Composition of heat-expandable microspheres and use thereof
US-2024191049-A1 · Jun 13, 2024 · US
Microencapsulated curing agent
US9725575B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9725575-B2 |
| Application number | US-201414213239-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 14, 2014 |
| Priority date | Mar 31, 2011 |
| Publication date | Aug 8, 2017 |
| Grant date | Aug 8, 2017 |
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Abstract
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A microencapsulated curing agent for use in curing a thermosetting resin is provided. The microencapsulated curing agent includes an organic peroxide curing agent and a polyurethane resin encapsulating the organic peroxide curing agent. The microencapsulated curing agent, when heated to 100° C. for 30 minutes, exhibits a loss of weight of no greater than 10 wt. %. Additionally, when heated to 140° C. for 5 minutes, the microencapsulated curing agent exhibits a loss of weight of at least 4 wt. %.
First claim
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What is claimed is: 1. A microencapsulated curing agent for use in curing a thermosetting resin, the microencapsulated curing agent consisting essentially of: from 15.0 to 70.0 wt. % of an organic peroxide, based on the total microencapsulated curing agent as a whole, and a polyurethane resin encapsulating the organic peroxide, wherein the microencapsulated curing agent is formed by interfacial polymerization between the organic peroxide, xylyene diisocyanate, and a polyethylene glycol having molecular weight of 200 to 20,000, wherein the microencapsulated curing agent, when heated to 100° C. for 30 minutes, exhibits a loss of weight of no greater than 10.0 wt. %, wherein the microencapsulated curing agent when heated to 140° C. for 5 minutes, exhibits a loss of weight of at least 4.0 wt. %, and wherein the microencapsulated curing agent, when heated to 140° C. for 30 seconds, exhibits a loss of weight of no greater than 5.0 wt. %. 2. The microencapsulated curing agent of claim 1 , wherein the microencapsulated curing agent, when heated to 100° C. for 30 minutes, exhibits a loss of weight of no greater than 10.0 wt. %, and further wherein the microencapsulated curing agent, when heated to 140° C. for 5 minutes, exhibits a loss of weight of at least 18.0 wt. %. 3. The microencapsulated curing agent of claim 2 , wherein the microencapsulated curing agent contains at least from 30.0 wt. % to 41.0 wt. % of the organic peroxide, based on the weight of the microencapsulated curing agent as a whole. 4. The microencapsulated curing agent of claim 1 , wherein the microencapsulated curing agent has a chemical stability such that, when soaked in styrene monomer for 48 hours at 23° C., the microencapsulated curing agent exhibit a decrease in the amount of the organic peroxide curing agent contained therein of no more than 15.0 wt. %. 5. The microencapsulated curing agent of claim 1 , wherein the microencapsulated curing agent, when heated to 100° C. for 30 minutes, exhibits a loss of weight of no greater than 5.0 wt. %, and further wherein the microencapsulated curing agent, when heated to 140° C. for 5 minutes, exhibits a loss of weight of at least 4.0 wt. %. 6. The microencapsulated curing agent of claim 5 , wherein the microencapsulated curing agent contains from 30.0 to 70.0 wt. % of the organic peroxide, based on the weight of the microencapsulated curing agent as a whole. 7. A microencapsulated curing agent for use in curing a thermosetting resin, the microencapsulated curing agent comprising: from 15.0 to 70.0 wt. % of an organic peroxide, based on the total microencapsulated curing agent as a whole, and a polyurethane resin encapsulating the organic peroxide, wherein the polyurethane resin consists essentially of xylyene diisocyanate and a polyethylene glycol having molecular weight of from 200 to 20,000, wherein the microencapsulated curing agent, when heated to 100° C. for 30 minutes, exhibits a loss of weight of no greater than 10.0 wt. %, and wherein the microencapsulated curing agent, when heated to 140° C. for 5 minutes, exhibits a loss of weight of at least 4.0 wt. %. 8. The microencapsulated curing agent of claim 7 , wherein the microencapsulated curing agent, when soaked in styrene monomer for 48 hours, exhibits a loss of weight of no greater than 15.0 wt. %.
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- What does patent US9725575B2 cover?
- A microencapsulated curing agent for use in curing a thermosetting resin is provided. The microencapsulated curing agent includes an organic peroxide curing agent and a polyurethane resin encapsulating the organic peroxide curing agent. The microencapsulated curing agent, when heated to 100° C. for 30 minutes, exhibits a loss of weight of no greater than 10 wt. %. Additionally, when heated to 1…
- Who is the assignee on this patent?
- Ocv Intellectual Capital Llc
- What technology area does this patent fall under?
- Primary CPC classification C08K9/10. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Aug 08 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).