Micromechanical component having hermetic through-contacting, and method for producing a micromechanical component having a hermetic through-contacting

Patent metadata

Field	Value
Publication number	US-9725311-B2
Application number	US-201514614053-A
Country	US
Kind code	B2
Filing date	Feb 4, 2015
Priority date	Feb 17, 2014
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

A micromechanical component includes: a hermetically sealed housing; a first functional element that is situated inside the housing; a first structured electrically conductive layer that contacts the first functional element and that is situated inside the housing; and a second structured electrically conductive layer, the first conductive layer being electrically contacted via the second conductive layer, and the second conductive layer being electrically contacted laterally through the housing via a hermetic through-contacting in the second conductive layer.

First claim

What is claimed is:

1. A micromechanical component having a hermetic through-contacting, comprising:
a hermetically sealed housing;
a first functional element situated inside the housing;
a first structured electrically conductive layer situated inside the housing and contacting the first functional element;
a second structured electrically conductive layer, wherein the first conductive layer is electrically contacted via the second conductive layer, and wherein the second conductive layer is electrically contacted laterally through the housing via a hermetic through-contacting in the second conductive layer; and
a second functional element situated inside the housing and having a second current requirement which is less than a first current requirement of the first element, wherein the second functional element is electrically contacted via the second conductive layer
wherein:
the second conductive layer has an electrical connection to the substrate, the electrical connection taking place via a first well configured in the substrate, and wherein the first well has a polarity in the blocking direction relative to the substrate;
a first contact of the first component is contacted via a first segment of the hermetic through-contacting;
a second contact of the first component is contacted via a second segment of the hermetic through-contacting;
the first segment of the hermetic through-contacting is connected to the substrate via the first well fashioned in the substrate; and
the second segment of the hermetic through-contacting is connected to the substrate via a second well fashioned in the substrate.

2. The micromechanical component as recited in claim 1 , wherein the first and the second wells are applied to a common potential.

3. The micromechanical component as recited in claim 1 , wherein at least one of:
a metallization of the through-contacting is in tungsten;
a metallization of the through-contacting is situated over at least one of salicidated silicon and a diffusion; and
a metallization of at least one of the first element and the first conductive layer is in copper.

4. The micromechanical component as recited in claim 1 ,
wherein the hermetic through-contacting includes a multiplicity of printed conductors connected in parallel, and wherein each one of the multiplicity of printed conductors is separated from adjacent conductors by the housing.

5. The micromechanical component as recited in claim 4 , wherein the housing has a substrate on which a bonding frame is attached, and wherein the second conductive layer is situated between the first conductive layer and the substrate.

6. The micromechanical component as recited in claim 5 , wherein the second conductive layer is electrically insulated from the substrate.

Assignees

• Bosch Gmbh Robert

Inventors

• Franz Jochen
• Armbruster Simon
• Grutzeck Helmut
• Muchow Joerg
• Njimonzie Frederic Njikam
• Duell Andreas
• Baader Johannes
• Liebing Stefan
• Straub Rainer

Classifications

• B81B7/007 Primary

  Interconnections between the MEMS and external electrical signals · CPC title

• B81B7/0035

  for maintaining a controlled atmosphere inside of the chamber containing the MEMS · CPC title

• B81C2203/0109

  Bonding an individual cap on the substrate · CPC title

• B81C1/00277 Primary

  for maintaining a controlled atmosphere inside of the cavity containing the MEMS · CPC title

• B81B2207/097

  Interconnects arranged on the substrate or the lid, and covered by the package seal · CPC title