Conductive film, method for manufacturing the same and display device comprising the same

Patent metadata

Field	Value
Publication number	US-9736937-B2
Application number	US-201414443213-A
Country	US
Kind code	B2
Filing date	Oct 30, 2014
Priority date	Oct 30, 2013
Publication date	Aug 15, 2017
Grant date	Aug 15, 2017

Abstract

The present application relates to a conductive film, a method for manufacturing the same, and a display device including the same.

First claim

The invention claimed is:

1. A conductive film comprising:
a substrate;
a transparent electrode layer provided on the substrate; and
a conductive pattern layer provided on the transparent electrode layer,
wherein the conductive pattern layer includes a metal nitride pattern layer including CuNx, x is a mass ratio of N with respect to a mass of Cu, and 0<x≦0.1, and
wherein a thickness of the metal nitride pattern layer is greater than or equal to 20 nm and less than or equal to 160 nm.

2. The conductive film of claim 1 , wherein the conductive pattern layer further includes a metal pattern layer including Cu, and the metal pattern layer is provided on at least one surface of the metal nitride pattern layer.

3. The conductive film of claim 2 , wherein the metal pattern layer is provided between the transparent electrode layer and the metal nitride pattern layer.

4. The conductive film of claim 2 , wherein the metal nitride pattern layer is provided between the transparent electrode layer and the metal pattern layer.

5. The conductive film of claim 2 , wherein the conductive pattern layer has a sheet resistance increase rate of 10% or less when 30 minutes passes by under an atmosphere of 150° C.

6. The conductive film of claim 2 , wherein a thickness ratio of the metal pattern layer and the metal nitride pattern layer is greater than or equal to 1:0.2 and less than or equal to 1:0.5.

7. The conductive film of claim 2 , wherein the metal pattern layer has a thickness of 100 nm or greater.

8. The conductive film of claim 2 , wherein the metal pattern layer is provided on an upper surface or on a lower surface of the metal nitride pattern layer, and a pattern line width of the metal pattern layer is from 80% to 120% with respect to a pattern line width of the metal nitride pattern layer.

9. The conductive film of claim 1 , wherein the metal nitride pattern layer further includes oxygen atoms, and a content of the oxygen atoms is greater than or equal to 3% and less than or equal to 6% with respect to the mass of Cu in the CuNx.

10. The conductive film of claim 1 , wherein the conductive pattern layer has sheet resistance of 0.5 Ω/square or less.

11. The conductive film of claim 1 , wherein the conductive pattern layer has R/R0 of 1.2 or less, wherein
R0 is an initial sheet resistance value at a temperature of 85° C. and relative humidity of 85%, and R is a sheet resistance value after 7 or more days pass by at a temperature of 85° C. and relative humidity of 85%.

12. The conductive film of claim 1 , wherein the conductive pattern layer has a pattern line width of greater than or equal to 0.1 μm and less than or equal to 100 μm.

13. The conductive film of claim 1 , wherein the conductive pattern layer has pattern line spacing of greater than or equal to 0.1 μm and less than or equal to 100 μm.

14. The conductive film of claim 1 , wherein the transparent electrode layer includes a metal oxide or a conductive polymer.

15. The conductive film of claim 1 , wherein the conductive pattern layer is wiring for a bezel of a display device.

16. A display device comprising the conductive film of claim 1 .

17. A touch panel comprising the conductive film of claim 1 .

18. A solar cell comprising the conductive film of claim 1 .

19. The conductive film of claim 1 , wherein the thickness of the metal nitride pattern layer is greater than or equal to 80 nm and less than or equal to 120 nm.

20. A method for manufacturing a conductive film comprising:
preparing a substrate;
forming a transparent electrode layer on the substrate; and
forming a conductive pattern layer on the transparent electrode layer,
wherein the conductive pattern layer includes a metal nitride pattern layer including CuNx, x is a mass ratio of N with respect to a mass of Cu, and 0<x≦0.1.

21. The method for manufacturing a conductive film of claim 20 , wherein the step of forming a conductive pattern layer includes forming a metal pattern layer including Cu on at least one surface of the metal nitride pattern layer.

22. The method for manufacturing a conductive film of claim 20 , wherein the step of forming a conductive pattern layer includes forming a conductive layer including a metal nitride layer including CuNx, wherein x is a mass ratio of N with respect to a mass of Cu, and 0<x≦0.1, on the transparent electrode layer, and then patterning the conductive layer.

23. The method for manufacturing a conductive film of claim 22 , wherein the conductive layer further includes a metal layer including Cu provided on an upper surface or on a lower surface of the metal nitride layer.

24. The method for manufacturing a conductive film of claim 23 , wherein the step of patterning the conductive layer is carried out by patterning the metal nitride layer and the metal layer at the same time.

25. The method for manufacturing a conductive film of claim 24 , wherein the step of patterning the conductive layer is carried out by etching the metal nitride layer and the metal layer all together using an etching liquid.

Assignees

• Lg Chemical Ltd

Inventors

• Kim Yong Chan
• Lim Jin Hyong
• Kim Ki-Hwan
• Yoon Junghwan
• Lee Ilha

Classifications

• H05K2201/0338

  Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer · CPC title

• G06F3/041 Primary

  Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means · CPC title

• G06F1/16

  Constructional details or arrangements · CPC title

• H01B1/026

  Alloys based on copper · CPC title

• H05K1/0298

  Multilayer circuits · CPC title