Thermal flow meter including a protrusion protruding from a circuit package body and a temperature detection element buried in the protrusion

Patent metadata

Field	Value
Publication number	US-9733113-B2
Application number	US-201314407169-A
Country	US
Kind code	B2
Filing date	May 15, 2013
Priority date	Jun 15, 2012
Publication date	Aug 15, 2017
Grant date	Aug 15, 2017

Abstract

Provided is a thermal flow meter to improve the measurement accuracy of a temperature detector provided in a thermal flow meter. The thermal flow meter includes a bypass passage through which a measurement target gas 30 flowing through a main passage flows, and a circuit package 400 which includes a measurement circuit for measuring a flow rate of the measurement target gas 30 flowing through the bypass passage and a temperature detecting portion 452 for detecting a temperature of the measurement target gas. The circuit package 400 includes a circuit package body which is molded by a resin to internally envelope the measurement circuit and a protrusion 424 molded by the resin. The temperature detecting portion 452 is provided in the leading end portion of the protrusion 424 , and at least the leading end portion of the protrusion protrudes to the outside from a housing 302.

First claim

The invention claimed is:

1. A thermal flow meter comprising:
a bypass passage into which a measurement target gas flowing through a main passage flows;
a circuit package which includes an air flow sensing portion for measuring a flow rate by performing heat transfer with the measurement target gas flowing through the bypass passage, a processing unit for controlling the air flow sensing portion, and a temperature detecting portion including a temperature detection element for detecting a temperature of the measurement target gas; and
a case which includes an external terminal for outputting an electric signal representing the flow rate and an electric signal representing a temperature of the measurement target gas and supports the circuit package, wherein
the case includes a resin housing which supports the circuit package,
the circuit package includes a circuit package body that is molded by a resin and the circuit package is configured to envelope the processing unit and the temperature detecting portion with the resin,
the circuit package includes a protrusion protruding in a shape extending to an upstream direction of the measurement target gas from a side of the circuit package body, and the temperature detection element is buried in the protrusion, and
at least a leading end portion of the protrusion is exposed in the main passage.

2. The thermal flow meter according to claim 1 , wherein the resin housing includes an outer wall,
the outer wall includes a hollow portion toward an inside of the resin housing, and
at least the leading end portion of the protrusion protrudes from the hollow portion of the outer wall to an outside of the resin housing.

3. The thermal flow meter according to claim 1 , wherein
the resin housing includes a first housing having the bypass passage and a second housing positioned on a side near a flange from the first housing,
an air passage is provided between the first housing and the second housing to flow the measurement target gas flowing through the main passage,
the circuit package is configured to envelope the processing unit and the temperature detecting portion with a resin,
the temperature detecting portion includes the protrusion which protrudes from the circuit package body,
at least the leading end portion of the protrusion protrudes to an outside of the resin housing, and
an opening of the air passage is provided between the first housing and the second housing is provided at a position of the protrusion.

4. The thermal flow meter according to claim 1 , wherein the leading end portion of the protrusion is formed to protrude from the resin housing toward an upstream direction of a flow of the measurement target gas flowing through the main passage.

5. The thermal flow meter according to claim 1 , wherein
the thermal flow meter includes the bypass passage on a center side of the main passage in the thermal flow meter, and
the leading end portion of the protrusion protruding from the circuit package body is formed to protrude from the bypass passage in the thermal flow meter to the outside of the resin housing.

6. The thermal flow meter according to claim 5 , wherein the resin housing is configured such that the outer wall has a hollow shape in a direction to a wall surface of the main passage between an upstream side and a downstream side of the main passage with respect to the outer wall on the upstream side or the downstream side of the main passage on the center side of the main passage in which the bypass passage is formed, and at least the leading end portion of the protrusion protrudes from a portion of the hollow shape of the outer wall to the outside of the resin housing.

7. The thermal flow meter according to claim 1 , wherein
the circuit package including a circuit package body and a protrusion is molded in a resin molding process,
the resin housing includes the bypass passage, a flange, an outer wall, and a fixing portion for fixing the circuit package,
the bypass passage, the flange, the outer wall, and the fixing portion are integrally molded by molding the resin housing in a second resin molding process, and
the circuit package molded in the first resin molding process is fixed to the resin housing by the fixing portion.

8. The thermal flow meter according to claim 1 , wherein
the circuit package including a circuit package body and a protrusion is molded in a first resin molding process,
the resin housing includes the bypass passage, a flange, and an outer wall,
the bypass passage, the flange, and the outer wall are integrally molded by molding the resin housing in a second resin molding process, and
the circuit package molded in the first resin molding process is covered and fixed to a portion of the outer wall.

9. The thermal flow meter according to claim 1 , wherein a cover is provided in the outside of the protrusion.

10. The thermal flow meter according to claim 9 , wherein
a front cover and a back cover are provided on both sides of the leading end portion of the protrusion, and
an opening is formed in each of the covers to cause the measurement target gas to flow.

11. The thermal flow meter according to claim 1 , wherein
the protrusion protruding from the circuit package body includes internally a lead, and
a temperature detection element is electrically connected to the lead in the leading end portion of the protrusion.

12. The thermal flow meter according to claim 11 , wherein the protrusion includes internally a first lead connected to the temperature detection element, a second lead for making electrical connection with an electric circuit in the circuit package body, and a connection line which is provided between the first lead and the second lead in order to electrically connect the first lead and the second lead.

13. The thermal flow meter according to claim 1 , wherein a hollow is provided in the resin enveloping the temperature detecting portion.

Assignees

• Hitachi Automotive Systems Ltd

Inventors

• Tashiro Shinobu
• Hanzawa Keiji
• Tokuyasu Noboru
• Morino Takeshi
• Doi Ryosuke
• Uenodan Akira

Classifications

• G01F1/6845

  Micromachined devices · CPC title

• G01F5/00

  Measuring a proportion of the volume flow · CPC title

• G01F15/02

  Compensating or correcting for variations in pressure, density or temperature · CPC title

• G01F15/006

  characterised by the use of a particular material, e.g. anti-corrosive material (G01F15/14 takes precedence) · CPC title

• G01F1/6965

  comprising means to store calibration data for flow signal calculation or correction · CPC title