Device having heat sink

Patent metadata

Field	Value
Publication number	US-9730311-B2
Application number	US-201314443896-A
Country	US
Kind code	B2
Filing date	Oct 25, 2013
Priority date	Nov 21, 2012
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

An electric compressor includes a motor, a scroll compression mechanism, a housing, a circuit unit, a circuit housing housing the circuit unit and integrated with the housing. The electric compressor includes a heat sink provided on a circuit unit side of a partition wall so as to project to be brought into contact with a semiconductor element of a power substrate, facing the partition wall that erects along a vertical direction to separate the inside of the housing from the circuit housing. The heat sink has a lower surface and an upper surface formed into a cylindrical shape so that width of an upper end portion and a lower end portion of the heat sink gradually decreases to reach a tip portion.

First claim

The invention claimed is:

1. An apparatus comprising:
an apparatus body;
a body housing that houses the apparatus body;
a circuit unit including a circuit board that drives and controls the apparatus body; and
a circuit housing that houses the circuit unit and that is integrated with the body housing, wherein a heat sink is provided on a circuit unit side of a partition wall so as to be brought into contact with an element of the circuit board, the partition wall erecting along a vertical direction or a substantially vertical direction to separate the inside of the body housing from the inside of the circuit housing, and wherein the heat sink has an upper end portion and a lower end portion at least one of whose width gradually decreases to reach a tip portion.

2. The apparatus according to claim 1 , wherein the heat sink has a dimension in the vertical direction that is longer than a dimension in a direction intersecting the vertical direction.

3. The apparatus according to claim 1 , wherein a plurality of the elements is arranged on the circuit board at least in a horizontal direction, and wherein the heat sink is provided for each of blocks into which an area where the elements are arranged is divided along the vertical direction.

4. The apparatus according to claim 1 , wherein a projected portion is formed in the partition wall so as to project above the heat sink toward the circuit unit.

5. The apparatus according to claim 4 , wherein the projected portion is formed so as to include a recessed portion that communicates with the inside of the body housing.

6. The apparatus according to claim 5 , wherein in the recessed portion, a terminal connecting the circuit board and the apparatus body is housed.

7. The apparatus according to claim 1 , wherein a fixed portion for fixing the circuit board to the partition wall is formed integrally with at least one of the heat sink and the projected portion.

8. The apparatus according to claim 1 , wherein the apparatus body includes a motor, and a compression mechanism that is driven and controlled through the motor and that compresses a refrigerant to be sucked into the body housing.

Assignees

• Mitsubishi Heavy Ind Automotive Thermal Sys Co Ltd

Inventors

• Ichikawa Gento
• Hagita Takayuki
• Yoshioka Akinori
• Kamitani Hiroyuki
• Nakano Koji
• Ishikawa Masayuki
• Takahashi Masanori
• Aoyagi Kenji
• Ito Masato

Classifications

• H10W40/43

  by flowing gases, e.g. forced air cooling · CPC title

• F04B27/10 Primary

  having stationary cylinders · CPC title

• H05K1/0203 Primary

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• F04C29/047

  Cooling of electronic devices installed inside the pump housing, e.g. inverters · CPC title

• F04C2240/808

  Electronic circuits (e.g. inverters) installed inside the machine · CPC title