Measurement device for determining oven heating parameters

Patent metadata

Field	Value
Publication number	US-9726379-B2
Application number	US-201514709590-A
Country	US
Kind code	B2
Filing date	May 12, 2015
Priority date	May 12, 2015
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

A measurement device for determining heating parameters of an oven may generally include a support plate and at least one sensor cup coupled to the support plate. The sensor cup may define a liquid well for receiving a volume of liquid and may include a bottom wall defining a floor of the liquid well. In addition, the measurement device may include a temperature sensor positioned adjacent to the floor of the liquid well such that the temperature sensor is configured to be in fluid contact with at least a portion of the volume of the liquid received within the liquid well. The temperature sensor may be configured to monitor a temperature of the liquid as the liquid is heated and evaporates from the sensor cup.

First claim

What is claimed is:

1. A system for determining oven heating parameters, the system comprising:
an oven, the oven defining an oven floor;
a measurement device configured to be positioned within the oven, the measurement device comprising:
a support plate, the support plate defining a lower surface facing the oven floor and an upper surface opposite the lower surface;
an upper sensor cup coupled to the support plate, the upper sensor cup defining an upper liquid well for receiving a first volume of liquid, the upper sensor cup including a bottom wall defining a floor of the upper liquid well, the upper sensor cup being positioned relative to the support plate such that at least a portion of the bottom wall of the upper sensor cup is positioned above the upper surface of the support plate;
a lower sensor cup coupled to the support plate, the lower sensor cup defining a lower liquid well for receiving a second volume of liquid, the lower sensor cup including a bottom wall defining a floor of the lower liquid well, the lower sensor cup being positioned relative to the support plate such that at least a portion of the bottom wall of the lower sensor cup is positioned below the lower surface of the support plate;
a first temperature sensor positioned adjacent to the floor of the upper liquid well such that the first temperature sensor is configured to be in fluid contact with at least a portion of the first volume of liquid received within the upper liquid well, the first temperature sensor being configured to monitor a temperature of the liquid contained within the upper liquid well as the liquid is heated and evaporates from the upper sensor cup due to heat transferred from the oven; and
a second temperature sensor positioned adjacent to the floor of the lower liquid well such that the second temperature sensor is configured to be in fluid contact with at least a portion of the second volume of liquid received within the lower liquid well, the second temperature sensor being configured to monitor a temperature of the liquid contained within the lower liquid well as the liquid is heated and evaporates from the lower sensor cup due to heat transferred from the oven.

2. The system of claim 1 , wherein the bottom surface of the support plate is configured to be spaced apart from the oven floor.

3. The system of claim 1 , wherein the bottom wall of the lower sensor cup is configured to contact the oven floor such that the second volume of liquid is heated at least in part due to conduction from the oven floor.

4. The system of claim 1 , wherein the lower sensor cup is configured to be received within a cup opening defined in the support plate.

5. The system of claim 4 , wherein the lower sensor cup is slidably received within the cup opening such that a flange of the lower sensor cup is positioned above the upper surface of the support plate and a collar of the lower sensor cup is positioned below the lower surface of the support plate, wherein the lower sensor cup is configured to be moved relative to the support plate along a distance defined between the flange and the collar.

6. The system of claim 1 , wherein the lower liquid well is defined by both the bottom wall of the lower sensor cup and a sidewall of the lower sensor cup extending upwardly from the bottom wall to a top end of the lower liquid well, further comprising a cover plate at least partially covering the top end of the lower liquid well.

7. The system of claim 1 , wherein the upper liquid well is defined by both the bottom wall of the upper sensor cup and a sidewall of the upper sensor cup extending upwardly from the bottom wall to an top end of the upper liquid well, the top end of the upper liquid well being exposed at least one of radiation or convection from the oven.

8. The system of claim 1 , wherein the bottom wall of the upper sensor cup is tapered towards a location of the first temperature sensor such that the first volume of liquid received within the upper liquid well flows along the bottom wall in the direction of the first temperature sensor and wherein the bottom wall of the lower sensor cup is tapered towards a location of the second temperature sensor such that the second volume of liquid received within the lower liquid well flows along the bottom wall in the direction of the second temperature sensor.

9. The system of claim 1 , wherein the support plate is formed from an insulating material.

10. The system of claim 1 , further comprising a plurality of upper sensor cups and a plurality of lower sensor cups coupled to the support plate.

11. The system of claim 1 , wherein the oven comprises a brick oven.

12. A measurement device for determining heating parameters of an oven, the measurement device comprising:
a support plate;
at least one sensor cup coupled to the support plate, the at least one sensor cup defining a liquid well for receiving a volume of liquid, the at least one sensor cup including a bottom wall defining a floor of the liquid well; and
a temperature sensor positioned adjacent to the floor of the liquid well such that the temperature sensor is configured to be in fluid contact with at least a portion of the volume of the liquid received within the liquid well, the temperature sensor being configured to monitor a temperature of the liquid as the liquid is heated and evaporates from the at least one sensor cup.

13. The measurement device of claim 12 , wherein the support plate defines an upper surface and a lower surface and wherein the at least one sensor cup comprises an upper sensor cup and a lower sensor cup, the upper sensor cup defining an upper liquid well for receiving a first volume of liquid and including a bottom wall defining a floor of the upper liquid well, the upper sensor cup being positioned relative to the support plate such that at least a portion of the bottom wall of the upper sensor cup is positioned above the upper surface of the support plate, the lower sensor cup defining a lower liquid well for receiving a second volume of liquid, the lower sensor cup including a bottom wall defining a floor of the lower liquid well, the lower sensor cup being positioned relative to the support plate such that at least a portion of the bottom wall of the lower sensor cup is positioned below the lower surface of the support plate.

14. The measurement device of claim 13 , wherein the lower sensor cup is configured to be received within a cup opening defined in the support plate.

15. The measurement device of claim 14 , wherein the lower sensor cup is slidably received within the cup opening such that a flange of the lower sensor cup is positioned above the upper surface of the support plate and a collar of the lower sensor cup is positioned below the lower surface of the support plate, wherein the lower sensor cup is configured to be moved relative to the support plate along a distance defined between the flange and the collar.

16. The measurement device of claim 13 , wherein the lower liquid well is defined by both the bottom wall of the lower sensor cup and a sidewall of the lower sensor cup extending upwardly from the bottom wall to a top end of the lower liquid well, further comprising a cover plate at least partially covering the top end of the lower liquid well.

17. The measurement device of claim 13 , wherein the upper liquid well is defined by both the bottom wall of the upper sensor cup and a sidewall of the upper sensor cup extending upwardly from the bottom wall to an open top end of the upper liquid well.

18. The measurement device of claim 13 , wherein

Assignees

• Gen Electric
• Haier Us Appliance Solutions Inc

Inventors

• Wiseman Joshua Stephen
• Armstrong James Lee
• Froelicher Stephen Bernard

Classifications

• F24C7/085 Primary

  on baking ovens · CPC title