Piezoelectric vibration component having distinguishable opposing principal surfaces

Patent metadata

Field	Value
Publication number	US-9729124-B2
Application number	US-201514670251-A
Country	US
Kind code	B2
Filing date	Mar 26, 2015
Priority date	Sep 26, 2012
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

A piezoelectric vibration component that includes a sealed space formed between first and second package members, and a piezoelectric vibrator is bonded to the first package member with first and second conductive adhesive portions. In the piezoelectric vibrator, a first vibration electrode and a first extended electrode are formed on a first surface of a piezoelectric substrate, and a second vibration electrode and a second extended electrode are formed on a second surface of the piezoelectric substrate. At least the second extended electrode provided on the second principal surface has a higher bonding strength with respect to the conductive adhesive than that of the electrodes on the first principal surface. The electrode patterns on the first and second principal surfaces differ from each other so that the first surface and the second surface can be distinguished from each other.

First claim

The invention claimed is:

1. A piezoelectric vibration device comprising:
a package member having a surface with first and second connection electrodes disposed thereon;
a piezoelectric vibrator including:
a piezoelectric substrate having first and second surfaces that oppose each other, the piezoelectric substrate being a quartz substrate,
a first vibration electrode disposed on the first surface of the piezoelectric substrate,
a first extended electrode disposed on the first surface of the piezoelectric substrate and that is electrically connected to the first vibration electrode,
an electrode pad disposed on the second surface of the piezoelectric substrate and electrically connected to the first extended electrode, the electrode pad overlapping the first extended electrode in a direction normal to the piezoelectric substrate with the piezoelectric substrate disposed between the electrode pad and the first extended electrode,
a second vibration electrode disposed on the second surface of the piezoelectric substrate, and
a second extended electrode disposed on the second surface of the piezoelectric substrate and that is electrically connected to the second vibration electrode;

a first conductive adhesive member applied to the electrode pad and that secures the piezoelectric vibrator to the package member and that electrically connects the first connection electrode to the first extended electrode; and
a second conductive adhesive member applied to the second extended electrode and that secures the piezoelectric vibrator to the package member and that electrically connects the second connection electrode to the second extended electrode,
wherein the first and second conductive adhesive members are secured to at least a same side of the second surface of the piezoelectric substrate,
wherein the first vibration electrode, the first extended electrode on the first surface and the electrode form a first electrode pattern, and the second vibration electrode and the second extended electrode on the second surface form a second electrode pattern, and
wherein the first and second electrode patterns differ from each other from a plan view of the first and second surfaces of the piezoelectric vibrator.

2. The piezoelectric vibration device according to claim 1 , further comprising a cap that is affixed to the package member to form a sealed space together with the package member and the piezoelectric vibrator is disposed in the sealed space.

3. The piezoelectric vibration device according to claim 2 , wherein the package member is a plate-shaped package substrate and the cap has a downwardly facing opening.

4. The piezoelectric vibration device according to claim 3 , wherein the package substrate is a ceramic substrate including a single ceramic layer.

5. The piezoelectric vibration device according to claim 1 , wherein the second surface of the piezoelectric substrate opposes the package member.

6. The piezoelectric vibration device according to claim 1 , wherein the second extended electrode comprises a metal material having a higher bonding strength with respect to the corresponding conductive adhesive member than the first extended electrode.

7. The piezoelectric vibration device according to claim 1 , wherein the piezoelectric substrate comprises an identification mark on at least one of the first surface and the second surface.

8. The piezoelectric vibration device according to claim 7 , wherein the identification mark indicates whether the surface on which the identification mark is disposed is the first surface or the second surface.

9. The piezoelectric vibration device according to claim 1 , wherein the first extended electrode and the second extended electrode have different shapes from the plan view of the first and second surfaces of the piezoelectric vibrator.

10. The piezoelectric vibration device according to claim 1 , wherein the piezoelectric substrate is a quartz substrate.

11. The piezoelectric vibration device according to claim 1 , wherein the first and second conductive adhesive member comprise an epoxy resin.

12. The piezoelectric vibration device according to claim 1 , wherein the first extended electrode comprises a rectangular shape.

13. The piezoelectric vibration device according to claim 12 , wherein the first extended electrode directly contacts the first vibration electrode.

14. The piezoelectric vibration device according to claim 1 , wherein the piezoelectric substrate comprises a rectangular shape and the first extended electrode extends to one corner thereof.

15. The piezoelectric vibration device according to claim 14 , wherein the electrode pad is further disposed on a side of the piezoelectric substrate between the first surface and the second surface.

16. The piezoelectric vibration device according to claim 1 , wherein the first vibration electrode does not extend to any edge of the first, surface of the piezoelectric substrate.

17. The piezoelectric vibration device according to claim 16 , wherein the second vibration electrode does not extend to any edge of the second surface of the piezoelectric substrate.

18. The piezoelectric vibration device according to claim 1 , wherein the second extended electrode comprises an Au film disposed between a pair of Cr films.

19. The piezoelectric vibration device according to claim 1 , wherein the piezoelectric substrate comprises a rectangular shape and the second extended electrode comprises at least one side that extends toward an apex of a corner section of the piezoelectric substrate.

20. The piezoelectric vibration device according to claim 1 , wherein a side of the second extended electrode extends linearly towards an apex of a corresponding corner section of the piezoelectric substrate in a plan view of the first and second surfaces of the piezoelectric vibrator.

21. The piezoelectric vibration device according to claim 1 , wherein the electrode pad comprises a metal material having a higher bonding strength to the first conductive member that a bonding strength of the first extended electrode to the first conductive member.

Assignees

• Murata Manufacturing Co

Inventors

• Okamoto Bunta
• Oishibashi Hidekazu

Classifications

• H01L41/0475

  Electricity · mapped topic

• H03H9/131

  consisting of a multilayered structure · CPC title

• H01L41/053

  Electricity · mapped topic

• H03H9/17

  having a single resonator (crystal tuning forks H03H9/21) · CPC title

• H03H9/1021 Primary

  the BAW device being of the cantilever type · CPC title