Manufacturing method of a condenser microphone

Patent metadata

Field	Value
Publication number	US-9729990-B2
Application number	US-201514978680-A
Country	US
Kind code	B2
Filing date	Dec 22, 2015
Priority date	Feb 18, 2013
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes.

First claim

What is claimed is:

1. A manufacturing method of a condenser microphone, comprising steps of:
providing a substrate;
forming a diaphragm having a plurality of protrusions on the substrate;
forming a sacrifice layer on the diaphragm and covering the protrusions;
disposing a back plate covering the sacrifice layer and partially coupled to the diaphragm;
forming a plurality of through holes in the back plate, wherein at least some of the through holes are corresponding to the protrusions respectively; and
removing the sacrifice layer.

2. The manufacturing method as recited in claim 1 , wherein the diaphragm and its protrusions are fabricated via injection, hot embossing, adhering or integration forming, on the substrate.

3. The manufacturing method as recited in claim 1 , wherein after the step of providing the substrate, the manufacturing method further comprises a step of:
disposing at least an insulating layer on the substrate.

4. The manufacturing method as recited in claim 1 , wherein after the step of forming the sacrifice layer on the diaphragm and covering the protrusions, the manufacturing method further comprises steps of:
forming an dielectric layer on the sacrifice layer; and
removing the sacrifice layer by an etching method.

Assignees

• Nat Univ Tsing Hua

Inventors

• Chen Sun-Zen
• Chen Henry J H
• Chen Jen-Yi
• Chiu Kuan-Hsun
• Hsieh Kuang-Chien

Classifications

• H04R2217/01

  Non-planar magnetostrictive, piezoelectric or electrostrictive benders · CPC title

• H04R7/04

  Plane diaphragms · CPC title

• H04R2231/001

  Moulding aspects of diaphragm or surround · CPC title

• H04R31/003 Primary

  for diaphragms or their outer suspension · CPC title

• H04R19/04

  Microphones (H04R19/01 takes precedence) · CPC title