Preforms made directly from thermosetting composite chips

Patent metadata

Field	Value
Publication number	US-9724854-B2
Application number	US-201514711087-A
Country	US
Kind code	B2
Filing date	May 13, 2015
Priority date	May 13, 2015
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

Preforms for use in molding composite parts are made directly from composite chips that are composed of fibers and an uncured thermosetting resin. Cold composite chips are formed into a stream of non-agglomerating chips that is used to fill the cavity of a preform tool. The non-agglomerating chips flow into the preform tool cavity to form a population of non-cohesive composite chips. The non-cohesive composite chips are then heated to form a preform made up of a consolidated population of cohesive composite chips in which the non-sticky uncured thermosetting resin of the non-cohesive chips has been converted to a sticky uncured thermosetting resin.

First claim

What is claimed is:

1. A method for making a preform comprising a consolidated population of cohesive composite chips wherein said preform comprises an exterior surface which forms the surface of a composite part upon molding of said preform, said method comprising the steps of:
providing non-agglomerating, composite chips, said non-agglomerating composite chips each comprising fibers and an uncured thermosetting resin wherein the non-agglomerating composite chips are at a temperature such that the tackiness of said uncured thermosetting resin is sufficiently low to prevent agglomeration of said non-agglomerating composite chips;
forming a stream comprising said non-agglomerating composite chips;
providing a preform tool which comprises walls that form a cavity for receiving said stream of non-agglomerating composite chips, wherein at least one of said walls defines said exterior surface of the preform;
directing said stream of non-agglomerating, composite chips to said preform tool order to fill said cavity with a population of non-cohesive composite chips;
increasing the temperature of said population of non-cohesive composite chips to form said preform comprising a consolidated population of cohesive composite chips wherein said cohesive composite chips each comprises said fibers and said uncured thermosetting resin wherein said cohesive composite chips are at a temperature such that the tackiness of said uncured thermosetting resin is sufficiently high to cause cohesion of said cohesive composite chips to form said preform; and
removing said preform from said preform tool.

2. A method for making a preform according to claim 1 wherein said fibers in said non-agglomerating composite chips are unidirectional.

3. A method for making a preform according to claim 1 wherein said non-agglomerating composite chips have a length of from 1 cm to 10 cm, a width of from 2 min to 2 cm and a. thickness of from 0.02 mm to 0.50 mm.

4. A method for making a preform according to claim 1 wherein said non-agglomerating composite chips are rectangular in shape.

5. A method for making a preform according to claim 1 wherein said uncured thermosetting resin comprises an epoxy resin.

6. A method for making a preform according to claim 5 wherein said non-agglomerating composite chips are at a temperature of between 0° C. and 25° C.

7. A method for making a preform according to claim 1 wherein said non-agglomerating composite chips are at a temperature of between 10° C. and 20° C.

8. A method for making a preform according to claim 1 wherein the preform tool is vibrated during filling of said cavity with said population of non-cohesive composite chips.

9. A method for making a preform according to claim 1 wherein said population of non-cohesive composite chips is weighed during filling of said cavity.

10. A method for making a preform according to claim 9 wherein said preform tool is vibrated during filling of said cavity with said non-agglomerating composite chips.

11. A method for making a preform according to claim 1 wherein a vacuum is applied to the cavity in said preform tool during filling of said cavity with said non-agglomerating composite chips to form said population of non-cohesive chips.

12. A method for making a preform according to claim 8 wherein a vacuum is applied to the cavity in said preform tool during, filling of said cavity with said non-agglomerating composite chips to form said population of non-cohesive chips.

13. A method for making a preform according to claim 1 wherein a vacuum is applied to the cavity in said preform tool during the step of forming said preform.

14. A method for making a preform according to claim 8 wherein a vacuum is applied to the cavity in said preform tool during the step of forming said preform.

15. A method for making a preform according to claim 1 wherein the exterior surface of said preform is contoured so that that preform has a first portion that is thicker than a second portion of said preform.

16. A method for making a composite part comprising the steps of providing a preform made according to claim 1 and curing said uncured thermosetting resin to form said composite part.

Assignees

• Hexcel Corp
• Hexcel Composites Ltd

Inventors

• Boursier Bruno

Classifications

• B29B11/16 Primary

  comprising fillers or reinforcement {(non-woven fabrics per se D04H1/00, D04H3/00)} · CPC title

• B29C43/02 Primary

  of articles of definite length, i.e. discrete articles {(B29C35/0227 takes precedence)} · CPC title