the plurality of soft material members is positioned in the portion of the metal matrix in the exterior bond region.

3. The system of claim 1 , wherein the plurality of hard material members is positioned in the portion of the metal matrix in the interior bond region.

4. The system of claim 1 , wherein:
the plurality of soft material members is positioned in the portion of the metal matrix in the exterior bond region; and
the plurality of hard material members is positioned in the portion of the metal matrix in the interior bond region.

5. The system of claim 1 , wherein the material of the interior bond region has an elastic modulus at least about 10% greater than the material of the exterior bond region.

6. The system of claim 1 , wherein the interior bond region may comprises greater than or equal to about 10% by volume of the composite bonding layer.

7. The system of claim 1 , wherein the soft material members comprise pure metals, polymers, or combinations thereof.

8. The system of claim 1 , wherein the hard material members comprise ceramics, intermetallic alloys, or combinations thereof.

9. The system of claim 1 , wherein the interior bond region comprises hard material members and the exterior bond region consists of metal matrix.

10. The system of claim 1 , wherein the exterior bond region comprises soft material members and the interior bond region consists of metal matrix.

11. The system of claim 1 , wherein the interior bond region and the exterior bond region comprise soft material members, and there is a greater concentration of soft material members in the exterior bond region than the interior bond region.

12. The system of claim 1 , wherein the interior bond region and the exterior bond region comprise hard material members, and there are a greater concentration of hard material members in the interior bond region than the exterior bond region.

13. The system of claim 1 , wherein the composite bonding layer comprises a transient liquid phase bond.

14. The system of claim 1 , wherein the distance between the upper substrate and the lower substrate is from about 5 microns to about 5000 microns.

15. A system of bonded substrates, the system comprising:
a first substrate comprising a bonding surface;
a second substrate comprising a complementary bonding surface; and
a composite bonding layer positioned between the first substrate and the second substrate and in contact with the bonding surface of the first substrate and the complementary bonding surface of the second substrate, the composite boding layer comprising:
an interior bond region;
an exterior bond region positioned around the interior bond region and defining an outer surface of the composite bonding layer, the material of the interior bond region having a greater elastic modulus than the material of the exterior bond region;
a metal matrix, wherein a portion of the metal matrix is in the interior bond region and a portion of the metal matrix is in the exterior bond region; and
a plurality of soft material members positioned in the portion of the metal matrix in the exterior bond region, or a plurality of hard material members positioned in the portion of the metal matrix in the interior bond region, or both, wherein the soft material members have an elastic modulus less than the elastic modulus of the metal matrix and the hard material members have an elastic modulus greater than the elastic modulus of the metal matrix;

wherein:
the soft material members comprise pure metals, polymers, or combinations thereof; and
the hard material members comprise ceramics, intermetallic alloys, or combinations thereof.

16. A method for bonding a first substrate to a second substrate, the method comprising:
providing the first substrate comprising a bonding surface;
providing the second substrate comprising a complementary bonding surface;
providing a composite bonding layer precursor positioned between the first substrate and the second substrate, and the composite bonding layer precursor in contact with the bonding surface of the first substrate and the complementary bonding surface of the second substrate;
forming a composite bonding layer comprising:
an interior bond region;
an exterior bond region positioned around the interior bond region and defining an outer surface of the composite bonding layer, the material of the interior bond region having a greater elastic modulus than the material of the exterior bond region;
a metal matrix, wherein a portion of the metal matrix is in the interior bond region and a portion of the metal matrix is in the exterior bond region; and
a plurality of soft material members positioned in the portion of the metal matrix in the exterior bond region, or a plurality of hard material members positioned in the portion of the metal matrix in the interior bond region, or both, wherein the soft material members have an elastic modulus less than the elastic modulus of the metal matrix and the hard material members have an elastic modulus greater than the elastic modulus of the metal matrix.

17. The method of claim 16 , wherein the plurality of soft material members is positioned in the portion of the metal matrix in the exterior bond region.

18. The method of claim 16 , wherein the plurality of hard material members is positioned in the portion of the metal matrix in the interior bond region.

19. The method of claim 16 , wherein:
the plurality of soft material members is positioned in the portion of the metal matrix in the exterior bond region; and
the plurality of hard material members is positioned in the portion of the metal matrix in the interior bond region.

20. The method of claim 15 , wherein the material of the interior bond region has a greater elastic modulus than the material of the exterior bond region.

Assignees

• Toyota Motor Eng & Mfg North America Inc

Inventors

• Joshi Shailesh
• Noguchi Masao
• Dede Ercan Mehmet

Classifications

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/257

  having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence) · CPC title

• H10W40/255 Primary

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H01L23/3675

  Electricity · mapped topic