Metal member, metal member surface processing method, semiconductor device, semiconductor device manufacturing method, and composite molded body
US-9517532-B2 · Dec 13, 2016 · US
US9737957B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9737957-B2 |
| Application number | US-201415037368-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 30, 2014 |
| Priority date | Nov 19, 2013 |
| Publication date | Aug 22, 2017 |
| Grant date | Aug 22, 2017 |
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A method for treating a surface of a wall, that can reduce conductivity thereof, the surface being located in a first area located near a second area in which an electric arc is likely to occur in an electrical protection apparatus, the first area constituting an area for recondensing cutting residue. The method includes micro-texturizing the surface to promote inhomogeneity in recondensation of cutting residue, by growing deposits of the residue on the surface to create islands of residue and thus to restrict conductivity of the resulting deposit.
Opening claim text (preview).
The invention claimed is: 1. A method for treating a surface of a panel to reduce its conductivity, the surface being located in a first area, located near a second area in which an electric arc may occur in an electric protection apparatus, the first area forming an area of recondensation of switching residues, the method comprising: forming micro-texturing on the surface to promote inhomogeneity of the recondensation of the switching residues, as a result of growth of deposits of the residues on the surface to create islands of residues and thus limit conductivity of the resulting deposit. 2. The treatment method as claimed in claim 1 , wherein the deposits of the residues are grown on the surface in a direction substantially perpendicular to the plane of the surface. 3. The treatment method as claimed in claim 1 , wherein a superhydrophobic surface is produced by the method of micro-texturing, the method being optimized to reduce surface tensions on the surface, thereby reducing a number of nucleation sites and promoting growth of the deposits along the vertical axis. 4. The treatment method as claimed in claim 1 , wherein the method is a micro-texturing method using a laser. 5. The treatment method as claimed in claim 4 , wherein the method is a micro-texturing method using a laser whose pulse duration is less than 1 nanosecond and which delivers a peak power of more than 10 GW. 6. The treatment method as claimed in claim 1 , wherein the surface micro-texturing is created directly on the panel, or is obtained by molding a component including the panel by a mold in which the surface micro-texturing is opposite of a desired micro-texturing on the component. 7. The treatment method as claimed in claim 1 , wherein the panel is made of a plastic material. 8. An electric protection apparatus comprising: at least one panel located in a recondensation area remote from an arc area, the surface of the panel having been modified by a treatment method as claimed in claim 1 , to improve post-switching insulation of the apparatus. 9. The apparatus as claimed in claim 8 , wherein the apparatus is a low voltage electric circuit breaker. 10. The apparatus as claimed in claim 8 , as a multi-pole apparatus comprising a plurality of single-pole switching units, and wherein the panel belongs to a spacer located between two juxtaposed single-pole units, or belongs to a dielectric screen placed between separators and a movable contact member in open position of the contacts.
Microembossing · CPC title
Means for extinguishing or suppressing arc {(magnet coil acting as blow-out device H01H71/38)} · CPC title
Constructional details of housings or casings not concerning the mounting or assembly of the different internal parts · CPC title
hydrophobic · CPC title
Operations & Transport · mapped topic
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