Body-mountable device with a common substrate for electronics and battery

Patent metadata

Field	Value
Publication number	US-9728494-B2
Application number	US-201514863510-A
Country	US
Kind code	B2
Filing date	Sep 24, 2015
Priority date	Sep 24, 2015
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

An example device includes a silicon substrate having a first substrate surface and a second substrate surface; a plurality of layers associated with one or more electronic components of an integrated circuit (IC), where the plurality of layers are deposited on the second substrate surface; a lithium-based battery having a plurality of battery layers deposited on the first substrate surface of the silicon substrate, where the lithium-based battery includes an anode current collector and a cathode current collector; a first through-silicon via (TSV) passing through the silicon substrate and providing an electrical connection between the anode current collector and the plurality of layers associated with the one or more electronic components of the IC; and a second TSV passing through the silicon substrate and providing an electrical connection between the cathode current collector and the plurality of layers associated with the one or more electronic components of the IC.

First claim

What is claimed is:

1. A device comprising:
a silicon substrate having a first substrate surface and a second substrate surface opposite the first substrate surface;
a plurality of layers associated with one or more electronic components of an integrated circuit, wherein the plurality of layers are deposited on the second substrate surface;
a lithium-based battery having a plurality of battery layers deposited on the first substrate surface of the silicon substrate, wherein the lithium-based battery includes an anode current collector and a cathode current collector defined within the plurality of battery layers and contacting the first substrate surface, and wherein the plurality of battery layers includes an electrolyte layer in direct contact with the first substrate surface, the cathode current collector, and the anode current collector;
a first through-silicon via (TSV) passing through the silicon substrate and providing an electrical connection between the anode current collector and the plurality of layers associated with the one or more electronic components of the integrated circuit, wherein the first TSV comprises a first conductive channel insulated from the silicon substrate by a first insulating layer surrounding the first conductive channel; and
a second TSV passing through the silicon substrate and providing an electrical connection between the cathode current collector and the plurality of layers associated with the one or more electronic components of the integrated circuit, wherein the second TSV comprises a second conductive channel insulated from the silicon substrate by a second insulating layer surrounding the second conductive channel.

2. The device of claim 1 , wherein the lithium-based battery is a type that undergoes an expansion during charging in which the expansion of the lithium-based battery causes an outward bulging, and wherein the plurality of battery layers are deposited on the first substrate surface such that the outward bulging is directed away from the silicon substrate.

3. The device of claim 2 , wherein the lithium-based battery further includes at least an anode layer, and wherein the expansion during charging is caused at least in part by production of lithium between the anode layer and the electrolyte layer during charging.

4. The device of claim 1 , further comprising:
an additional substrate having one or more conductive traces coupled via a conductive adhesive to the plurality of layers associated with the one or more electronic components of the integrated circuit.

5. The device of claim 4 , wherein the conductive adhesive includes an anisotropic conductive paste (ACP).

6. The device of claim 4 , wherein the additional substrate is associated with an eye-mountable contact lens.

7. The device of claim 1 , wherein the electrolyte layer is partially disposed between an anode layer and a cathode layer such that the cathode layer is in direct contact with the electrolyte layer, the first substrate surface, and the cathode current collector, whereas the anode layer is in direct contact with the anode current collector and the electrolyte layer without contacting the first substrate surface.

8. The device of claim 1 , wherein the integrated circuit comprises a complementary metal-oxide semiconductor (CMOS) chip.

9. A method comprising:
providing a silicon substrate having a first substrate surface and a second substrate surface opposite the first substrate surface;
depositing a plurality of layers associated with one or more electronic components of an integrated circuit on the second substrate surface;
depositing a plurality of battery layers of a lithium-based battery on the first substrate surface of the silicon substrate, wherein the lithium-based battery includes an anode current collector and a cathode current collector defined within the plurality of battery layers and contacting the first substrate surface, and wherein the plurality of battery layers includes an electrolyte layer in direct contact with the first substrate surface, the cathode current collector, and the anode current collector;
forming a first through-silicon via (TSV) in the silicon substrate to provide an electrical connection between the anode current collector and the plurality of layers associated with the one or more electronic components of the integrated circuit, wherein the first TSV comprises a first conductive channel insulated from the silicon substrate by a first insulating layer surrounding the first conductive channel; and
forming a second TSV in the silicon substrate to provide an electrical connection between the cathode current collector and the plurality of layers associated with the one or more electronic components of the integrated circuit, wherein the second TSV comprises a second conductive channel insulated from the silicon substrate by a second insulating layer surrounding the second conductive channel.

10. The method of claim 9 , wherein the lithium-based battery is a type that undergoes an expansion during charging in which the expansion of the lithium-based battery causes an outward bulging, and wherein depositing the plurality of battery layers on the first substrate surface is such that the outward bulging is directed away from the silicon substrate.

11. The method of claim 10 , wherein the lithium-based battery further includes at least an anode layer, and wherein the expansion during charging is caused at least in part by production of lithium between the anode layer and the electrolyte layer during charging.

12. The method of claim 9 , further comprising:
coupling the plurality of layers associated with the one or more electronic components of the integrated circuit to an additional substrate of a body-mountable device.

13. The method of claim 12 , wherein the additional substrate includes one or more conductive traces, and wherein the coupling includes coupling the one or more conductive traces to the plurality of layers via an anisotropic conductive paste (ACP).

14. The method of claim 9 , wherein the electrolyte layer is partially disposed between an anode layer and a cathode layer such that the cathode layer is in direct contact with the electrolyte layer, the first substrate surface, and the cathode current collector, whereas the anode layer is in direct contact with the anode current collector and the electrolyte layer without contacting the first substrate surface.

15. The method of claim 14 , wherein the anode current collector and the cathode current collector are in contact with a battery protective packaging layer, and wherein the battery protective packaging layer is further in contact with the first substrate surface, the electrolyte layer, and the anode layer without contacting the cathode layer.

16. A system comprising:
a silicon substrate having a first substrate surface and a second substrate surface opposite the first substrate surface;
one or more electronic components coupled to the second substrate surface;
a lithium-based battery having a plurality of battery layers deposited on the first substrate surface of the silicon substrate such that the silicon substrate is configured as a common substrate for the one or more electronic components and the lithium-based battery, wherein the lithium-based battery includes an anode current collector and a cathode current collector defined within the plurality of battery layers and contacting the first substrate surface, and wherein the plurality of battery layers includes an electrolyte layer in direct contact with the first substrate surface, the cathode current collector, and the anode

Assignees

• Verily Life Sciences Llc

Inventors

• Biederman William James
• Yeager Daniel James
• Otis Brian

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W70/698

  Semiconductor materials that are electrically insulating, e.g. undoped silicon · CPC title

• H10W70/695

  Organic materials · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title