Polyimide precursor, polyimide, and coating solution for under layer film for image formation

Patent metadata

Field	Value
Publication number	US-9732253-B2
Application number	US-201414175236-A
Country	US
Kind code	B2
Filing date	Feb 7, 2014
Priority date	Apr 25, 2007
Publication date	Aug 15, 2017
Grant date	Aug 15, 2017

Abstract

There is provided a polyimide precursor which can alter the hydrophilicity/hydrophobicity of the surface of a cured film formed readily even by a low level of ultraviolet ray irradiation; and a polyimide produced from the polyimide precursor. The polyimide precursor having a structure represented by the following formula (1):

where A represents a tetravalent organic group; B represents a bivalent organic group having a thiol ester bond in its main chain; R 1 and R 2 independently represent a hydrogen atom or a univalent organic group; and n represents a natural number.

First claim

The invention claimed is:

1. A cured film produced by curing a coating solution for an under layer film for image formation, said coating solution comprising:
at least one type of a compound selected from a group consisting of:
(i) a polyimide precursor having a linear structure represented by the following formula (1):

where A represents a tetravalent organic group; B represents a bivalent organic group having a thiol ester bond in its main chain; R 1 and R 2 independently represent a hydrogen atom or a univalent organic group; and n represents a natural number, and
(ii) a polyimide produced by dehydrating and ring closing said polyimide precursor.

2. A film produced by using a coating solution for an under layer film for image formation, said coating solution comprising:
at least one type of a compound selected from a group consisting of:
(i) a polyimide precursor having a linear structure represented by the following formula (1):

where A represents a tetravalent organic group; B represents a bivalent organic group having a thiol ester bond in its main chain; R 1 and R 2 independently represent a hydrogen atom or a univalent organic group; and n represents a natural number, and
(ii) a polyimide produced by dehydrating and ring closing said polyimide precursor.

3. The film according to claim 2 , wherein the film is an under layer film for image formation.

4. The film according to claim 2 , wherein the film is an under layer film for electrode pattern formation.

5. The film according to claim 2 , wherein the film is a gate insulating film.

6. A method for forming the film of claim 2 , comprising:
applying the coating solution for an under layer film for image formation on a substrate,
thermosetting the applied coating solution, and
irradiating the thermoset coating solution with an ultraviolet ray.

Assignees

• Nissan Chemical Ind Ltd

Inventors

• Maeda Shinichi
• Iinuma Yosuke

Classifications

• C08G73/105

  with oxygen only in the diamino moiety · CPC title

• C08G73/1075

  Partially aromatic polyimides · CPC title

• C08G73/1039 Primary

  comprising halogen-containing substituents · CPC title

• G03F7/11

  having cover layers or intermediate layers, e.g. subbing layers {(G03F7/091 - G03F7/093, B41N3/03 take precedence)} · CPC title

• C09D179/08 Primary

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title