Lead-free soldering method and soldered article
US-2017012018-A1 · Jan 12, 2017 · US
Power module
US9735226B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9735226-B1 |
| Application number | US-201615262024-A |
| Country | US |
| Kind code | B1 |
| Filing date | Sep 12, 2016 |
| Priority date | Jan 28, 2016 |
| Publication date | Aug 15, 2017 |
| Grant date | Aug 15, 2017 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Provided is a power module having a sufficient space in which a large electronic component in size is disposed, and having yield strength against external stresses, such as vibrations. A power module includes: an insulating substrate; a semiconductor element mounted above the insulating substrate; a sealant sealing the insulating substrate and semiconductor element, and forming the outer shape of the power module; and a pair of terminals disposed on the sealant, in both ends of the sealant in a width direction of the power module in an upright manner. The pair of terminals are spaced from each other by a distance greater than the width of a film capacitor being a first electronic component mounted on the bottom surface of a control substrate being a circuit substrate coupled to tips of the pair of terminals. The pair of terminals are longer in a height direction than the film capacitor.
First claim
Opening claim text (preview).
What is claimed is: 1. A power module comprising: an insulating substrate; a semiconductor element mounted above said insulating substrate; a sealant sealing said insulating substrate and said semiconductor element, said sealant forming an outer shape of said power module; and a pair of terminals disposed on said sealant, in both ends of said sealant in a width direction of said power module in an upright manner, wherein said pair of terminals are spaced from each other in said width direction by a distance greater than a width of at least one first electronic component mounted on a bottom surface of a circuit substrate coupled to tips of said pair of terminals, wherein said pair of terminals are longer in a height direction than said at least one first electronic component, said height direction being orthogonal to said width direction, and wherein said pair of terminals are wider in said width direction than said at least one first electronic component. 2. The power module according to claim 1 , wherein said pair of terminals are spaced from each other in said width direction by a distance greater than a sum of a width of sai d at least one first electronic component and a width of a second electronic component mounted on said bottom surface of said circuit substrate, at a position adjacent to said at least one first electronic component, and wherein said pair of terminals are longer in said height direction than said at least one first electronic component and said second electronic component. 3. The power module according to claim 1 , wherein said pair of terminals are wider than said at least one first electronic component or said second electronic component. 4. The power module according to claim 1 , further comprising a terminal disposed on said sealant, in a middle of said sealant in said width direction in an upright manner, said terminal being coupled to said circuit substrate at a tip of said terminal. 5. The power module according to claim 1 , further comprising a terminal for disposing said at least one first electronic component above said sealant. 6. The power module according to claim 1 , wherein said at least one first electronic component comprises a plurality of first electronic components, wherein said plurality of first electronic components are mounted at positions adjacent to each other in said width direction, and wherein said power module further comprises a plurality of terminals for disposing each of said plurality of first electronic components above said sealant. 7. The power module according to claim 6 , further comprising a terminal disposed on said sealant, between said plurality of first electronic components adjacent to each other in an upright manner, said terminal being coupled to said circuit substrate at a tip of said terminal.
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Frequently asked questions
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- What does patent US9735226B1 cover?
- Provided is a power module having a sufficient space in which a large electronic component in size is disposed, and having yield strength against external stresses, such as vibrations. A power module includes: an insulating substrate; a semiconductor element mounted above the insulating substrate; a sealant sealing the insulating substrate and semiconductor element, and forming the outer shape …
- Who is the assignee on this patent?
- Mitsubishi Electric Corp
- What technology area does this patent fall under?
- Primary CPC classification H01L28/40. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 15 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).