Customizable shrink wrap

Patent metadata

Field	Value
Publication number	US-9725198-B2
Application number	US-201414465585-A
Country	US
Kind code	B2
Filing date	Aug 21, 2014
Priority date	Jan 31, 2014
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

Shrink wrap films that are customized to have a shape matching a shape of a particular part or parts are disclosed. The shrink wrap films can be formed using unique manufacturing techniques that involve heating the part or parts prior to applying the shrink wrap film. The resultant part or parts will have substantially wrinkle-free and defect-free shrink wrap film applied thereon. In some embodiments, additional functional and cosmetic features are formed in the shrink wrap film. In some embodiments, a laser cutting procedure is used to form the features in the shrink wrap film. Methods can be used to provide visually and tactilely smooth and aesthetically appealing shrink wrapped consumer products.

First claim

What is claimed is:

1. A method of shrink wrapping a part, the method comprising:
heating an external surface of the part, the external surface having a shape;
positioning a shrink wrap film while in an elongate state around the heated external surface; and
shrinking the shrink wrap film over the external surface of the part, wherein during the shrinking the shrink wrap film contacts the heated external surface of the part causing the shrink wrap film to take on a contracted state having a shape that matches the shape of the external surface.

2. The method of claim 1 , wherein shrinking the shrink wrap comprises heating the shrink wrap using an external heat source.

3. The method of claim 2 , wherein the heat source is heated air produced by one or more of an oven and hot air gun.

4. The method of claim 1 , wherein heating the external surface of the part includes processing the part in an oven.

5. The method of claim 1 , wherein the part is an electronic device, wherein heating the external surface of the part includes heating a housing of the electronic device.

6. The method of claim 1 , wherein the external surface of the part includes a metallic surface.

7. The method of claim 6 , wherein the metallic surface is anodized or painted.

8. The method of claim 1 , wherein the external surface of the part includes a curved surface, wherein the shrink wrap film uniformly conforms to the curved surface.

9. A method of shrink wrapping a part, the method comprising:
heating an external surface of the part;
positioning a shrink wrap film around the external surface of the part such that an inner surface of the shrink wrap is proximate the heated external surface of the part; and
heating an outer surface of the shrink wrap film such that the shrink wrap film shrinks and conforms to the external surface of the part, wherein during the shrinking the heated external surface of the part heats the inner surface of the shrink wrap causing uniform heating and shrinking of the shrink wrap film around the external surface of the part.

10. The method of claim 9 , wherein the part is an electronic device, wherein heating the external surface of the part includes heating a housing of the electronic device.

11. The method of claim 9 , wherein the external surface of the part is a metallic surface.

12. The method of claim 9 , wherein heating the outer surface of the shrink wrap film includes directing heat from a heat source to the outer surface of the shrink wrap film.

13. The method of claim 12 , wherein heat source is a heat tunnel.

14. The method of claim 9 , further comprising:
cutting features within the shrink wrap film using a laser, the features configured to assist subsequent removal of the shrink wrap film from the part.

15. A method of shrink wrapping an electronic device, the method comprising:
heating an external surface of the electronic device;
positioning a shrink wrap film around the heated external surface of the electronic device; and
shrinking the shrink wrap film by heating the shrink wrap film to a temperature sufficient for the shrink wrap film to conform to the external surface of the electronic device, wherein heating the external surface causes the shrink wrap to uniformly conform to the external surface of the electronic device.

16. The method of claim 15 , wherein the external surface of the electronic device corresponds to a housing of the electronic device.

17. The method of claim 16 , wherein the housing is heated to a temperature high enough to heat the inner surface of the shrink wrap and low enough not to substantially damage internal components of the electronic device.

18. The method of claim 15 , wherein heating the external surface of the electronic device includes heating the external surface to at least a predetermined temperature.

19. The method of claim 15 , wherein the shrink wrap film uniformly conforms to the external surface of the electronic device without forming visible wrinkles in the shrink wrap film.

20. The method of claim 15 , wherein the external surface includes a curved bottom surface, the method further comprising:
prior to heating the external surface, placing the electronic device on a support structure that supports the electronic device while exposing the curved bottom surface during the heating.

Assignees

• Apple Inc

Inventors

• Whang Eugene A
• Newburn Paul E
• Doutt Mark E
• Dionello Rafael L
• Pu Hsien Y
• Korinek Michael A
• Cernokus Evan A
• Long Michael S

Classifications

• B65D75/002

  in shrink films (B65D71/08 takes precedence) · CPC title

• B65B63/08

  for heating or cooling articles or materials to facilitate packaging · CPC title

• B65D75/5844

  the portion of the wall being a narrow strip, e.g. between lines of weakness (B65D75/5838 takes precedence) · CPC title

• B65B53/063 Primary

  Tunnels · CPC title

• B65B61/18

  for making package-opening or unpacking elements · CPC title