Circuit configuration for radar applications

Patent metadata

Field	Value
Publication number	US-9726753-B2
Application number	US-201214117147-A
Country	US
Kind code	B2
Filing date	Mar 13, 2012
Priority date	May 10, 2011
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

A circuit configuration for radar applications having a printed board and semiconductor modules mounted on it, each of the semiconductor modules including an integrated circuit, a rewiring layer for connecting the integrated circuit to the printed board and at least one antenna element integrated into the semiconductor module and connected to the integrated circuit for transmitting and/or receiving radar signals, the integrated circuit including at least one HF oscillator and a frequency splitter connected to the HF oscillator, the circuit configuration including phase-locked loops for controlling the HF oscillators, each of the phase-locked loops having the frequency splitter and a phase detector for comparing a split-frequency signal of the HF oscillator with a reference signal, and the reference signals may be fed to the phase-locked loops via the printed board.

First claim

What is claimed:

1. A circuit configuration for a radar application, comprising:
a printed board;
semiconductor modules mounted on the printed board, each of the semiconductor modules including an integrated circuit, a rewiring layer for connecting the integrated circuit to the printed board and at least one antenna element integrated into the semiconductor module and connected to the integrated circuit for at least one of transmitting and receiving radar signals, and wherein integrated circuits of the semiconductor modules each include at least one HF oscillator and a frequency splitter connected to the HF oscillator; and
phase-locked loops for controlling the at least one HF oscillator, each of the phase-locked loops having the frequency splitter and a phase detector for comparing a split-frequency signal of the HF oscillator with a reference signal, wherein the reference signals are feedable to the phase-locked loops via the printed board, and wherein the phase detector is external to the semiconductor module,
wherein at least one integrated circuit of the semiconductor modules consists of exactly one HF oscillator and exactly one frequency splitter.

2. The circuit configuration of claim 1 , wherein the semiconductor modules each have a wafer unit and an interface layer, the wafer unit having a semiconductor chip, which forms the integrated circuit, and a housing layer, in which the semiconductor chip is embedded, and the interface layer having the rewiring layer which connects the integrated circuit to terminals of the interface layer connected to the printed board.

3. The circuit configuration of claim 2 , wherein the at least one antenna element is situated in the interface layer.

4. The circuit configuration of claim 1 , further comprising:
an oscillator situated on the printed board for generating a reference signal.

5. The circuit configuration of claim 4 , wherein the reference signal is a common reference signal for the phase-locked loops.

6. The circuit configuration of claim 1 , wherein multiple semiconductor modules are situated in a regular pattern in one row on the printed board.

7. The circuit configuration of claim 1 , wherein a beam forming device is situated in front of the semiconductor modules on a side of the semiconductor modules facing away from the printed board.

8. The circuit configuration of claim 1 , wherein the semiconductor modules are situated at regular intervals in rows and columns on the printed board.

9. A radar sensor, comprising:
a circuit configuration for a radar application, including:
a printed board;
semiconductor modules mounted on the printed board, each of the semiconductor modules including an integrated circuit, a rewiring layer for connecting the integrated circuit to the printed board and at least one antenna element integrated into the semiconductor module and connected to the integrated circuit for at least one of transmitting and receiving radar signals, and wherein integrated circuits of the semiconductor modules each include at least one HF oscillator and a frequency splitter connected to the HF oscillator; and
phase-locked loops for controlling the at least one HF oscillator, each of the phase-locked loops having the frequency splitter and a phase detector for comparing a split-frequency signal of the HF oscillator with a reference signal, wherein the reference signals are feedable to the phase-locked loops via the printed board, and wherein the phase detector is external to the semiconductor module,
wherein at least one integrated circuit of the semiconductor modules consists of exactly one HF oscillator and exactly one frequency splitter.

10. A motor vehicle radar system, comprising:
a circuit configuration for a radar application, including:
a printed board;
semiconductor modules mounted on the printed board, each of the semiconductor modules including an integrated circuit, a rewiring layer for connecting the integrated circuit to the printed board and at least one antenna element integrated into the semiconductor module and connected to the integrated circuit for at least one of transmitting and receiving radar signals, and wherein integrated circuits of the semiconductor modules each include at least one HF oscillator and a frequency splitter connected to the HF oscillator; and
phase-locked loops for controlling the at least one HF oscillator, each of the phase-locked loops having the frequency splitter and a phase detector for comparing a split-frequency signal of the HF oscillator with a reference signal, wherein the reference signals are feedable to the phase-locked loops via the printed board, and wherein the phase detector is external to the semiconductor module
wherein at least one integrated circuit of the semiconductor modules consists of exactly one HF oscillator and exactly one frequency splitter.

11. The circuit configuration of claim 1 , wherein at least one other integrated circuit of the semiconductor modules consists of exactly one other HF oscillator, exactly one other frequency splitter, and a mixer.

Assignees

• Binzer Thomas
• Brueggmann Oliver
• Waldschmidt Christian
• Steinbuch Dirk
• Bosch Gmbh Robert

Inventors

• Binzer Thomas
• Brueggmann Oliver
• Waldschmidt Christian
• Steinbuch Dirk

Classifications

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/241

  Dispositions, e.g. layouts · CPC title

• H10W44/248

  for antennas · CPC title

• H10W70/09

  extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs · CPC title