Adaptable sunshield for fan-less electronic component
US-11864341-B1 · Jan 2, 2024 · US
US9730358B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9730358-B2 |
| Application number | US-201414185937-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 21, 2014 |
| Priority date | Mar 1, 2013 |
| Publication date | Aug 8, 2017 |
| Grant date | Aug 8, 2017 |
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An exemplary heat dissipation apparatus includes a bracket, a reticular cover fixed to the bracket and a receiving space being defined with the bracket, and a tray received in the receiving space. The tray includes a first surface and a second surface. A number of first through holes is defined on the bracket. A number of second through holes is defined on the tray respectively corresponding to the first through holes, each of the second through holes extends obliquely from the first surface of the tray to the second surface of the tray relative to a vertical line of the first and second surfaces of the tray. A first magnet is installed on the first surface of the tray, a second magnet corresponding to the first magnet is installed on the bracket.
Opening claim text (preview).
What is claimed is: 1. A heat dissipation apparatus comprising: a bracket; a reticular cover fixed to the bracket, the reticular cover and the bracket cooperatively defining a receiving space; and a tray received in the receiving space and rotating relative to the bracket, the tray comprising a first surface facing to the bracket and a second surface opposite to the first surface, and the tray regarding a central vertical axis of the first surface and second surface as axis of rotation; wherein a plurality of first through holes are defined on the bracket, a plurality of second through holes are defined on the tray and respectively corresponds to the plurality of first through holes, each of the plurality of second through holes extends obliquely from the first surface of the tray to the second surface of the tray relative to a vertical line of the first and second surfaces of the tray, the plurality of second through holes are arranged in at least one row around the central vertical axis, and the plurality of first through holes are placed in at least one row around the central vertical axis, and wherein the first surface of the tray is installed with a first magnet, the bracket is installed with a second magnet corresponding to the first magnet, the tray is supported on the bracket by the repulsive force between the first magnet and the second magnet. 2. The heat dissipation apparatus of claim 1 , wherein the bracket comprises a base, a sleeve, a cover plate and a plurality of pillars, the sleeve perpendicularly connecting the base and the cover plate, the cover plate is adjacent to the first surface of the tray, the cover plate defines a first opening exposing an inside of the sleeve to an outside of the cover plate, the plurality of first through holes correspond to the plurality of pillars, and each of the plurality of first through holes runs though the corresponding pillar. 3. The heat dissipation apparatus of claim 2 , wherein the base defines a circle-shaped opening allowing the inside of the sleeve communication with and the outside of the base and a slot communicating with and encircling the circle-shaped opening, a first sleeve-shaped magnet is fixed into the slot, the first surface of the tray is placed with a guiding pillar, the guiding pillar and the slot of the base are coaxial with the central vertical axis of the tray, a second sleeve-shaped magnet is placed on periphery of the guiding pillar, the guiding pillar with the second sleeve-shaped magnet is received in the first sleeve-shaped magnet, and first sleeve-shaped magnet and the second sleeve-shaped magnet repel each other. 4. The heat dissipation apparatus of claim 3 , wherein the reticular cover comprises a reticular surface and a support extending from an edge of the reticular surface, the support is fixed on the cover plate, the reticular surface, the support and the cover plate cooperatively define the receiving space, and the reticular surface is adjacent to the tray received in the receiving space. 5. The heat dissipation apparatus of claim 4 , wherein a first circle-shaped slot corresponding to the guiding pillar is placed in the second surface of the tray, a second circle-shaped slot corresponding to the first circle-shaped slot is placed in the reticular surface, a first circle plate-shaped magnet is placed into the first circle-shaped slot, a second circle plate-shaped magnet is placed into the second circle-shaped slot, the first circle plate-shaped magnet and the second circle plate-shaped magnet repel each other. 6. The heat dissipation apparatus of claim 5 , wherein the first magnet and the second magnet are a ring-shaped magnet, a first ring slot is placed around the first opening of the cover plate, a second ring slot is placed on the first surface of the tray corresponding to the first ring slot, the first ring-shaped magnet is placed into the first ring slot, and the second ring-shaped magnet is placed in the second ring slot. 7. The heat dissipation apparatus of claim 2 , wherein the plurality of pillars are placed in three rows around the circle-shaped opening, the pillars placed in each row are equally angularly spaced from each other, the plurality of second through holes are placed in three rows around the guiding pillar, the second through holes placed in each row are equally angularly spaced from each other, the pillars in one row respectively align with the pillars in other two rows to form a line which is collinear with the radius of the circle-shaped open, the second through holes in one row respectively align with the second through holes in other two rows to form a line which is collinear with the radius of the guiding pillar. 8. The heat dissipation apparatus of claim 2 , wherein the cover plate, the sleeve and the base cooperatively form a groove on the outside of the sleeve, the groove is used in assembling the heat dissipation apparatus to a device needing heat dissipation. 9. The heat dissipation apparatus of claim 1 , wherein a density of the second through holes in each row is higher than a density of the first through holes of a corresponding row. 10. An electronic device comprising: a housing; and a heat dissipation apparatus received in the housing, the heat dissipation apparatus comprising: a bracket; a reticular cover fixed to the bracket, the reticular cover and the bracket cooperatively defining a receiving space; and a tray received in the receiving space and rotating relative to the bracket, the tray comprising a first surface facing to the bracket and a second surface opposite to the first surface, and the tray regarding a central vertical axis of the first surface and second surface as axis of rotation; wherein a plurality of first through holes are defined on the bracket, a plurality of second through holes are defined on the tray and respectively corresponds to the plurality of first through holes, each of the plurality of second through holes extends obliquely from the first surface of the tray to the second surface of the tray relative to a vertical line of the first and second surfaces of the tray, the plurality of second through holes are arranged in at least one row around the central vertical axis, and the plurality of first through holes are placed in at least one row around the central vertical axis, and wherein the first surface of the tray is installed with a first magnet, the bracket is installed with a second magnet corresponding to the first magnet, the tray is supported on the bracket by the repulsive force between the first magnet and the second magnet. 11. The heat dissipation apparatus of claim 10 , wherein the bracket comprises a base, a sleeve, a cover plate and a plurality of pillars, the sleeve perpendicularly connected between the base and the cover plate, the cover plate is adjacent to the first surface of the tray, the cover plate defines a first opening exposing an inside of the sleeve to an outside of the cover plate, the plurality of first through holes correspond to the plurality of pillars, and each of the plurality of first through holes runs though the corresponding pillar. 12. The heat dissipation apparatus of claim 11 , wherein the base defines a circle-shaped opening allowing the inside of the sleeve communication with and the outside of the base and a slot communicating with and encircling the circle-shaped opening, a first sleeve-shaped magnet is fixed into the slot, the first surface of the tray is placed with a guiding pillar, the guiding pillar and the slot of the base are coaxial with the central vertical axis of the tray, a second sleeve-shaped magnet is placed on periphery of the guiding pillar, the guiding pillar with
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