Methods for chemical mechanical polishing and forming interconnect structure
US-2024290629-A1 · Aug 29, 2024 · US
US9725620B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9725620-B2 |
| Application number | US-201314412366-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 7, 2013 |
| Priority date | Nov 7, 2012 |
| Publication date | Aug 8, 2017 |
| Grant date | Aug 8, 2017 |
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The present invention provides a cerium oxide based composite polishing powder and a preparation method thereof. The polishing powder contains the element magnesium in an amount of 0.005 wt %-5 wt % to magnesium oxide meter. The preparation method includes: (1) uniformly mixing a salt solution containing cerium serving as the main component of the polishing powder; (2) uniformly mixing a precipitating agent of an aqueous magnesium bicarbonate solution with the mixed solution prepared in step (1) to obtain a slurry; (3) aging the slurry prepared in step (2) for 0-48 h while the temperature of the slurry is kept at 30-90 degrees centigrade, and filtering the aged slurry to obtain the precursor powder of the polishing powder; (4) calcinating the precursor powder at 600-1000 degrees centigrade, then dispersing and separating the calcinated precursor powder to obtain the polishing powder. The present invention improves the polishing performance and the suspension performance of polishing powder.
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The invention claimed is: 1. A cerium oxide based composite polishing powder, wherein the cerium oxide based composite polishing powder comprises the element magnesium in an amount of 0.005-5 wt % to magnesium oxide meter, the cerium oxide based composite polishing powder further comprises 0.2-8 wt % of the element of fluorine or further comprises 0.1-5 wt % of the element of phosphorus. 2. The cerium oxide based composite polishing powder according to claim 1 , wherein the content of the element of magnesium is 0.01-2 wt % to magnesium oxide meter. 3. The cerium oxide based composite polishing powder according to claim 1 , wherein further comprises: at least one of the other rare earth elements different from cerium. 4. The cerium oxide based composite polishing powder according to claim 1 , wherein the content of cerium oxide is 40-99.99 wt %. 5. The cerium oxide based composite polishing powder according to claim 1 , wherein the median particle diameter D 50 of the cerium oxide based composite polishing powder is 0.02-5 μm. 6. The cerium oxide based composite polishing powder according to claim 1 , wherein the median particle diameter D 50 of the cerium oxide based composite polishing powder is 0.5-3 μm.
containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)} · CPC title
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