Semiconductor Integrated Circuit and Semiconductor Device
US-2024162894-A1 · May 16, 2024 · US
Apparatus and methods for on-die temperature sensing to improve FPGA performance
US9735779B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9735779-B1 |
| Application number | US-53410509-A |
| Country | US |
| Kind code | B1 |
| Filing date | Jul 31, 2009 |
| Priority date | Jul 7, 2009 |
| Publication date | Aug 15, 2017 |
| Grant date | Aug 15, 2017 |
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- Title
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Abstract
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A field programmable gate array (FPGA) includes a temperature sensor array. The FPGA also includes a supply voltage modulation circuit. The supply voltage modulation circuit is coupled to the temperature sensor array.
First claim
Opening claim text (preview).
The invention claimed is: 1. A field programmable gate array (FPGA), comprising: a temperature sensor array adapted to provide an output signal; and a supply voltage modulation circuit coupled to receive a reference signal derived from the output signal of the temperature sensor array. 2. The field programmable gate array (FPGA) according to claim 1 , wherein the temperature sensor array comprises a plurality of diodes. 3. The field programmable gate array (FPGA) according to claim 2 , wherein the plurality of diodes are distributed uniformly within core circuitry of the field programmable gate array (FPGA). 4. The field programmable gate array (FPGA) according to claim 2 , wherein the plurality of diodes are distributed non-uniformly within core circuitry of the field programmable gate array (FPGA). 5. The field programmable gate array (FPGA) according to claim 1 , wherein the supply voltage modulation circuit is operable to modulate a supply voltage of the field programmable gate array (FPGA). 6. The field programmable gate array (FPGA) according to claim 1 , wherein the supply voltage modulation circuit is operable to modulate a supply voltage of programmable logic circuitry within the field programmable gate array (FPGA). 7. The field programmable gate array (FPGA) according to claim 1 , wherein the supply voltage modulation circuit is operable to modulate a supply voltage of programmable interconnect circuitry within the field programmable gate array (FPGA). 8. The field programmable gate array (FPGA) according to claim 1 , further comprising body bias modulation circuit coupled to the temperature sensor array. 9. A field programmable gate array (FPGA), comprising: a temperature sensor array adapted to provide an output signal; and a body bias modulation circuit coupled to receive a reference signal derived from the output signal of the temperature sensor array. 10. The field programmable gate array (FPGA) according to claim 9 , wherein the temperature sensor array comprises a plurality of diodes. 11. The field programmable gate array (FPGA) according to claim 10 , wherein the plurality of diodes are distributed uniformly within core circuitry of the field programmable gate array (FPGA). 12. The field programmable gate array (FPGA) according to claim 10 , wherein the plurality of diodes are distributed non-uniformly within core circuitry of the field programmable gate array (FPGA). 13. The field programmable gate array (FPGA) according to claim 9 wherein the body bias modulation circuit is operable to modulate a body bias of at least one transistor in the field programmable gate array (FPGA). 14. The field programmable gate array (FPGA) according to claim 9 , further comprising programmable logic circuitry, wherein the body bias modulation circuit is operable to modulate a body bias of at least one transistor in the programmable logic circuitry. 15. The field programmable gate array (FPGA) according to claim 9 , further comprising programmable interconnect circuitry, wherein the body bias modulation circuit is operable to modulate a body bias of at least one transistor in the programmable interconnect circuitry. 16. A method of operating a field programmable gate array (FPGA), the method comprising: using a temperature sensor array to obtain a plurality of temperature values for a die of the field programmable gate array (FPGA) to generate a reference signal derived from the plurality of temperature values; and modulating, based on the reference signal derived from the plurality of temperature values, at least one of a supply voltage of the field programmable gate array (FPGA) and a body bias of the field programmable gate array (FPGA). 17. The method according to claim 16 , wherein modulating, based on the plurality of temperature values, at least one of a supply voltage of the field programmable gate array (FPGA) and a body bias of the field programmable gate array (FPGA) further comprises modulating a supply voltage of programmable logic circuitry within the field programmable gate array (FPGA). 18. The method according to claim 16 , wherein modulating, based on the plurality of temperature values, at least one of a supply voltage of the field programmable gate array (FPGA) and a body bias of the field programmable gate array (FPGA) further comprises modulating a supply voltage of programmable interconnect circuitry within the field programmable gate array (FPGA). 19. The method according to claim 16 , wherein modulating, based on the plurality of temperature values, at least one of a supply voltage of the field programmable gate array (FPGA) and a body bias of the field programmable gate array (FPGA) further comprises modulating a body bias applied to programmable logic circuitry within the field programmable gate array (FPGA). 20. The method according to claim 16 , wherein modulating, based on the plurality of temperature values, at least one of a supply voltage of the field programmable gate array (FPGA) and a body bias of the field programmable gate array (FPGA) further comprises modulating a body bias applied to programmable interconnect circuitry within the field programmable gate array (FPGA).
Assignees
Inventors
Classifications
Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title
Electricity · mapped topic
- H03K19/00369Primary
Modifications for compensating variations of temperature, supply voltage or other physical parameters · CPC title
Resistors, capacitors or inductors · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9735779B1 cover?
- A field programmable gate array (FPGA) includes a temperature sensor array. The FPGA also includes a supply voltage modulation circuit. The supply voltage modulation circuit is coupled to the temperature sensor array.
- Who is the assignee on this patent?
- Perisetty Srinivas, Altera Corp
- What technology area does this patent fall under?
- Primary CPC classification H03K19/00369. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 15 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).