Micro-electro-mechanical system (MEMS) device with multi-dimensional spring structure and frame

Patent metadata

Field	Value
Publication number	US-9733269-B2
Application number	US-201414535022-A
Country	US
Kind code	B2
Filing date	Nov 6, 2014
Priority date	Nov 6, 2014
Publication date	Aug 15, 2017
Grant date	Aug 15, 2017

Abstract

The invention provides a MEMS device. The MEMS device includes: a substrate; a proof mass, including at least two slots, each of the slots including an inner space and an opening, the inner space being relatively closer to a center area of the proof mass than the opening; at least two anchors located in the corresponding slots and connected to the substrate; at least two linkages located in the corresponding slots and connected to the corresponding anchors; and a multi-dimensional spring structure for assisting a multi-dimensional movement of the proof mass, the multi-dimensional spring structure surrounding a periphery of the proof mass, and connected to the substrate through the linkages and the anchors. The multi-dimensional spring structure includes first and second springs for assisting an out-of-plane movement and an in-plane movement of the proof mass.

First claim

What is claimed is:

1. A micro-electro-mechanical system (MEMS) device, comprising:
a substrate;
a proof mass, including at least two slots, each of the slots including a first inner space and an opening, wherein the first inner space is relatively closer to a center area of the proof mass than the opening;
at least two anchors, respectively located in the corresponding first inner spaces and connected to the substrate;
at least two linkages, respectively located in the corresponding slots and connected to the corresponding anchors; and
a multi-dimensional spring structure for assisting a multi-dimensional movement of the proof mass, the multi-dimensional spring structure surrounding a periphery of the proof mass, and connected to the substrate through the linkages and the anchors, the multi-dimensional spring structure comprising:
a plurality of first springs, connected to the proof mass for assisting an out-of-plane movement of the proof mass;
a plurality of second springs, each of the second springs being directly or indirectly connected between a corresponding one of the linkages and a corresponding one of the first springs, for assisting an in-plane movement of the proof mass, wherein the first springs and second springs respectively assist movements of the proof mass in different dimensions; and

an outer frame which is connected to the first and second springs and forms a frame-like structure which encompasses all of the proof mass, wherein the second springs are connected to the proof mass through the first springs.

2. The MEMS devices of claim 1 , wherein the at least two slots, the at least two linkages, and the at least two anchors are reflection-symmetric with respect to a center line of the proof mass, respectively.

3. The MEMS devices of claim 1 , wherein the first springs are connected to two opposite sides of the proof mass, and the openings of the at least two slots are connected to two other opposite sides of the proof mass.

4. The MEMS devices of claim 1 , wherein the first springs are rotatable springs for assisting an out-of-plane rotational movement of the proof mass.

5. The MEMS devices of claim 4 , wherein a rotation axis is formed along an imaginary line connecting two of the first springs, and a mass of the proof mass is unevenly distributed at two sides of the rotation axis such that the rotational movement is an eccentric movement.

6. The MEMS devices of claim 1 , wherein the first springs are translational springs for assisting the out-of-plane movement of the proof mass, and the out-of-plane movement is a translational out-of-plane movement.

7. The MEMS devices of claim 1 , wherein more than one of the anchors are located in each of the slots, and the linkage in each of the slots is connected to all the anchors in the same slot.

8. The MEMS devices of claim 1 , wherein the multi-dimensional movement is a three-dimensional movement.

9. The MEMS devices of claim 1 , wherein the multi-dimensional spring structure includes:
at least two inner beams, respectively connected to the at least two corresponding linkages; and
the first springs and the second springs, wherein the outer frame is connected to the inner beams through the second springs, and the outer frame is connected to the proof mass through the first springs, and wherein there is no portion of the proof mass between the inner beams and the outer frame.

10. A micro-electro-mechanical system (MEMS) device, comprising:
a substrate;
a proof mass, including at least two slots, each of the slots including a first inner space and an opening, wherein the first inner space is relatively closer to a center area of the proof mass than the opening;
at least two anchors, respectively located in the corresponding first inner spaces and connected to the substrate;
at least two linkages, respectively located in the corresponding slots and connected to the corresponding anchors; and
a multi-dimensional spring structure for assisting a multi-dimensional movement of the proof mass, the multi-dimensional spring structure surrounding a periphery of the proof mass, and connected to the substrate through the linkages and the anchors, the multi-dimensional spring structure comprising:
a plurality of first springs, connected to the proof mass for assisting an out-of-plane movement of the proof mass; and
a plurality of second springs, each of the second springs being directly or indirectly connected between a corresponding one of the linkages and a corresponding one of the first springs, for assisting an in-plane movement of the proof mass, wherein the first springs and second springs respectively assist movements of the proof mass in different dimensions;

wherein the first springs are reflection-symmetric with respect to a first center line of the proof mass and the second springs are reflection-symmetric with respect to a second center line of the proof mass.

Assignees

• Hsu Yu-Wen
• Lin Shih-Chieh
• Wu Chia-Yu
• Richtek Technology Corp

Inventors

• Hsu Yu-Wen
• Lin Shih-Chieh
• Wu Chia-Yu

Classifications

• G01P2015/0845

  using a plurality of spring-mass systems being arranged on one common planar substrate, the systems not being mechanically coupled and the sensitive direction of each system being different · CPC title

• G01P15/125 Primary

  by capacitive pick-up · CPC title

• H01L29/84

  Electricity · mapped topic

• H10D48/50

  Devices controlled by mechanical forces, e.g. pressure · CPC title